Universal modular wafer transport system

• US 20030129045A1
• Filed: 09/03/2002
• Published: 07/10/2003
• Est. Priority Date: 08/31/2001
• Status: Active Grant

• Current Assignee: Brooks Automation Ltd. (United Kingdom) (Azenta, Inc.)
• Original Assignee: Asyst Technologies Incorporated (Azenta, Inc.)
• Inventors: Speasl, Jerry A., Hine, Roger G., Krolak, Michael, Bonora, Anthony C., Gould, Richard H.
• Granted Patent: US 7,293,950 B2
• Time in Patent Office: Days
• US Class Current: 414/217
• CPC Class Codes: H01L 21/67709 using magnetic elements
• CPC Class Codes: H01L 21/67766 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67775 Docking arrangements
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers
• CPC Class Codes: H01L 21/68707 the wafers being placed on a robot blade, or gripped by a gripper for conveyance
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber

Abstract

The present invention is a wafer transfer system that transports individual wafers between chambers within an isolated environment. In one embodiment, a wafer is transported by a wafer shuttle that travel within a transport enclosure. The interior of the transport enclosure is isolated from the atmospheric conditions of the surrounding wafer fabrication facility. Thus, an individual wafer may be transported throughout the wafer fabrication facility without having to maintain a clean room environment for the entire facility. The wafer shuttle may be propelled by various technologies, such as, but not limited to, magnetic levitation or air bearings. The wafer shuttle may also transport more than one wafer simultaneously. The interior of the transport enclosure may also be under vacuum, gas-filled, or subject to filtered air.

Claims

1. A wafer transport system for transferring wafers between processing stations, comprising:

a wafer transport device;

a wafer transport enclosure, having multiple rails that said wafer transport device may travel along;

a transition chamber located between the processing tool and said wafer transport enclosure, including an isolation valve;

a driver for controlling the movement of said wafer transport device along said tracks;

2. The wafer transport system according to claim 1, wherein said rails are magnetic rails.

3. The wafer transport system according to claim 1, wherein said wafer transport device includes a lift magnet and a propulsion magnet.

4. The wafer transport system according to claim 1, wherein said lift magnet and said magnetic rail form a magnetic coupling.