Stage apparatus, scanning type exposure apparatus, and device produced with the same

• US 20030128348A1
• Filed: 01/22/2003
• Published: 07/10/2003
• Est. Priority Date: 09/19/1997
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Nishi, Kenji
• Granted Patent: US 6,906,782 B2
• Time in Patent Office: Days
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70358 Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: G03F 7/70708 being electrostatic; Electrostatically deformable vacuum chucks
• CPC Class Codes: G03F 7/70716 Stages
• CPC Class Codes: G03F 7/70725 control
• CPC Class Codes: G03F 7/70766 Reaction force control means, e.g. countermass
• CPC Class Codes: G03F 7/70775 Position control, e.g. interferometers or encoders for determining the stage position
• CPC Class Codes: H01L 21/681 using optical controlling means

Abstract

An exposure apparatus has a triangular shaped stage which is movable in a two-dimensional plane while holding a substrate. The stage has a reflecting surface provided on a side face of the stage so that the surface extends in a specific direction intersecting Y axis and X axis. An interferometer radiates a beam onto the reflecting surface to measure a position of the stage in a direction perpendicular to the specific direction. Using the measured position and an angle of the specific direction, a calculator can calculate the position of the stage on rectangular coordinate system defined by X and Y axes. The size and weight of the stage can be reduced, and the throughput of the exposure apparatus is improved.

Claims

1. A scanning type exposure apparatus for transferring a pattern on a mask to a substrate via a projection optical system by synchronously moving the mask and the substrate, the scanning type exposure apparatus comprising:

a mask stage arranged on a side of an object plane of the projection optical system;

a substrate stage arranged on a side of an image plane of the projection optical system;

a plurality of corner cubes provided on the mask stage and arranged in a second direction perpendicular to a first direction in which the mask is synchronously moved; and

a first interferometer which radiates a measuring beam to the mask stage in the first direction, and receives the measuring beam reflected by one of the plurality of corner cubes selected depending on a position of the mask stage in the second direction.

2. The scanning type exposure apparatus according to claim 1, further comprising:

a driving control system which reciprocates the mask stage in the first direction at least once and moves the mask stage in the second direction during the reciprocating movement in order to transfer the pattern on the mask to the substrate, wherein;

two of the plurality of corner cubes are arranged and separated from each other by a distance corresponding to an amount of movement of the mask stage in the second direction.

3. The scanning type exposure apparatus according to claim 1, wherein:

a predetermined fiducial mark is arranged on the substrate stage; and

the apparatus further comprises a measuring unit which measures a positional relationship between the mask and the substrate stage with the fiducial mark in order to reset the first interferometer depending on the position of the mask stage in the second direction.

4. The scanning type exposure apparatus according to claim 1, further comprising:

a first pedestal which supports the projection optical system;

a second pedestal which arranges the mask stage thereon;

a vibration-preventive apparatus which supports the first pedestal; and

a frame which is provided on a floor to arrange the vibration-preventive apparatus thereon, and the frame having an actuator which applies a force corresponding to a reaction force generated by movement of the mask stage, to the mask stage or the second pedestal.

5. The scanning type exposure apparatus according to claim 1, wherein an extension line of the measuring beam of the first interferometer intersects an optical axis of the projection optical system.

6. A scanning type exposure apparatus for transferring a pattern formed on a mask to a substrate via a projection optical system, while relatively moving the mask and the substrate in a predetermined first direction in synchronization with each other, the scanning type exposure apparatus comprising:

a mask stage which is two-dimensionally movable while holding the mask;

a substrate stage which is movable in the first direction while holding the substrate;

a first reflecting surface provided on the mask stage and extending in the first direction;

a plurality of corner cubes provided on the mask stage and arranged at predetermined spacing distances in a second direction perpendicular to the first direction;

a first interferometer which measures a position of the mask stage in the first direction by radiating a measuring beam in the first direction onto one of the plurality of corner cubes depending on a position of the mask stage in the second direction, and receiving a reflected light beam therefrom; and

a second interferometer which measures a position of the mask stage in the second direction by radiating a measuring beam in the second direction onto the first reflecting surface, and receiving a reflected light beam therefrom.

7. The scanning type exposure apparatus according to claim 6, wherein the plurality of corner cubes are provided corresponding to a plurality of areas arranged on the mask in the second direction respectively.

8. The scanning type exposure apparatus according to claim 7, wherein the plurality of corner cubes further include a corner cube arranged at a central portion of the mask in the second direction.

9. The scanning type exposure apparatus according to claim 6, further comprising a reset unit which resets the first interferometer in accordance with position information in the second direction of the mask stage.

10. The scanning type exposure apparatus according to claim 6, wherein:

the apparatus further comprises a third interferometer which radiates a measuring beam in the second direction onto the mask stage from a side opposite to the second interferometer;

the mask stage further has a second reflecting surface parallel to the first reflecting surface onto which the measuring beam from the third interferometer is radiated; and

the apparatus further comprises a calculating unit which calculates the position of the mask stage in the second direction on the basis of at least one of measured values of the second and third interferometers.

11. The scanning type exposure apparatus according to claim 10, wherein the calculating unit determines the position of the mask stage in the second direction on the basis of one of or both of the measured values of the second and third interferometets in accordance with information on an area on the mask located opposingly to a projection field of the projection optical system, the information being one of position information on the mask stage in the second direction.

12. The scanning type exposure apparatus according to claim 6, wherein:

a predetermined fiducial mark is arranged on the substrate stage; and

the apparatus further comprises a measuring unit which measures a positional relationship between the mask and the substrate stage with the fiducial mark in order to reset the first interferometer depending on the position of the mask stage in the second direction.

13. The scanning type exposure apparatus according to claim 10, wherein:

a predetermined fiducial mark is arranged on the substrate stage; and

the apparatus further comprises a measuring unit which measures a positional relationship between the mask and the substrate stage with the fiducial mark in order to reset the first interferometer depending on the position of the mask stage in the second direction.

14. The scanning type exposure apparatus according to claim 6, further comprising:

a first pedestal which supports the projection optical system;

a second pedestal which arranges the mask stage thereon;

a vibration-preventive apparatus which supports the first pedestal; and

a frame provided on a floor on which the vibration-preventive apparatus is arranged, and the frame having an actuator which applies a force corresponding to a reaction force generated by movement of the mask stage, to the mask stage or the second pedestal.

15. The scanning type exposure apparatus according to claim 10, further comprising:

a first pedestal which supports the projection optical system;

a second pedestal which arranges the mask stage thereon;

a vibration-preventive apparatus which supports the first pedestal; and

a frame provided on a floor on which the vibration-preventive apparatus is arranged, and the frame having an actuator which applies a force corresponding to a reaction force generated by movement of the mask stage, to the mask stage or the second pedestal.

16. The scanning type exposure apparatus according to claim 6, wherein an extension line of the measuring beam of the first interferometer intersects an optical axis of the projection optical system.

17. The scanning type exposure apparatus according to claim 10, wherein an extension line of the measuring beam of the first interferometer intersects an optical axis of the projection optical system.

18. The scanning type exposure apparatus according to claim 12, wherein an extension line of the measuring beam of the first interferometer intersects an optical axis of the projection optical system.

19. The scanning type exposure apparatus according to claim 16, wherein the second interferometer radiates two measuring beams onto the first reflecting surface in the second direction, and an extension line of one of the two measuring beams intersects an optical axis of the projection optical system.

20. The scanning type exposure apparatus according to claim 6, wherein the first reflecting surface is formed on a side surface of the mask stage.

21. The scanning type exposure apparatus according to claim 10, wherein the first reflecting surface is formed on a side surface of the mask stage.

22. The scanning type exposure apparatus according to claim 12, wherein the first reflecting surface is formed on a side surface of the mask stage.

23. A scanning exposure method for transferring a pattern formed on a mask to a substrate, while relatively moving a mask stage which holds the mask and a substrate stage which holds the substrate in a predetermined first direction in synchronization with each other, the method comprising:

a first scanning exposure step of transferring a pattern in a first area on the mask to a predetermined area on the substrate, while radiating a measuring beam onto a first reflecting surface provided on the mask stage to extend in the first direction and receiving a reflected light beam therefrom to manage a position of the mask stage in a second direction, and radiating a measuring beam onto a first corner cube provided on the mask stage and receiving a reflected light beam therefrom to manage a position of the mask stage in the first direction; and

a second scanning exposure step of transferring a pattern in a second area adjoining the first area in the second direction on the mask to the predetermined area on the substrate, while radiating the measuring beam onto the first reflecting surface and receiving a reflected light beam therefrom to manage the position of the mask stage in the second direction, and radiating the measuring beam onto a second corner cube different from the first corner cube provided on the mask stage and receiving a reflected light beam therefrom to manage the position of the mask stage in the first direction.

24. The scanning exposure method according to claim 23, wherein the pattern in the first area and the pattern in the second area are subjected to overlay exposure on the substrate to form a predetermined circuit pattern.

25. The scanning exposure method according to claim 23, wherein the first corner cube is provided at a mask stage position corresponding to the pattern in the first area, and the second corner cube is provided at a mask stage position corresponding to the pattern in the second area.

155. A microdevice produced by using the exposure method as defined in claim 23.

26. A method for producing a scanning type exposure apparatus which transfers a pattern on a mask to a substrate via a projection optical system by synchronously moving the mask and the substrate, the method comprising:

providing the projection optical system;

providing a mask stage arranged on a side of an object plane of the projection optical system;

providing a substrate stage arranged on a side of an image plane of the projection optical system;

providing a plurality of corner cubes on the mask stage to be arranged in a second direction perpendicular to a first direction in which the mask is synchronously moved; and

providing a first interferometer which radiates a measuring beam to the mask stage in the first direction, and receives the measuring beam reflected by one of the plurality of corner cubes selected depending on a position of the mask stage in the second direction.

27. The method according to claim 26, further comprising providing a driving control system which reciprocates the mask stage in the first direction at least once and moving the mask stage in the second direction during the reciprocating movement in order to transfer the pattern on the mask to the substrate, wherein two of the plurality of corner cubes are arranged and separated from each other by a distance corresponding to an amount of movement of the mask stage in the second direction.

28. A method for producing a scanning type exposure apparatus which transfers a pattern formed on a mask to a substrate via a projection optical system, while relatively moving the mask and the substrate in a first direction in synchronization with each other, the method comprising:

providing the projection optical system;

providing a mask stage which is two-dimensionally movable while holding the mask;

providing a substrate stage which is movable in the first direction while holding the substrate;

providing a first reflecting surface on the mask stage to extend in the first direction;

providing a plurality of corner cubes on the mask stage to be arranged at predetermined spacing distances in a second direction perpendicular to the first direction;

providing a first interferometer which measures a position of the mask stage in the first direction by radiating a measuring beam in the first direction onto one of the plurality of corner cubes depending on a position of the mask stage in the second direction, and receiving a reflected light beam therefrom; and

providing a second interferometer which measures a position of the mask stage in the second direction by radiating a measuring beam in the second direction onto the first reflecting surface, and receiving a reflected light beam therefrom.

29. The method according to claim 28, wherein the plurality of corner cubes are provided corresponding to a plurality of areas arranged on the mask in the second direction respectively.

30. The method according to claim 28, further comprising:

providing a third interferometer which radiates a measuring beam in the second direction onto the mask stage from a side opposite to the second interferometer;

providing, on the mask stage, a second reflecting surface parallel to the first reflecting surface onto which the measuring beam from the third interferometer is radiated; and

providing a calculating unit which calculates the position of the mask stage in the second direction on the basis of at least one of measured values of the second and third interferometers.

31. A scanning exposure method for transferring a pattern on a mask onto a substrate by reciprocatively moving the mask in a first direction to irradiate, with an illumination light beam, first and second areas respectively arranged in a second direction perpendicular to the first direction on the mask, and moving the substrate in synchronization with the movement of the mask, the method comprising:

driving a mask stage in the first direction on the basis of an output of an interferometer which radiates a measuring beam to a first mirror provided on the mask stage which holds the mask in order to irradiate the first area on the mask with the illumination light beam; and

driving the mask stage in the first direction while radiating the measuring beam of the interferometer onto a second mirror which is different from the first mirror provided on the mask stage in order to irradiate the second area on the mask with the illumination light beam.

32. The scanning exposure method according to claim 31, wherein the second area on the mask is overlay-transferred to a comparted area on the substrate to which the first area on the mask is transferred to form a combined pattern of a first pattern in the first area and a second pattern in the second area in the comparted area.

33. The scanning exposure method according to claim 31, wherein in order to successively transfer the pattern on the mask to a plurality of comparted areas on the substrate, the first area on the mask is successively transferred to the plurality of comparted areas, the mask is moved in the second direction, and then the second area on the mask is successively transferred to the plurality of comparted areas.

34. The scanning exposure method according to claim 33, wherein intensity distribution of the illumination light beam is changed before the second area on the mask is transferred to the plurality of comparted areas.

35. The scanning exposure method according to claim 31, wherein the mask stage is moved obliquely with respect to the first direction during deceleration of the mask stage after the first area on the mask is irradiated with the illumination light beam.

36. The scanning exposure method according to claim 31, wherein the mask stage is accelerated in a direction intersecting the first and second directions to allow the second area on the mask to approach the illumination light beam before the second area on the mask is irradiated with the illumination light beam.

37. The scanning exposure method according to claim 31, wherein the mask stage is driven without any stop between illumination of the illumination light beam onto the first area on the mask and illumination of the illumination light beam onto the second area on the mask.

38. The scanning exposure method according to claim 36, wherein the mask stage is driven without any stop between illumination of the illumination light beam onto the first area on the mask and illumination of the illumination light beam onto the second area on the mask.

39. The scanning exposure method according to claim 31, wherein a substrate stage which holds the substrate is driven without any stop between first scanning exposure for transferring the first area on the mask to a first comparted area on the substrate and second scanning exposure for transferring the second area on the mask to a second comparted area adjacent to the first comparted area on the substrate.

40. The scanning exposure method according to claim 36, wherein a substrate stage which holds the substrate is driven without any stop between first scanning exposure for transferring the first area on the mask to a first comparted area on the substrate and second scanning exposure for transferring the second area on the mask to a second comparted area adjacent to the first comparted area on the substrate.

41. The scanning exposure method according to claim 40, wherein the substrate stage is accelerated in a direction intersecting the first and second directions before the second scanning exposure.

42. The scanning exposure method according to claim 31, wherein the mask includes first and second masks arranged in the second direction, a first pattern in the first area is formed on the first mask, and a second pattern in the second area is formed on the second mask.

43. The scanning exposure method according to claim 35, wherein the mask includes first and second masks arranged in the second direction, a first pattern in the first area is formed on the first mask, and a second pattern in the second area is formed on the second mask.

44. The scanning exposure method according to claim 40, wherein the mask includes first and second masks arranged in the second direction, a first pattern in the first area is formed on the first mask, and a second pattern in the second area is formed on the second mask.

45. The scanning exposure method according to claim 31, wherein each of the first and second mirrors is a corner cube.

156. A microdevice produced by using the exposure method as defined in claim 31.

46. A scanning exposure method for transferring a pattern on a mask onto a substrate by reciprocatively moving the mask in a first direction to irradiate, with an illumination light beam, first and second areas respectively arranged in a second direction perpendicular to the first direction on the mask, and moving the substrate in synchronization with the movement of the mask, wherein:

the mask is moved without any stop between illumination of the illumination light beam onto the first area on the mask and illumination of the illumination light beam onto the second area on the mask.

157. A microdevice produced by using the exposure method as defined in claim 46.

47. A scanning exposure method for transferring a circuit pattern onto a substrate, comprising:

a first step of moving a mask having first and second divided patterns of the circuit pattern in a first direction to irradiate the first divided pattern with an illumination light beam, and moving the substrate in synchronization with the movement of the mask to transfer the first divided pattern to a comparted area on the substrate; and

a second step of moving the mask in the first direction, i.e., in the direction opposite to that used in the first step to irradiate the second divided pattern with the illumination light beam, and moving the substrate in synchronization with the movement of the mask to transfer the second divided pattern to the comparted area.

48. The scanning exposure method according to claim 47, wherein the mask is moved between the first step and the second step so that at least one of a velocity component in the first direction and a velocity component in a second direction perpendicular thereto is not zero.

158. A microdevice produced by using the exposure method as defined in claim 47.

49. A stage apparatus comprising:

a first movable member which is movable in a two-dimensional plane while holding a substrate;

a first reflecting surface which is provided on the first movable member to extend in a direction intersecting a predetermined first axis and a second axis perpendicular thereto in the two-dimensional plane;

a first interferometer which measures a position of the first movable member in a third axis direction by perpendicularly radiating a measuring beam onto the first reflecting surface and receiving a reflected light beam therefrom; and

a calculating unit which calculates a position coordinate on a rectangular coordinate system defined by the first axis and the second axis of the first movable member, on the basis of a measured value obtained by the first interferometer.

50. The stage apparatus according to claim 49, further comprising:

a second reflecting surface which is provided on the first movable member to extend in the second axis direction; and

a second interferometer which measures a position of the first movable member in the first axis direction by perpendicularly radiating a measuring beam onto the second reflecting surface and receiving a reflected light beam therefrom, wherein;

the calculating unit calculates a position coordinate of the first movable member in the second axis direction on the basis of the measured value obtained by the first interferometer.

51. The stage apparatus according to claim 49, wherein the calculating unit calculates at least one of the position in the first axis direction and the position in the second axis direction of the first movable member on the basis of both of the measured value obtained by the first interferometer and the measured value obtained by the second interferometer.

52. The stage apparatus according to claim 49, further comprising:

a third reflecting surface which is provided on the first movable member, which intersects the first axis and the second axis perpendicular thereto in the two-dimensional plane, and which extends in a direction different from that of the first reflecting surface; and

a third interferometer which measures a position of the first movable member in a fourth axis direction by perpendicularly radiating a measuring beam onto the third reflecting surface and receiving a reflected light beam therefrom, wherein;

the calculating unit calculates a position of the first movable member in the second axis direction on a stage coordinate system defined by the first axis and the second axis on the basis of measured values obtained by the first and third interferometers.

53. The stage apparatus according to claim 49, wherein:

the first interferometer radiates the two measuring beams having respective measuring axes onto the first reflecting surface so as to be separated each other in a direction perpendicular to the two-dimensional plane, and receives respective reflected light beams therefrom, in order to measure the position of the first movable member in the third axis direction for each of measuring axes; and

the calculating unit also calculates inclination of the first movable member with respect to the two-dimensional plane on the basis of the measured value obtained by the first interferometer.

54. The stage apparatus according to claim 49, wherein:

the first interferometer radiates two measuring beam having respective measuring axes separated in a direction parallel to the two-dimensional plane onto the first reflecting surface, and receives respective reflected light beams therefrom in order to measure the position of the first movable member in the third axis direction for each of measuring axes; and

the calculating unit also calculates rotation of the first movable member in the two-dimensional plane on the basis of the measured value obtained by the first interferometer.

55. The stage apparatus according to claim 53, wherein:

the first interferometer radiates two measuring beam having respective measuring axes separated in a direction parallel to the two-dimensional plane onto the first reflecting surface, and receives respective reflected light beams therefrom, in order to measure the position of the first movable member in the third axis direction for each of the measuring axes; and

the calculating unit also calculates rotation of the first movable member in the two-dimensional plane on the basis of the measured value obtained by the first interferometer.

56. The stage apparatus according to claim 50, wherein:

the second interferometer radiates three measuring beams having respective measuring axes onto the second reflecting surface so that incoming points into the second reflecting surface are not arranged on an identical straight line on the second reflecting surface, and receiving respective reflected light beams therefrom, in order to measure the position of the first movable member in the first axis direction for the respective measuring axes; and

the calculating unit also calculates rotation of the first movable member in the two-dimensional plane and inclination of the first movable member with respect to the two-dimensional plane on the basis of the measured value obtained by the second interferometer.

57. The stage apparatus according to claim 49, wherein the first reflecting surface is formed on an end surface of the first movable member.

58. The stage apparatus according to claim 53, wherein the first reflecting surface is formed on an end surface of the first movable member.

59. The stage apparatus according to claim 56, wherein the first reflecting surface is formed on an end surface of the first movable member.

60. The stage apparatus according to claim 50, wherein the first movable member has a substantially triangular configuration, and the second reflecting surface is formed on an end surface of the first movable member.

61. The stage apparatus according to claim 56, wherein the first movable member has a substantially triangular configuration, and the second reflecting surface is formed on an end surface of the first movable member.

62. The stage apparatus according to claim 60, further comprising a driving unit which drives the first movable member in a direction perpendicular to the two-dimensional plane in response to an output of at least one of first, second, and third interferometers, provided in the vicinity of at least one corner of three corners of the substantially triangular first movable member.

63. The stage apparatus according to claim 61, further comprising a driving unit which drives the first movable member in a direction perpendicular to the two-dimensional plane in response to an output of at least one of first, second, and third interferometers, provided in the vicinity of at least one corner of three corners of the substantially triangular first movable member.

64. The stage apparatus according to claim 52, wherein:

each of the interferometers radiates three measuring beam having respective measuring axes onto the corresponding reflecting surface so that their incoming points are not arranged on an identical straight line on the reflecting surface, and receives reflected light beams therefrom, in order to measure a position of the first movable member in a direction of each of the measuring axes for each of the measuring axes; and

the calculating unit calculates rotation of the first movable member in the two-dimensional plane and inclination with respect to the two-dimensional plane using a measured value or measured values obtained by the measuring axis or the measuring axes of at least one of the first, second, and third interferometers.

65. The stage apparatus according to claim 64, wherein:

the first movable member includes a second plate movable in the two-dimensional plane, a leveling drive mechanism carried on the second plate, and a first plate which is supported by the leveling drive mechanism and holds the substrate;

the first, second, and third reflecting surfaces are provided on the first plate;

the leveling drive mechanism includes three actuators which support the first plate at different three points substantially on extension lines of the respective measuring axes of the first, second, and third interferometers, the actuators driving the first plate independently in a direction perpendicular to the two-dimensional plane at respective support points;

the calculating unit calculates inclination of the first, second, and third reflecting surfaces with respect to the two-dimensional plane using the measured values obtained by the first, second, and third interferometers respectively; and

the stage apparatus further comprises an actuator control unit which controls the three actuators in accordance with a calculation result obtained by the calculating unit.

66. The stage apparatus according to claim 49, further comprising:

a base board; and

a second movable member which arranges the first movable member thereon, the second movable member being arranged on the base board and movable relative to the base board and the first movable member respectively, wherein;

the second movable member is moved in response to a reaction force generated by movement of the first movable member.

67. The stage apparatus according to claim 53, further comprising:

a base board; and

a second movable member which arranges the first movable member thereon, the second-movable member being arranged on the base board and movable relative to the base board and the first movable member respectively, wherein;

the second movable member is moved in response to a reaction force generated by movement of the first movable member.

68. The stage apparatus according to claim 57, further comprising:

a base board; and

a second movable member which arranges the first movable member thereon, the second movable member being arranged on the base board and movable relative to the base board and the first movable member respectively, wherein;

the second movable member is moved in response to a reaction force generated by movement of the first movable member.

69. The stage apparatus according to claim 66, further comprising:

a driving system which drives the second movable member provided on the base board at a predetermined response frequency; and

a control unit which controls a position of the second movable member at a response frequency of not more than several Hz by the aid of the driving system.

70. The stage apparatus according to claim 67, further comprising:

a driving system which drives the second movable member provided on the base board at a predetermined response frequency; and

a control unit which controls a position of the second movable member at a response frequency of not more than several Hz by the aid of the driving system.

71. The stage apparatus according to claim 68, further comprising:

a driving system which drives the second movable member provided on the base board at a predetermined response frequency; and

a control unit which controls a position of the second movable member at a response frequency of not more than several Hz by the aid of the driving system.

104. An exposure apparatus comprising the stage apparatus as defined in claim 49, wherein a pattern on a mask is transferred to a photosensitive substrate held by the stage apparatus.

186. A lithography apparatus provided with the stage apparatus as defined in claim 49.

187. The lithography apparatus according to claim 186, further comprising an exposure system which exposes a photosensitive substrate held by the first movable member with an illumination beam.

188. The lithography apparatus according to claim 187, wherein the exposure system includes an illumination system which radiates the illumination beam onto a mask, and a production system which projects the illumination beam onto the photosensitive substrate.

189. The lithography apparatus according to claim 187, wherein the illumination beam is one selected from the group consisting of a far ultraviolet ray, a vacuum ultraviolet ray, an X-ray, and a charged particle beam.

72. A scanning type exposure apparatus for exposing a substrate by transferring a pattern formed on a mask onto the substrate, the apparatus comprising:

a stage apparatus including a substrate stage which is movable in a two-dimensional plane while holding the substrate, a first reflecting surface which is provided on the substrate stage to extend in a direction intersecting a predetermined first axis and a second axis perpendicular thereto in the two-dimensional plane, a first interferometer which measures a position of the substrate stage in a third axis direction by perpendicularly radiating a measuring beam onto the first reflecting surface and receiving a reflected light beam therefrom, and a calculating unit which calculates a position coordinate on a rectangular coordinate system defined by the first axis and the second axis of the substrate stage, on the basis of a measured value obtained by the first interferometer;

a mask stage which holds the mask; and

a stage control system which relatively moves the mask stage and the substrate stage in synchronization with each other in a direction of the first axis, wherein;

the pattern formed on the mask is transferred to the substrate on the substrate stage during the relative movement of the mask stage and the substrate stage effected by the stage control system.

73. The scanning type exposure apparatus according to claim 72, further comprising:

a second reflecting surface provided on the substrate stage and extending in the second axis direction; and

a second interferometer which measures a position of the substrate stage in the first axis direction by perpendicularly radiating a measuring beam onto the second reflecting surface and receiving a reflected light beam therefrom, wherein;

the calculating unit calculates a position coordinate of the substrate stage in the second axis direction on the basis of the measured value obtained by the first interferometer.

74. The scanning type exposure apparatus according to claim 73, further comprising:

a third reflecting surface which is provided on the substrate stage, which intersects the first axis and the second axis perpendicular thereto in the two-dimensional plane, and which extends in a direction different from that of the first reflecting surface; and

a third interferometer which measures a position of the substrate stage in a fourth axis direction by perpendicularly radiating a measuring beam onto the third reflecting surface and receiving a reflected light beam therefrom, wherein;

the calculating unit calculates a position of the substrate stage in the second axis direction on a stage coordinate system defined by the first axis and the second axis on the basis of measured values obtained by the first and third interferometers.

75. The scanning type exposure apparatus according to claim 74, wherein:

each of the first and third interferometers is an interferometer having-two-axes, the apparatus further comprises;

a projection optical system having an optical axis which is orthogonal to the mask and the substrate respectively; and

an alignment optical system provided separately from the projection optical system; and

the respective measuring axes of the first and third interferometers are set so that a point of intersection obtained by extending one of the measuring axes of each of the first and third interferometers is substantially coincident with a center of the projection optical system, and a point of intersection obtained by extending the respective remaining measuring axes is substantially coincident with a center of the alignment optical system.

76. The scanning type exposure apparatus according to claim 74, wherein rate of acceleration, maximum velocity, and settling time of the substrate stage during the exposure are determined so that any one of the measuring axes of the first, second, and third interferometers is not deviated from the corresponding reflecting surface of the first, second, and third reflecting surfaces during the scanning exposure for peripheral areas of the substrate.

77. The scanning type exposure apparatus according to claim 74, wherein a fiducial mark and a sensor which perform predetermined measurement in relation to exposure process with the measured values of the first, second, and third interferometers are arranged at predetermined positions on the substrate stage at which any one of the measuring axes of the first, second, and third interferometers is not deviated from the corresponding reflecting surface of the first, second, and third reflecting surfaces.

78. The scanning type exposure apparatus according to claim 74, wherein:

each of the interferometers radiates three measuring beam having respective measuring axes which are not arranged on an identical straight line on each of the reflecting surfaces onto the corresponding reflecting surface respectively, and receives reflected light beams therefrom, in order to measure a position of the substrate stage in a direction of each of measuring axes for each of the measuring axes; and

the calculating unit calculates rotation of the substrate stage in the two-dimensional plane and inclination with respect to the two-dimensional plane using a measured value or measured values obtained by the measuring axis or the measuring axes of at least one of the first, second, and third interferometers.

79. The scanning type exposure apparatus according to claim 74, wherein:

the substrate stage includes a second plate movable in the two-dimensional plane, a leveling drive mechanism carried on the second plate, and a first plate which is supported by the leveling drive mechanism and holds the substrate;

the first, second, and third reflecting surfaces are provided on the first plate;

the leveling drive mechanism includes three actuators which support the first plate at different three points substantially on extension lines of the respective measuring axes of the first, second, and third interferometers, the actuators driving the first plate independently in a direction perpendicular to the two-dimensional plane at respective support points;

the calculating unit calculates inclination of the first, secondhand third reflecting surfaces with respect to the two-dimensional plane using the measured values obtained by the first, second, and third interferometers respectively; and

the stage apparatus further comprises an actuator control unit which controls the three actuators in accordance with a calculation result obtained by the calculating unit.

80. The scanning type exposure apparatus according to claim 78, wherein:

the mask stage is rotatable in the two-dimensional plane;

the calculating unit calculates a rotation discrepancy amount of the substrate stage in the two-dimensional plane on the basis of the measured value obtained by the second interferometer; and

the stage control system controls rotation of the mask stage so that the rotation discrepancy amount is corrected.

81. The scanning type exposure apparatus according to claim 72, further comprising:

a base board;

a second movable member which arranges the substrate stage thereon, the second movable member being arranged on the base board and movable relative to each of the base board and the substrate stage;

a driving system which drives the second movable member provided on the base board at a predetermined response frequency; and

a control unit which controls a position of the second movable member at a response frequency of not more than several Hz by the aid of the driving system, wherein;

the second movable member is moved in response to a reaction force generated by movement of the substrate stage.

82. The scanning type exposure apparatus according to claim 81, wherein:

the substrate stage has a weight which is not more than {fraction (1/9)} of a weight of the second movable member; and

the control unit varies a response frequency of the second movable member before exposure or alignment and the other response frequencies.

83. The scanning type exposure apparatus according to claim 82, further comprising:

a position-measuring unit which monitors a two-dimensional position of the second movable member, wherein;

the control unit corrects the position of the second movable member to a predetermined position on the basis of a measurement result obtained by the position-measuring unit during movement of the substrate stage other than exposure and alignment.

84. The scanning type exposure apparatus according to claim 75, further comprising at least two apparatuses which supplies temperature-adjusted gas in order to adjust temperature of light flux paths of the first, second, and third interferometers.

85. The scanning type exposure apparatus according to claim 72, wherein the first reflecting surface is formed on an end surface of the substrate stage.

86. The scanning type exposure apparatus according to claim 85, wherein the substrate stage has at least three reflecting surfaces on its end surface, and one of the three reflecting surfaces is the first reflecting surface.

87. The scanning type exposure apparatus according to claim 85, wherein the stage control system determines not only throughput but also scanning velocities of the mask and the substrate on the basis of an extending length of the first reflecting surface.

88. The scanning type exposure apparatus according to claim 72, further comprising a plurality of corner cubes attached to the mask stage in a direction of movement of the mask and the substrate, and an interferometer system which radiates the light beam onto one of the plurality of corner cubes and receiving a reflected light beam therefrom.

89. A scanning type exposure apparatus for exposing a photosensitive substrate with a pattern by synchronously moving a mask formed with the pattern and the photosensitive substrate across an area onto which an energy beam is radiated, the apparatus comprising:

a mask stage which is movable while placing the mask thereon;

a substrate stage which is movable while placing the photosensitive substrate thereon, the substrate stage having, on a side wall, at least first, second, and third reflecting surfaces, and the first, second and third reflecting surfaces or extension lines thereof forming a triangle; and

an interferometer system which radiates measuring beams to the first, second, and third reflecting surfaces respectively.

90. The scanning type exposure apparatus according to claim 89, wherein the triangle is a regular triangle.

91. The scanning type exposure apparatus according to claim 89, wherein one reflecting surface of the first, second, and third reflecting surfaces extends in a direction along a scanning direction or a direction perpendicular thereto.

92. The scanning type exposure apparatus according to claim 89, wherein the mask stage is provided with a plurality of corner cubes which are disposed at a side portion of the stage.

93. The scanning type exposure apparatus according to claim 89, further comprising a base board and a movable base board supported thereover in a floating manner, wherein the substrate stage is supported over the movable base board in a floating manner so that the movable base board is moved in accordance with a reaction force generated when the substrate stage is moved in a scanning direction.

94. The scanning type exposure apparatus according to claim 93, wherein the substrate stage is composed of a plurality of triangular stages which hold the substrates respectively.

95. A stage apparatus comprising:

a base board;

a first movable member which is movable relative to the base board and holds a substrate;

a second movable member which arranges the first movable member thereon, the second movable member being arranged on the base board and being movable relative to the base board and the first movable member respectively; and

a driving unit which moves the first movable member in a two-dimensional plane, wherein;

the second movable member is moved in accordance with a reaction force generated by the movement of the first movable member.

96. The stage apparatus according to claim 95, wherein:

the driving unit includes a linear actuator which drives the first movable member on the second movable member; and

the first movable member and the second movable member are supported in a non-contact manner by the second movable member and the base board respectively.

97. The stage apparatus according to claim 95, wherein:

the first movable member has a first reflecting surface which extends in a direction intersecting first and second axes respectively orthogonal to one another in the two-dimensional plane, a second reflecting surface which extends in the second axis direction, and a third reflecting surface which is arranged substantially symmetrically to the first reflecting surface with respect to the first axis; and

the apparatus further comprises three interferometers which radiate measuring beams to the first, second, and third reflecting surfaces respectively.

98. The stage apparatus according to claim 95, wherein the first movable member includes:

a first plate which places the substrate thereon;

a driving mechanism which moves the first plate in a direction perpendicular to the two-dimensional plane, and inclines the first plate relative to the two-dimensional plane; and

a second plate which places the driving mechanism thereon.

99. The stage apparatus according to claim 95, wherein the first movable member is composed of a plurality of movable sections, the respective movable sections are arranged on the second movable member, the driving unit drives the respective movable sections in the two-dimensional plane, and the second movable member is moved in accordance with the reaction force brought about when the respective movable sections are driven.

100. The stage apparatus according to claim 98, wherein the first movable member is composed of a plurality of movable sections, the respective movable sections are arranged on the second movable member, the driving unit drives the respective movable sections in the two-dimensional plane, and the second movable member is moved in accordance with the reaction force brought about when the respective movable sections are driven.

101. The stage apparatus according to claim 95, wherein:

a mass of the first movable member is not more than about {fraction (1/9)} of a mass of the second movable member; and

the apparatus further comprises a second driving unit which drives the second movable member at a low response frequency on the base board.

102. The stage apparatus according to claim 98, wherein:

a mass of the first movable member is not more than about {fraction (1/9)} of a mass of the second movable member; and

the apparatus further comprises a second driving unit which drives the second movable member at a low response frequency on the base board.

103. The stage apparatus according to claim 99, wherein:

a mass of the first movable member is not more than about {fraction (1/9)} of a mass of the second movable member; and

the apparatus further comprises a second driving unit which drives the second-movable member at a low response frequency on the base board.

105. An exposure apparatus comprising the stage apparatus as defined in claim 95, wherein a pattern on a mask is transferred to a photosensitive substrate held by the first movable member.

106. The exposure apparatus according to claim 105, further comprising a second driving unit for driving the second movable member on the base board, and a control unit which varies control response of the second driving unit in a plurality of operations including an exposure operation for the photosensitive substrate.

107. The exposure apparatus according to claim 106, wherein the control unit moves the second movable member by the aid of the second driving unit after moving the first movable member, and a response frequency of the second driving unit is increased during the movement of the second movable member as compared with the movement of the first movable member.

108. A scanning type exposure apparatus comprising:

a stage apparatus including a base board;

a first movable member which is movable relative to the base board and holds a substrate;

a second movable member which arranges the first movable member thereon, the second movable member being arranged on the base board and being movable relative to the base board and the first movable member respectively; and

a driving unit which moves the first movable member in a two-dimensional plane;

wherein the second movable member is moved in accordance with a reaction force generated by the movement of the first movable member;

a mask stage which holds a mask;

a projection optical system having an optical axis perpendicular to the mask and the substrate respectively;

a first pedestal which supports the projection optical system and suspends the base board thereby; and

a vibration-preventive apparatus which supports the first pedestal, wherein;

a pattern on the mask is transferred onto the substrate via the projection optical system by synchronously moving the mask and the substrate by the aid of the mask stage and the stage apparatus.

109. The scanning type exposure apparatus according to claim 108, further comprising:

a second pedestal which places the mask stage thereon; and

a frame provided on a floor on which the vibration-preventive apparatus is arranged, and the frame having an actuator which applies a force corresponding to a reaction force generated by movement of the mask stage, to the mask stage or the second pedestal.

110. The scanning type exposure apparatus according to claim 109, further comprising:

a base plate which places the vibration-preventive apparatus thereon; and

an elastic member which connects the base plate and the frame.

111. The scanning type exposure apparatus according to claim 108, wherein:

the first movable member has a first reflecting surface which extends in a direction intersecting a scanning direction for the substrate and a non-scanning direction orthogonal thereto respectively on the two-dimensional plane, a second reflecting surface which extends in the non-scanning direction, and a third reflecting surface which is arranged substantially symmetrically to the first reflecting surface in relation to the scanning direction; and

the apparatus further comprises three sets of interferometers which radiate measuring beams to the first, second, and third reflecting surfaces respectively.

112. The scanning type exposure apparatus according to claim 108, further comprising:

a position-measuring unit which detects a relative position of the second movable member with respect to the base board; and

a second driving unit which positions the second movable member at a predetermined point on the base board on the basis of an output of the position-measuring unit during operation other than exposure operation for the substrate and alignment operation.

113. The scanning type exposure apparatus according to claim 108, wherein the first movable member is composed of a plurality of movable sections, the respective movable sections are arranged on the second movable member, the driving unit drives the respective movable sections in the two-dimensional plane, and the second movable member is moved in accordance with the reaction force brought about when the respective movable sections are driven.

114. The scanning type exposure apparatus according to claim 111, further comprising:

a position-measuring unit which detects a relative position of the second movable member to the base board; and

a second driving unit which positions the second movable member at a predetermined point on the base board on the basis of an output of the position-measuring unit during operation other than exposure operation for the substrate and alignment operation.

115. The scanning type exposure apparatus according to claim 108, wherein the first movable member is a substrate stage.

116. The scanning type exposure apparatus according to claim 108, further comprising a plurality of corner cubes attached to the mask stage in a direction intersecting a direction in which the mask is moved, and an interferometer system which radiates the light beam onto one of the plurality of corner cubes and receives a reflected light beam therefrom.

117. An exposure apparatus for transferring a pattern on a mask onto a substrate, comprising:

a base board;

at least two first movable members each of which is movable relative to the base board and holds the substrate respectively;

a second movable member which places the respective first movable members thereon, the second movable member being arranged on the base board and being movable relative to the base board and each of the first movable members respectively; and

a driving unit which drives the respective first movable members in a two-dimensional plane, wherein;

the second movable member is moved in accordance with a reaction force brought about when the respective first movable members are driven; and

the substrate, to which the pattern on the mask is transferred, is held by each of the first movable members.

118. The exposure apparatus according to claim 117, wherein:

a mass of each of the first movable members is about not more than {fraction (1/9)} of a mass of the second movable member; and

the apparatus further comprises a second driving unit which drives the second movable member at a low response frequency on the base board.

119. The exposure apparatus according to claim 118, further comprising:

a projection optical system which projects the pattern on the mask onto the substrate, wherein;

the driving unit drives the first movable member which holds the substrate to which the pattern is transferred, in a scanning direction with respect to the projection optical system in synchronization with the mask, when the pattern on the mask is transferred to the substrate held by each of the first movable members.

120. A scanning type exposure apparatus for transferring a pattern on a mask onto a substrate by synchronously moving the mask and the substrate, the apparatus comprising:

a substrate stage which places the substrate thereon, the substrate stage having a first reflecting surface extending in a direction intersecting a first direction in which the substrate is synchronously moved and a second direction perpendicular thereto respectively, and a second reflecting surface extending in the second direction; and

first and second interferometers which radiate measuring beams onto the first and second reflecting surfaces respectively.

121. The scanning type exposure apparatus according to claim 120, further comprising:

a projection optical system having an optical axis substantially perpendicular to the mask and the substrate respectively, wherein;

the first and second interferometers are arranged such that their measuring axes make intersection at the optical axis of the projection optical system respectively.

122. The scanning type exposure apparatus according to claim 121, further comprising:

an off-axis alignment sensor which radiates a light beam onto a mark on the substrate, wherein;

the first interferometer has the first measuring axis which intersects the optical axis of the projection optical system, and the second measuring axis which intersects a detection center of the off-axis alignment sensor.

123. The scanning type exposure apparatus according to claim 122, wherein:

the second interferometer radiates two measuring beams separated from each other in the second direction, onto the second reflecting surface; and

the detection center of the off-axis alignment sensor is determined by the two measuring beams, and is arranged on the measuring axis of the second interferometer passing through the optical axis of the projection optical system.

124. The scanning type exposure apparatus according to claim 123, wherein:

the substrate stage has a third reflecting surface which is arranged substantially symmetrically to the first reflecting surface in relation to the first direction; and

the apparatus further comprises a third interferometer which radiates a measuring beam onto the third reflecting surface.

125. The scanning type exposure apparatus according to claim 124, wherein the third interferometer has a third measuring axis which intersects the optical axis of the projection optical system, and a fourth measuring axis which intersects the detection center of the off-axis alignment sensor.

126. The scanning type exposure apparatus according to claim 120, further comprising a mask stage, a plurality of corner cubes attached to the mask stage in a direction intersecting a direction in which the mask is moved, and an interferometer system which radiates a light beam to one of the plurality of corner cubes and receives a reflected light beam therefrom.

127. An exposure method for transferring a pattern on a mask onto a photosensitive substrate by synchronously moving the mask and the photosensitive substrate, wherein:

exposure operation is performed while controlling a position of the photosensitive substrate in at least the non-scanning direction which is perpendicular to a synchronous movement direction for the photosensitive substrate, of the non-scanning direction and the synchronous movement direction for the photosensitive substrate, with a first measuring beam in a direction different from a non-scanning direction.

128. The exposure method according to claim 127, wherein the position of the photosensitive substrate is controlled in the synchronous movement direction with a second measuring beam which is substantially parallel to the synchronous movement direction.

166. A microdevice produced by using the exposure method as defined in claim 127.

129. An exposure method for transferring a pattern on a mask onto a photosensitive substrate, wherein:

a position of the photosensitive substrate is controlled with a measuring beam in a direction different from a first direction in which first and second areas are arranged and a second direction perpendicular thereto, between transfer of the pattern to the first area on the photosensitive substrate and transfer of the pattern to the second area adjacent to the first area on the photosensitive substrate.

130. The exposure method according to claim 129, wherein the mask and the photosensitive substrate are synchronously moved in the second direction in order to transfer the pattern to the first and second areas respectively.

131. The exposure method according to claim 129 wherein magnitude of a rate of acceleration differs between acceleration and deceleration of movement of the photosensitive substrate in the first direction.

132. A method for producing a stage apparatus, comprising:

providing a first movable member which is movable in a two-dimensional plane while holding a substrate;

providing a first reflecting surface on the first movable member to extend in a direction intersecting a predetermined first axis and a second axis perpendicular thereto in the two-dimensional plane;

providing a first interferometer which measures a position of the first movable member in a third axis direction by perpendicularly radiating a measuring beam onto the first reflecting surface and receiving a reflected light beam therefrom; and

providing a calculating unit which calculates a position coordinate on a rectangular coordinate system defined by the first axis and the second axis of the first movable member, on the basis of a measured value obtained by the first interferometer.

133. The method according to claim 132, further comprising:

providing a second reflecting surface on the first movable member to extend in the second axis direction; and

providing a second interferometer which measures a position of the first movable member in the first axis direction by perpendicularly radiating a measuring beam onto the second reflecting surface and receiving a reflected light beam therefrom, wherein;

the calculating unit calculates a position coordinate of the first movable member in the second axis direction on the basis of the measured value obtained by the first interferometer.

134. The method according to claim 133, further comprising:

providing a third reflecting surface on the first movable member, the third reflecting surface intersecting the first axis and the second axis perpendicular thereto in the two-dimensional plane, and extending in a direction different from that of the first reflecting surface; and

providing a third interferometer which measures a position of the first movable member in a fourth axis direction by perpendicularly radiating a measuring beam onto the third reflecting surface and receiving a reflected light beam therefrom, wherein;

the calculating unit calculates a position of the first movable member in the second axis direction on a stage coordinate system defined by the first axis and the second axis on the basis of measured values obtained by the first and third interferometers.

135. A method for producing a scanning type exposure apparatus which exposes a substrate by transferring a pattern formed on a mask onto the substrate, the method comprising:

producing a stage apparatus by providing a substrate stage which is movable in a two-dimensional plane while holding the substrate, a first reflecting surface which is provided on the substrate stage to extend in a direction intersecting a predetermined first axis and a second axis perpendicular thereto in the two-dimensional plane, a first interferometer which measures a position of the substrate stage in a third axis direction by perpendicularly radiating a measuring beam onto the first reflecting surface and receiving a reflected light beam therefrom, and a calculating unit which calculates a position coordinate on a rectangular coordinate system defined by the first axis and the second axis of the substrate stage, on the basis of a measured value obtained by the first interferometer respectively;

providing a mask stage which holds the mask; and

providing a stage control system which relatively moves the mask stage and the substrate stage in synchronization with each other in a direction of the first axis, wherein;

the scanning type exposure apparatus is operated such that the pattern formed on the mask is transferred to the substrate on the substrate stage during relative movement of the mask stage and the substrate stage effected by the stage control system.

136. A method for producing a stage apparatus, comprising:

providing a base board;

providing a first movable member which is movable relative to the base board which holds a substrate;

arranging, on the base board, a second movable member which arranges the first movable member thereon, the second movable member being movable relative to the base board and the first movable member respectively; and

providing a driving unit which moves the first movable member in a two-dimensional plane, wherein;

the stage apparatus is constructed such that the second movable member is moved in accordance with a reaction force generated by the movement of the first movable member.

137. A method for producing a scanning type exposure apparatus, comprising:

producing a stage apparatus by providing a base board;

a first movable member which is movable relative to the base board and holds a substrate;

a second movable member which arranges the first movable member thereon, the second movable member being arranged on the base board and being movable relative to the base board and the first movable member respectively; and

a driving unit which moves the first movable member in a two-dimensional plane respectively;

whereby the second movable member is moved in accordance with a reaction force generated by the movement of the first movable member;

providing a mask stage which holds a mask;

providing a projection optical system having an optical axis perpendicular to the mask and the substrate respectively;

providing a first pedestal which supports the projection optical system and suspends the base board thereby; and

providing a vibration-preventive apparatus which supports the first pedestal, wherein;

the scanning type exposure apparatus is operated such that a pattern on the mask is transferred onto the substrate via the projection optical system by synchronously moving the mask and the substrate by the aid of the mask stage and the stage apparatus.

138. A method for producing a scanning type exposure apparatus which transfers a pattern on a mask onto a substrate by synchronously moving the mask and the substrate, the method comprising:

providing a substrate stage which places the substrate thereon;

providing, on the substrate stage, a first reflecting surface extending in a direction intersecting a first direction in which the substrate is synchronously moved and a second direction perpendicular thereto respectively, and a second reflecting surface extending in the second direction; and

providing first and second interferometers which radiates measuring beams onto the first and second reflecting surfaces respectively.

139. A scanning type exposure apparatus for successively transferring a pattern on a mask to a plurality of shot areas on a photosensitive substrate by synchronously-moving the mask and-the photosensitive substrate, the apparatus comprising:

a substrate stage which is movable in a two-dimensional plane while holding the photosensitive substrate;

a mask stage which is movable while holding the mask; and

a stage control system which controls both of the substrate and mask stages so that run-up operation for exposure for the next shot is performed for the substrate stage after completion of exposure simultaneously with stepping operation in a non-scanning direction for the exposure for the next shot in a concurrent manner, and the stepping operation in the non-scanning direction is completed before a synchronous settling period for the both stages before the exposure for the next shot.

140. The scanning type exposure apparatus according to claim 139, wherein the stage control system controls the both stages so that a rate of acceleration of the substrate stage in the non-scanning direction, which corresponds to an over-scanning period composed of a constant velocity movement period and a deceleration period for the mask stage after the exposure for a previous shot, has an absolute value which is larger than that of a rate of deceleration of the substrate stage in the non-scanning direction which corresponds to a pre-scanning period for the mask stage before starting the exposure for the next shot.

141. A scanning exposure method for successively transferring a pattern on a mask to a plurality of comparted areas on a substrate, the method comprising:

synchronously moving the mask and the substrate to perform scanning exposure for a certain comparted area of the plurality of comparted areas; and

starting acceleration of the substrate in a first direction in which the substrate is synchronously moved before completing stepping operation for the substrate in a second direction after completing the scanning exposure for the certain comparted area in order to perform scanning exposure for another comparted area adjacent to the certain comparted area in the second direction perpendicular to the first direction, and completing the stepping operation before synchronous settling period for the mask and the substrate before the scanning exposure for the another comparted area.

142. The scanning exposure method according to claim 141, wherein the substrate is moved by the acceleration obliquely with respect to the first and second directions before the scanning exposure for the another comparted area, and a movement velocity in the first direction is set to be a velocity corresponding to a sensitivity characteristic of the substrate.

143. The scanning exposure method according to claim 141, wherein after completing the scanning exposure for the certain comparted area, the substrate is moved in the second direction while decelerating the substrate in the first direction until the substrate is moved in the first direction by a run-up distance necessary to perform the scanning exposure for the another comparted area.

144. The scanning exposure method according to claim 142, wherein after completing the scanning exposure for the certain comparted area, the substrate is moved in the second direction while decelerating the substrate in the first direction until the substrate is moved in the first direction by a run-up distance necessary to perform the scanning exposure for the another comparted area.

145. The scanning exposure method according to claim 141, wherein the substrate is moved so that at least one of a velocity component in the first direction and a velocity component in the second direction is not zero during a period between the scanning exposure for the certain comparted area and the scanning exposure for the another comparted area.

146. The scanning exposure method according to claim 141, wherein the substrate is moved during a period between the scanning exposure for the certain comparted area and the scanning exposure for the another comparted area so that a position in the second direction, at which a movement velocity in the first direction is zero, is nearer to the another comparted area than to the certain comparted area.

147. The scanning exposure method according claim 145, wherein the substrate is moved during a period between the scanning exposure for the certain comparted area and the scanning exposure for the another comparted area so that a position in the second direction, at which a movement velocity in the first direction is zero, is nearer to the another comparted area than to the certain comparted area.

148. The scanning exposure method according to claim 141, wherein:

the substrate is moved in the second direction while decelerating the substrate until a movement velocity of the substrate in the first direction is zero after completing the scanning exposure for the certain comparted area, and the substrate is moved in the second direction while accelerating the substrate in the first direction before performing the scanning exposure for the another comparted area.

149. The scanning exposure method according to claim 148, wherein the substrate is moved without any stop during a period between the scanning exposure for the certain comparted area and the scanning exposure for the another comparted area.

150. The scanning exposure method according to claim 148, wherein the substrate is moved so that a movement locus thereof is substantially parabolic during a period between the scanning exposure for the certain comparted area and the scanning exposure for the another comparted area.

151. The scanning exposure method according to claim 141, wherein acceleration is started for the mask before a velocity component of the substrate in the second direction is zero.

152. The scanning exposure method according to claim 141, wherein an absolute value of a rate of acceleration differs between acceleration and deceleration of the substrate when the substrate is moved in the second direction during a period between the scanning exposure for the certain comparted area and the scanning exposure for the another comparted area.

153. The scanning exposure method according to claim 148, wherein acceleration is started for the mask before a velocity component of the substrate in the second direction is zero.

154. The scanning exposure method according to claim 148, wherein an absolute value of a rate of acceleration differs between acceleration and deceleration of the substrate when the substrate is moved in the second direction during a period between the scanning exposure for the certain comparted area and the scanning exposure for the another comparted area.

167. A microdevice produced by using the exposure method as defined in claim 141.

168. A microdevice produced by using the exposure method as defined in claim 148.

169. A microdevice produced by using the exposure method as defined in claim 150.

178. The scanning exposure method according to claim 141, wherein the substrate is moved so that a velocity component in at least one of a first direction in which the substrate is synchronously moved and a second direction perpendicular thereto is not zero until completion of scanning exposure for the last comparted area on the substrate to which the pattern on the mask is to be transferred.

159. A scanning exposure method for successively transferring a pattern on a mask to a first comparted area and a second comparted area on a substrate, arranged in a second direction perpendicular to a first direction in which the substrate is synchronously moved, by synchronously moving the mask and the substrate, the method comprising:

starting acceleration of the substrate and acceleration of the mask in order to perform scanning exposure for the second comparted area before a velocity component of the substrate in the second direction is zero after completing scanning exposure for the first comparted area.

160. The scanning exposure method according to claim 159, wherein the substrate is accelerated in the first direction, and it is decelerated in the second direction.

161. The scanning exposure method according to claim 159, wherein the acceleration of the substrate in the second direction is started before a velocity component of the substrate in the first direction is zero after completing the scanning exposure for the first comparted area.

162. The scanning exposure method according to claim 159, wherein the substrate is moved without any stop during a period between the scanning exposure for the first comparted area and the scanning exposure for the second comparted area.

163. The scanning exposure method according to claim 159, wherein a position of the substrate in the second direction, at which a velocity component of the substrate in the first direction is zero after completing scanning exposure for the first comparted area, is closer to the first comparted area than the second comparted area in the second direction.

164. The scanning exposure method according to claim 160, wherein the acceleration of the substrate in the second direction is started before a velocity component of the substrate in the first direction is zero after completing the scanning exposure for the first comparted area.

165. The scanning exposure method according to claim 160, wherein a position of the substrate in the second direction, at which a velocity component of the substrate in the first direction is zero after completing scanning exposure for the first comparted area, is closer to the first comparted area than the second comparted area in the second direction.

170. A microdevice produced by using the exposure method as defined in claim 159.

171. A microdevice produced by using the exposure method as defined in claim 163.

172. A scanning exposure method for successively transferring a pattern on a mask to a first comparted area and a second comparted area on a substrate, arranged in a second direction perpendicular to a first direction in which the substrate is synchronously moved, by synchronously moving the mask and the substrate, wherein:

during a period between first scanning exposure for the first comparted area and second scanning exposure for the second comparted area, acceleration of the substrate in the second direction is started before a velocity component of the substrate in the first direction is zero after completing the first scanning exposure, and acceleration of the substrate in the first direction and acceleration of the mask are started before a velocity component of the substrate in the second direction is zero.

173. The scanning exposure method according to claim 172, wherein the acceleration of the substrate in the first direction is started during deceleration of the substrate in the second direction.

174. The scanning exposure method according to claim 172, wherein the acceleration of the substrate in the second direction is started during the deceleration of the substrate after completing the first scanning exposure.

175. The scanning exposure method according to claim 173, wherein the acceleration of the substrate in the second direction is started during the deceleration of the substrate after completing the first scanning exposure.

176. The scanning exposure method according to claim 172, wherein the substrate is moved without any stop during the period between the scanning exposure for the first comparted area and the scanning exposure for the second comparted area.

177. The scanning exposure method according to claim 172, wherein the scanning exposure is performed for the first and second comparted areas in accordance with reciprocating movement of the mask.

190. A microdevice produced by using the exposure method as defined in claim 172.

191. A microdevice produced by using the exposure method as defined in claim 177.

179. A scanning exposure method for transferring a pattern on a mask to one or more comparted areas on a substrate by synchronously moving the mask and the substrate, wherein:

at least one of the mask and the substrate is accelerated in a direction of the synchronous movement on the basis of a rate of acceleration variation curve along which a rate of acceleration is gradually converged to zero, prior to the synchronous movement of the mask and the substrate when scanning exposure-is performed for the respective comparted areas.

180. The scanning exposure method according to claim 179, comprising:

successively transferring the pattern on the mask to a first comparted area and a second comparted area on the substrate, arranged in a second direction perpendicular to a first direction in which the substrate is synchronously moved, wherein;

the substrate is moved in a direction intersecting the first direction and the second direction during deceleration of the substrate in the first direction after completing scanning exposure for the first comparted area and during acceleration of the substrate in the first direction before performing scanning exposure for the second comparted area.

181. A scanning exposure method for successively transferring a pattern on a mask to a first comparted area and a second comparted area on a substrate, arranged in a second direction perpendicular to a first direction in which the substrate is synchronously moved, by synchronously moving the mask and the substrate, comprising:

performing scanning exposure for at least the first comparted area, wherein at least one of the mask and the substrate is accelerated in the first direction on the basis-of a rate of acceleration variation curve along which a rate of acceleration is gradually converged to zero prior to the synchronous movement of the mask and the substrate, and the at least one of the mask and the substrate is decelerated in the first direction at a constant rate of deceleration after completing the synchronous movement.

182. The scanning exposure method according to claim 181, wherein the substrate is moved in a direction intersecting the first direction and the second direction during the deceleration of the substrate in the first direction after completing the scanning exposure for the first comparted area and during acceleration of the substrate in the first direction before performing scanning exposure for the second comparted area.

183. A scanning exposure method for transferring a pattern on a mask onto a substrate by synchronously moving the mask and the substrate with respect to an area onto which an energy beam is radiated, the method comprising:

starting the movement of the mask and the substrate while accelerating the mask and the substrate;

allowing the mask and the substrate to arrive at a constant velocity while continuously decreasing a rate of acceleration of one of the mask and the substrate; and

executing scanning exposure when the mask and the substrate are moved at the constant velocity.

184. The scanning exposure method according to claim 183, wherein one of the mask and the substrate is decelerated at a constant rate of deceleration after the mask and the substrate are moved at the constant velocity.

185. A method for producing a scanning type exposure apparatus which successively transfers a pattern on a mask to a plurality of shot areas on a photosensitive substrate by synchronously moving the mask and the photosensitive substrate, the method comprising:

providing a substrate stage which is movable in a two-dimensional plane while holding the photosensitive substrate;

providing a mask stage which is movable while holding the mask; and

providing a stage control system which controls the both stages so that run-up operation for exposure for the next shot is performed for the substrate stage after completion of exposure simultaneously with stepping operation in a non-scanning direction for the exposure for the next shot in a concurrent manner, and the stepping operation in the non-scanning direction is completed before a synchronous settling period for the both stages before the exposure for the next shot.