Printed circuit board support

• US 20030136637A1
• Filed: 02/27/2003
• Published: 07/24/2003
• Est. Priority Date: 11/01/2000
• Status: Active Grant

• Current Assignee: Brian F. Gordon, John S. Godfrey, Tony M. Teitenberg
• Original Assignee: Brian F. Gordon, John S. Godfrey, Tony M. Teitenberg
• Inventors: Gordon, Brian F., Godfrey, John S., Teitenberg, Tony M.
• Granted Patent: US 6,863,170 B2
• Time in Patent Office: Days
• US Class Current: 198/345.2
• CPC Class Codes: H05K 13/0069 Holders for printed circuit boards
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53196 Means to apply magnetic force directly to position or hold work part
• CPC Class Codes: Y10T 29/53265 with work-holder for assembly

Abstract

A method of conveying a printed circuit board in a printed circuit board conveying system. The conveying system comprises a pair of conveyor rails and a printed circuit board support assembly. The rails are positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey the printed circuit board along a conveyor path. The support assembly is positioned to support a major portion of the printed circuit board between the lateral edge portions and comprises a support base and a spacer selected from a plurality of spacers. The method comprises selecting a spacer as a function of its thickness and a thickness profile of the printed circuit board engaged by the pair of conveyor rails, installing the selected spacer by extending at least one projection into a recess, and engaging an upper spacer surface of the selected spacer with the printed circuit board. It is emphasized that this abstract, is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR §1.72(b).

Claims

1. A method of conveying a printed circuit board in a printed circuit board conveying system wherein said conveying system comprises:

a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and

a printed circuit board support assembly positioned to support a major portion of said printed circuit board between said lateral edge portions, said printed circuit board support assembly comprising

a support base defining a support surface and at least one recess formed therein, said recess defining an opening on said support surface; and

a spacer selected from a plurality of spacers, each of said spacers defining an upper spacer surface and an opposite spacer surface, wherein (i) said upper spacer surface is sized and configured to support and engage a major portion of said printed circuit board, (ii) said spacers define a range of respective thickness dimensions between respective ones of said upper spacer surfaces and corresponding ones of said opposite spacer surfaces, (iii) each of said spacers includes at least one projection extending from said opposite spacer surface, and (iv) said respective projections and said recess formed in said support base are sized to enable extension of said respective projections into said recess and to limit movement of said spacer relative to a plane parallel to said support surface;

and wherein said method comprises;

selecting one of said plurality of spacers as a function of its thickness and a thickness profile of said printed circuit board engaged by said pair of conveyor rails;

installing said selected spacer by extending at least one of said respective projections into said recess; and

engaging an upper spacer surface of said selected spacer with said printed circuit board.

2. A method of conveying a printed circuit board in a printed circuit board conveying system wherein said conveying system comprises:

a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and

a printed circuit board support positioned to support a major portion of said printed circuit board between said lateral edge portions, said printed circuit board support comprising

a support base defining a support surface; and

a base extension assembly secured to said support base and arranged to define a variable extension assembly height dimension and at least a portion of a height dimension of said printed circuit board support, wherein variation of said variable extension assembly height dimension results in variation of said height dimension of said printed circuit board support, and wherein said base extension assembly is configured such that said height dimension of said printed circuit board support permits engagement of said support surface with said printed circuit board;

and wherein said method comprises;

engaging said support surface of said support base with said printed circuit board engaged by said pair of conveyor rails; and

varying said height dimension of said base extension assembly as a function of a thickness profile of said printed circuit board.

3. A method of processing a printed circuit board in a processing system including a printed circuit board conveying system coupling a printed circuit board loader to a stencil printer, a pick and place machine, and a reflow oven, wherein said printed circuit board conveying system comprises:

a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and

a printed circuit board support assembly positioned to support a major portion of said printed circuit board between said lateral edge portions within an operating envelope of said pick and place machine, said printed circuit board support assembly comprising

a support base defining a support surface and at least one recess formed therein, said recess defining an opening on said support surface; and

a spacer selected from a plurality of spacers, each of said spacers defining an upper spacer surface and an opposite spacer surface, wherein (i) said upper spacer surface is sized and configured to support and engage a major portion of a printed circuit board, (ii) said spacers define a range of respective thickness dimensions between respective ones of said upper spacer surfaces and corresponding ones of said opposite spacer surfaces, (iii) each of said spacers includes at least one projection extending from said opposite spacer surface, and (iv) said respective projections and said recess formed in said support base are sized to enable extension of said respective projections into said recess and to limit movement of said spacer relative to a plane parallel to said support surface;

and wherein said method comprises;

selecting one of said plurality of spacers as a function of its thickness and a thickness profile of said printed circuit board engaged by said pair of conveyor rails;

installing said selected spacer by extending at least one of said respective projections into said recess; and

engaging an upper spacer surface of said selected spacer with said printed circuit board within said operating envelope of said pick and place machine.

4. A method of processing a printed circuit board in a processing system including a printed circuit board conveying system coupling a printed circuit board loader to a stencil printer, a pick and place machine, and a reflow oven, wherein said printed circuit board conveying system comprises:

a pair of conveyor rails positioned to engage opposite lateral edge portions of a printed circuit board and configured to convey said printed circuit board along a conveyor path; and

a printed circuit board support positioned to support a major portion of said printed circuit board between said lateral edge portions within an operating envelope of said pick and place machine, said printed circuit board support comprising

a support base defining a support surface; and

a base extension assembly secured to said support base and arranged to define a variable extension assembly height dimension and at least a portion of a height dimension of said printed circuit board support, wherein variation of said variable extension assembly height dimension results in variation of said height dimension of said printed circuit board support, and wherein said base extension assembly is configured such that said height dimension of said printed circuit board support permits engagement of said support surface with said printed circuit board;

and wherein said method comprises;

engaging said support surface of said support base with said printed circuit board engaged by said pair of conveyor rails within said operating envelope of said pick and place machine; and

varying said height dimension of said base extension assembly as a function of a thickness profile of said printed circuit board.