Apparatus to prevent damage to probe card
First Claim
1. A semiconductor die testing system comprising:
- a probe card including;
a substrate having a first surface and a second surface;
a plurality of conductive traces disposed adjacent at least one of the first surface and the second surface;
a plurality of probe elements in electrical communication with the plurality of conductive traces; and
a plurality of fuses disposed adjacent at least one of the first surface and the second surface, the plurality of fuses in electrical communication with the plurality of conductive traces; and
semiconductor device testing apparatus linkable with the probe card, the semiconductor testing apparatus configured for sending test signals through the probe card.
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0 Petitions
Accused Products
Abstract
Probe cards configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. In embodiments of the invention, protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. In this regard, methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card of the present invention is also provided.
36 Citations
12 Claims
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1. A semiconductor die testing system comprising:
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a probe card including;
a substrate having a first surface and a second surface;
a plurality of conductive traces disposed adjacent at least one of the first surface and the second surface;
a plurality of probe elements in electrical communication with the plurality of conductive traces; and
a plurality of fuses disposed adjacent at least one of the first surface and the second surface, the plurality of fuses in electrical communication with the plurality of conductive traces; and
semiconductor device testing apparatus linkable with the probe card, the semiconductor testing apparatus configured for sending test signals through the probe card. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A testing system comprising:
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a probe card including;
a substrate having a first surface and a second surface;
a plurality of conductive traces disposed adjacent at least one of the first surface and the second surface;
a plurality of probe elements in electrical communication with the plurality of conductive traces; and
a plurality of fuses disposed adjacent at least one of the first surface and the second surface, the plurality of fuses in electrical communication with the plurality of conductive traces; and
semiconductor device testing apparatus linkable with the probe card, the semiconductor testing apparatus configured for sending test signals through the probe card. - View Dependent Claims (8, 9, 10, 11, 12)
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Specification