Methods of operating microelectronic devices, and methods of providing microelectronic devices

• US 20030129951A1
• Filed: 02/19/2003
• Published: 07/10/2003
• Est. Priority Date: 03/01/1999
• Status: Active Grant

• Current Assignee: Round Rock Research LLC
• Original Assignee: Patrick W. Tandy
• Inventors: Tandy, Patrick W.
• Granted Patent: US 6,718,163 B2
• Time in Patent Office: Days
• US Class Current: 455/90.1
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H04B 1/3816 : Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
• CPC Class Codes: H04B 1/3833 : Hand-held transceivers

Abstract

Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices are described. In one embodiment, a microelectronic device includes a microelectronic package which provides a housing within which integrated circuitry is received. An integrated circuit die is received within the microelectronic package and includes integrated circuitry formed thereon. The integrated circuitry comprises first transmit/receive circuitry configured to transmit and receive radio frequency signals. Second transmit/receive circuitry is provided, discrete from the first transmit/receive circuitry, and is contained within the microelectronic package. The second circuitry is configured to transmit and receive radio frequency signals, wherein the first and second transmit/receive circuitry are configured to establish wireless communication between one another within the microelectronic package. In another embodiment, a microelectronic package is provided having housed therein integrated circuitry. Wireless communication is produced using a transmitter inside the microelectronic package. The produced wireless communication is received using a receiver inside the microelectronic package. Responsive to the receiving of such communication, the integrated circuitry is caused to operate in a designed manner.

Claims

1. A microelectronic device comprising:

a microelectronic package providing a housing within which integrated circuitry is received;

an integrated circuit die received within the microelectronic package and having integrated circuitry formed thereon, the integrated circuitry comprising first transmit/receive circuitry configured to transmit and receive radio frequency signals; and

second transmit/receive circuitry, discrete from the first transmit/receive circuitry and contained within the microelectronic package, the second transmit/receive circuitry being configured to transmit and receive radio frequency signals, wherein the first and second transmit/receive circuitry are configured to establish wireless communication between one another within the microelectronic package.

2. The microelectronic device of claim 1, wherein the microelectronic package contains more than one die.

3. The microelectronic device of claim 1, wherein the second transmit/receive circuitry is disposed on a second integrated circuit die.

4. The microelectronic device of claim 1 further comprising a substrate disposed within the housing, and wherein the first and second transmit/receive circuitry are supported on the substrate.

5. The microelectronic device of claim 1 further comprising a printed circuit board substrate disposed within the housing, and wherein the first and second transmit/receive circuitry are supported on the printed circuit board substrate.

6. The microelectronic device of claim 1, wherein the microelectronic device is hand-carriable.

7. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry are disposed within 24 inches of one another within the microelectronic package.

8. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication.

9. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless RF communication.

10. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication, the antennas being disposed within 24 inches of one another within the microelectronic package.

11. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication, the antennas being disposed within one inch of one another within the microelectronic package.

12. The microelectronic device of claim 1, wherein the first and second transmit/receive circuitry comprise individual respective antennas configured to transmit and receive wireless communication, the antennas being disposed within one half inch of one another within the microelectronic package.

13. The microelectronic device of claim 1, wherein the die is void of external electrical connections for anything other than at least one of power and ground.

14. A microelectronic device comprising:

a microelectronic package providing a housing within which integrated circuitry is received;

an integrated circuit die received within the microelectronic package and having integrated circuitry formed thereon and configured to operate in a designed manner, the integrated circuitry comprising a processor;

an integrated circuitry transmitter received within the microelectronic package and configured to transmit wireless communication; and

an integrated circuitry receiver received within the microelectronic package and configured to receive wireless communication transmitted by the integrated circuitry transmitter, the receiver being further operably coupled with the processor and configured to provide data thereto responsive to received wireless communication.

15. The microelectronic device of claim 14, wherein the receiver comprises a portion of the integrated circuitry on the die.

16. The microelectronic device of claim 14, wherein the integrated circuitry transmitter is disposed on a second integrated circuit die.

17. The microelectronic device of claim 14, wherein more than one die is received within the housing.

18. The microelectronic device of claim 14, wherein the die has lead fingers operably connected therewith through individual wire bonds, there being wire bonds with the die only for connections to power and ground.

19. The microelectronic device of claim 14, wherein the transmitter and the receiver are disposed within the microelectronic package within 24 inches of one another.

20. The microelectronic device of claim 14, wherein the transmitter and the receiver are disposed within the microelectronic package within one inch of one another.

21. The microelectronic device of claim 14, wherein the transmitter and the receiver are disposed within the microelectronic package within one half inch of one another.

22. The microelectronic device of claim 14, wherein the processor is configured to receive data which is provided by the receiver and, responsive thereto, cause the integrated circuitry on the die to operate in said designed manner.

23. The microelectronic device of claim 14, wherein the die has lead fingers operably connected therewith through individual wire bonds, there being wire bonds with the die only for connections to power and ground, and wherein the transmitter and the receiver are disposed within the microelectronic package within 24 inches of one another.

24. The microelectronic device of claim 14, wherein the die has lead fingers operably connected therewith through individual wire bonds, there being wire bonds with the die only for connections to power and ground, and wherein the transmitter and the receiver are disposed within the microelectronic package within one inch of one another.

25. The microelectronic device of claim 14, wherein the die has lead fingers operably connected therewith through individual wire bonds, there being wire bonds with the die only for connections to power and ground, and wherein the transmitter and the receiver are disposed within the microelectronic package within one half inch of one another.

26. The microelectronic device of claim 14, wherein the microelectronic device is hand-transportable.

27. A microelectronic device comprising:

a microelectronic package providing a housing within which integrated circuitry is received, and an integrated circuitry-supporting substrate inside the housing;

an integrated circuit die received within the microelectronic package and supported by the integrated circuitry-supporting substrate, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry comprising first transmit/receive circuitry configured to transmit and receive wireless communication; and

second transmit/receive circuitry, discrete from the first transmit/receive circuitry and contained within the microelectronic package, the second transmit/receive circuitry being configured to transmit and receive wireless communication, wherein the first and second transmit/receive circuitry are configured to establish wireless communication between one another within the microelectronic package sufficient to enable the integrated circuitry on the integrated circuitry die to operate in a designed manner.

28. The microelectronic device of claim 27, wherein the second transmit/receive circuitry is disposed on a second integrated circuit die supported by the integrated circuitry-supporting substrate.

29. The microelectronic device of claim 27, wherein the second transmit/receive circuitry is supported by the integrated circuitry-supporting substrate.

30. The microelectronic device of claim 27, wherein the device is hand-transportable.

31. The microelectronic device of claim 27 further comprising individual antennas operably associated with the first and second transmit/receive circuitry respectively, the antennas being disposed within the microelectronic package within 24 inches of one another.

32. The microelectronic device of claim 27 further comprising individual antennas operably associated with the first and second transmit/receive circuitry respectively, the antennas being disposed within the microelectronic package within one inch of one another.

33. The microelectronic device of claim 27 further comprising individual antennas operably associated with the first and second transmit/receive circuitry respectively, the antennas being disposed within the microelectronic package within one half inch of one another.

34. The microelectronic device of claim 27, wherein the integrated circuit die has physical-electrical connection structure securing it to the integrated circuitry-supporting substrate, said structure supplying electrical connections only for power and ground.

35. The microelectronic device of claim 27, wherein the wireless communication comprises RF communication.

36. The microelectronic device of claim 27, wherein the microelectronic device comprises a hermetically-sealed device.

37. A method of operating a microelectronic device comprising:

providing a microelectronic package having housed therein integrated circuitry;

producing wireless communication using a transmitter inside the microelectronic package;

receiving the produced wireless communication using a receiver inside the microelectronic package; and

responsive to said receiving, causing the integrated circuitry to operate in a designed manner.

38. The method of claim 37, wherein said producing of the wireless communication comprises using an integrated circuitry transmitter.

39. The method of claim 37, wherein said receiving of the wireless communication comprises using an integrated circuitry receiver.

40. The method of claim 37 further comprising positioning the transmitter and the receiver within 24 inches of one another.

41. The method of claim 37 further comprising positioning the transmitter and the receiver within one inch of one another.

42. The method of claim 37 further comprising positioning the transmitter and the receiver within one half inch of one another.

43. The method of claim 37 further comprising fabricating the integrated circuitry.

44. A method of operating a microelectronic device comprising:

providing a microelectronic package having housed therein integrated circuitry;

transmitting a wireless communication signal using an integrated circuitry transmitter inside the microelectronic package;

receiving the transmitted wireless communication signal using an integrated circuitry receiver inside the microelectronic package; and

responsive to said receiving, causing the integrated circuitry within the microelectronic package to operate in a designed manner.

45. The method of claim 44 further comprising positioning the transmitter and the receiver within 24 inches of one another.

46. The method of claim 44 further comprising positioning the transmitter and the receiver within one inch of one another.

47. The method of claim 44 further comprising positioning the transmitter and the receiver within one half inch of one another.

48. The method of claim 44 further comprising fabricating one of the integrated circuitry transmitter or receiver.

49. A method of forming a microelectronic device comprising:

providing a microelectronic package within which integrated circuitry is to be housed;

mounting an integrated circuitry transmitter within the package; and

mounting an integrated circuit die within the package, the die having integrated circuitry disposed thereon including an integrated circuit receiver, wherein the transmitter and receiver are configured to establish direct wireless communication with one another, wherein operating instructions for the integrated circuitry on the die are transmitted and received within the microelectronic package.

50. The method of claim 49, wherein the transmitter and the receiver are mounted within 24 inches of one another.

51. The method of claim 49, wherein the transmitter and the receiver are mounted within one inch of one another.

52. The method of claim 49, wherein the transmitter and the receiver are mounted within one half inch of one another.