Optical machining device

• US 20030132210A1
• Filed: 11/25/2002
• Published: 07/17/2003
• Est. Priority Date: 11/07/2000
• Status: Active Grant

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Fujii, Koji, Nagayasu, Dokei, Hirasawa, Kazushige, Ryudo, Makoto
• Granted Patent: US 6,791,061 B2
• Time in Patent Office: Days
• US Class Current: 219/121.84
• CPC Class Codes: B23K 26/123 in an atmosphere of particular gases
• CPC Class Codes: B23K 26/14 using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor B23K26/12 takes precedence
• CPC Class Codes: B23K 26/1476 Features inside the nozzle for feeding the fluid stream through the nozzle
• CPC Class Codes: B23K 26/16 Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece by a fluid stream B23K26/142
• CPC Class Codes: H01S 5/02407 Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling

Abstract

An optical processing apparatus has high reliability and stable welding quality. In the processing apparatus, a semiconductor laser and an optical system are disposed to a flow path of processing gas. The gas protects the semiconductor laser and the optical system from moisture and dust while cooling them. In addition, the apparatus also leads the processing gas to flow through a holder of the optical system to increase cooling effect for the optical system and to improve an optical accuracy. The apparatus guides the processing gas along a surface of a cover glass inside a nozzle ejecting the processing gas to a workpiece, to prevent the surface of the cover glass from being damaged and stained. The processing gas is ejected in a direction coaxial with a direction of output light, so as to shield an area being processed.

Claims

1. An optical processing apparatus comprising:

a laser source;

an enclosure accommodating said laser light source therein, and having an inlet opening for introducing gas and an outlet opening for discharging said introduced gas;

a lens, disposed to a path of laser irradiated from said laser source through said enclosure;

a lens holder for supporting said lens; and

a cylinder communicated to said enclosure, for covering an outer periphery of said lens holder to form a space with said lens holder for guiding said discharged gas to flow therethrough.

2. An optical processing apparatus according to claim 1, further comprising a nozzle connected to a laser irradiating portion of said cylinder, said nozzle including a tip end having a diameter smaller than a diameter of said irradiating portion, wherein said gas guided through said space flows into said nozzle.

3. An optical processing apparatus according to claim 2, wherein said nozzle has a shape that leads said gas to flow along said irradiating portion of said cylinder.

4. An optical processing apparatus according to claim 2 or 3, wherein said gas flows from said nozzle in the same direction as an irradiating direction of said laser light.

5. An optical processing apparatus according to any one of claims 2 to 4,

wherein said lens holder and said cylinder have cylindrical shape, and

wherein said nozzle has a conic shape with an opening in said tip end, and covers said irradiating portion of said cylinder for said laser.

6. An optical processing apparatus according to any one of claims 1 to 5, wherein said gas is shielding gas for welding.