Method of backgrinding wafers while leaving backgrinding tape on a chuck
First Claim
Patent Images
1. A method of preparing a wafer, said method comprising the steps of:
- a) providing a wafer having a front side and a back side;
b) processing the wafer such that the wafer has a flatness and a thickness suitable for building-up a device on the front side of the wafer;
c) building-up a device onto the front side of the wafer;
d) providing a chuck and a tape, wherein the chuck is suitable for supporting the tape during a backgrinding process, and wherein the tape is suitable for supporting the wafer;
e) after building up the device, placing the tape onto the chuck;
f) placing the front side of the wafer onto the tape;
g) securing the front side of the wafer to the tape;
h) grinding the back side of the wafer; and
i) removing the wafer from the tape.
2 Assignments
0 Petitions
Accused Products
Abstract
A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, and then removed from the tape. A tool for applying tape to a chuck, as described herein, facilitates this method.
-
Citations
40 Claims
-
1. A method of preparing a wafer, said method comprising the steps of:
-
a) providing a wafer having a front side and a back side;
b) processing the wafer such that the wafer has a flatness and a thickness suitable for building-up a device on the front side of the wafer;
c) building-up a device onto the front side of the wafer;
d) providing a chuck and a tape, wherein the chuck is suitable for supporting the tape during a backgrinding process, and wherein the tape is suitable for supporting the wafer;
e) after building up the device, placing the tape onto the chuck;
f) placing the front side of the wafer onto the tape;
g) securing the front side of the wafer to the tape;
h) grinding the back side of the wafer; and
i) removing the wafer from the tape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method of preparing a wafer, said method comprising the steps of:
-
providing a wafer having a front side and a back side;
processing the wafer such that the wafer has a flatness and a thickness suitable for building-up a device on the front side of the wafer;
building-up a device onto the front side of the wafer;
providing a chuck, wherein the chuck is suitable for supporting a tape during a backgrinding process and wherein the chuck is capable of communicating a vacuum;
providing a tape having a wafer side suitable for supporting the wafer and a chuck side suitable for resting on a chuck, wherein the chuck side of the tape is adhesive and the wafer side of the tape is non-adhesive; and
wherein the tape is capable of communicating a vacuum;
placing the chuck side of the tape onto the chuck;
after building up the device, placing the front side of the wafer onto the wafer side of the tape;
securing the front side of the wafer to the wafer side of the tape by applying a vacuum through the chuck and the tape;
grinding the back side of the wafer;
releasing the vacuum; and
removing the wafer from the tape. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
-
-
21. A method of preparing a wafer, said method comprising the steps of:
-
a) providing a wafer having a front side and a back side;
b) processing the wafer such that the wafer has a flatness and a thickness suitable for building-up a device on the front side of the wafer;
c) building-up a device onto the front side of the wafer;
d) providing a chuck and a pad, wherein the chuck is suitable for supporting the pad during a backgrinding process, and wherein the pad is suitable for supporting the wafer;
e) after building up the device, placing the pad onto the chuck;
f) placing the front side of the wafer onto the pad;
g) securing the front side of the wafer to the pad;
h) grinding the back side of the wafer; and
i) removing the wafer from the pad. - View Dependent Claims (22, 23, 24, 26, 27, 28, 29, 30)
-
-
25. The method of claim 25 wherein the step of removing the second wafer from the pad comprises the step of removing the second wafer from the pad without removing the pad from the chuck.
-
31. A method of preparing a wafer, said method comprising the steps of:
-
providing a wafer having a front side and a back side;
processing the wafer such that the wafer has a flatness and a thickness suitable for building-up a device on the front side of the wafer;
building-up a device onto the front side of the wafer;
providing a chuck, wherein the chuck is suitable for supporting a pad during a backgrinding process and wherein the chuck is capable of communicating a vacuum;
providing a pad having a wafer side suitable for supporting the wafer and a chuck side suitable for resting on a chuck, wherein the chuck side of the pad is adhesive and the wafer side of the pad is non-adhesive; and
wherein the pad is capable of communicating a vacuum;
placing the chuck side of the pad onto the chuck;
after building up the device, placing the front side of the wafer onto the wafer side of the pad;
securing the front side of the wafer to the wafer side of the pad by applying a vacuum through the chuck and the pad;
grinding the back side of the wafer;
releasing the vacuum; and
removing the wafer from the pad. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40)
-
Specification