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Method and apparatus for monitoring plasma processing operations

  • US 20030136663A1
  • Filed: 06/06/2002
  • Published: 07/24/2003
  • Est. Priority Date: 04/23/1998
  • Status: Abandoned Application
First Claim
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1. A plasma monitoring system for a plasma process performed in a processing chamber, wherein said plasma process comprises a first plasma step, and wherein a first endpoint of said first plasma step is when a first predetermined result has been achieved, said system comprising:

  • a computer-readable storage medium comprising;

    a first output associated with at least a portion of one of said first plasma steps, said first output being data representative of optical emissions from said processing chamber during execution of one of said first plasma steps within said processing chamber, wherein said optical emissions are within a first wavelength range extending from about 250 nanometers to about 1,000 nanometers and at least at every 1 nanometer within said first wavelength range;

    means for identifying when said first endpoint has occurred for a current said first plasma step, wherein said means for identifying comprises a first technique comprising;

    means for receiving data representative of optical emissions of said plasma in said processing chamber at least within said first wavelength range, at least a plurality of different constant during said current said first plasma step, and at least at every 1 nanometer within said first wavelength range;

    means for comparing said optical emissions at each of said plurality of different times with said first output; and

    means for determining when said optical emissions from at least one of said plurality of different times is within a predetermined amount of said first output at which time said first endpoint for said current said first plasma step is deemed to have been reached.

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