Thermally matched fluid cooled power converter
First Claim
1. A modular power converter comprising:
- a thermal support at least partially defining an electric reference plane and configured to receive and circulate a coolant stream for extraction of heat;
an interface plate secured to the thermal support and contacting the coolant stream during operation;
at least one power electronic device subassembly disposed on the interface plate and comprising a power electronic device and contact pads for transmitting signals to and from the power electronics device, the interface plate and the electronics device subassembly being at least partially thermally matched to create a desired thermal gradient to remove heat from the power electronics device during operation via the substrate and the thermal support.
2 Assignments
0 Petitions
Accused Products
Abstract
A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
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Citations
41 Claims
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1. A modular power converter comprising:
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a thermal support at least partially defining an electric reference plane and configured to receive and circulate a coolant stream for extraction of heat;
an interface plate secured to the thermal support and contacting the coolant stream during operation;
at least one power electronic device subassembly disposed on the interface plate and comprising a power electronic device and contact pads for transmitting signals to and from the power electronics device, the interface plate and the electronics device subassembly being at least partially thermally matched to create a desired thermal gradient to remove heat from the power electronics device during operation via the substrate and the thermal support. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A modular power converter comprising:
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a thermal support at least partially defining an electric reference plane and configured to receive and circulate a coolant stream for extraction of heat;
an interface plate secured to the thermal support and contacting the coolant stream during operation;
at least one power electronic device subassembly disposed on the interface plate and comprising a power electronic device and contact pads for transmitting signals to and from the power electronics device, the interface plate and the electronics device subassembly being at least partially thermally matched to create a desired thermal gradient to remove heat from the power electronics device during operation via the substrate and the thermal support;
wherein the interface plate and the thermal support are made of different materials. - View Dependent Claims (14, 15, 16, 17, 18)
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19. A modular power converter comprising:
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a controlled power electronics circuit including solid state switches configured to convert incoming power to controlled outgoing power; and
a fluid cooled support on which the power electronics circuit is directly secured, the fluid cooled support including inlet and outlet ports for a cooling fluid and an internal fluid conduit for directing flow of cooling fluid adjacent to the power electronics circuit for removal of heat therefrom, the support further including an interface plate on which the power electronics circuit is secured and which contacts the cooling fluid during operation, interfaces between the power electronics circuit and and the interface plate being thermally matched to limit differential thermal expansion during operation of the solid state switches. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. A modular power converter comprising:
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a plurality of controlled power electronics circuits including solid state switches configured to convert incoming power to controlled outgoing power; and
a fluid cooled support on which the power electronics circuits are directly secured, the fluid cooled support including inlet and outlet ports for a cooling fluid and an internal fluid conduit for directing flow of cooling fluid adjacent to the power electronics circuit for removal of heat therefrom, the support further including an interface plate on which the power electronics circuit is secured and which contacts the cooling fluid during operation, interfaces between the power electronics circuit and the interface plate being thermally matched to limit differential thermal expansion during operation of the solid state switches. - View Dependent Claims (31, 32)
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33. A modular power converter comprising:
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a plurality of controlled power electronics circuits including solid state switches configured to convert incoming power to controlled outgoing power, each circuit including a first bonding layer thermally matched to an underlying interface plate, a substrate disposed on the first bonding layer and thermally matched to the first bonding layer, a second bonding layer disposed on the substrate and thermally matched to the substrate, and a device layer disposed on the second bonding layer and thermally matched to the second bonding layer; and
a fluid cooled support on which the power electronics circuits are directly secured, the fluid cooled support including inlet and outlet ports for a cooling fluid and an internal fluid conduit for directing flow of cooling toward the interface plate for removal of heat therefrom during operation of the solid state switches. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41)
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Specification