Integrated circuit inductor with a magnetic core

• US 20030137387A1
• Filed: 02/03/2003
• Published: 07/24/2003
• Est. Priority Date: 03/10/2000
• Status: Active Grant

• Current Assignee: Round Rock Research LLC
• Original Assignee: Kie Y. Ahn, Leonard Forbes
• Inventors: Ahn, Kie Y., Forbes, Leonard
• Granted Patent: US 6,696,912 B2
• Time in Patent Office: Days
• US Class Current: 336/223
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 17/045 with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
• CPC Class Codes: H01F 41/046 structurally combined with ferromagnetic material
• CPC Class Codes: H01F 5/003 Printed circuit coils
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

An inductor is fabricated on a substrate having a top surface and a bottom surface. The inductor includes a plurality of holes extending through the substrate, wherein the plurality of holes interconnect the top surface and the bottom surface of the substrate. The inductor also includes a plurality of conductive posts formed in the plurality of holes and a plurality of conductive segments formed on the top surface and on the bottom surface that interconnect the conductive posts such that a continuous conductive coil is formed. The inductor also includes a magnetic core that occupies substantially the entire volume enclosed by the conductive coil.

Claims

1. A device comprising:

an integrated circuit formed on a substrate;

an inductor comprising a magnetic core embedded within said substrate and a conductive coil surrounding said magnetic core;

wherein said magnetic core comprises a porous region of said substrate treated with a ferromagnetic material; and

wherein said inductor is operably coupled to said integrated circuit.

2. The device of claim 1, wherein said integrated circuit comprises a memory circuit.

3. The device of claim 1, further comprising a processor coupled to said integrated circuit.

4. The device of claim 1, wherein said substrate comprises a semiconductor.

5. The device of claim 1, wherein said substrate comprises silicon.

6. The device of claim 1, wherein said substrate comprises silicon carbide.

7. The device of claim 1, wherein said substrate comprises germanium.

8. The device of claim 1, wherein said porous region is formed using an anodic etching process.

9. The device of claim 1, wherein said porous region is formed using a laser ablation process.

10. The device of claim 1, wherein said treatment with a ferromagnetic material comprises a chemical vapor deposition process.

11. The device of claim 1, wherein said magnetic core comprises a magnetic oxide.

12. The device of claim 1, wherein said ferromagnetic material comprises Permalloy.

13. The device of claim 1, wherein said conductive coil comprises copper.

14. The device of claim 1, wherein said conductive coil comprises gold.

15. The device of claim 1, wherein said conductive coil comprises a plurality of conductive posts extending through said substrate and interconnected by a plurality of conductive straps.

16. The device of claim 15, wherein each of said plurality of conductive posts and said plurality of conductive straps is fabricated from a different conductive material.

17. The device of claim 15, wherein each of said plurality of conductive posts and said plurality of conductive straps is fabricated from one of two different metals.

18. The device of claim 17, wherein a first one of said metals comprises copper and a second one of said metals comprises aluminum.

19. The device of claim 15, wherein said conductive posts are configured in two substantially parallel rows.

20. The device of claim 15, wherein said substrate has at least two substantially parallel surfaces, and wherein said conductive posts are substantially perpendicular to said surfaces.

21. The device of claim 15, wherein said conductive posts have circular cross-sections.

22. The device of claim 15, wherein said conductive posts are at least partially surrounded by an insulating material.

23. The device of claim 22, wherein said insulating material comprises polyimide.

24. The device of claim 1, wherein said inductor has an inductance of at least 1 nanohenry.

25. The device of claim 1, further comprising a passivation layer covering said conductive coil.

26. The device of claim 25, wherein said passivation layer is configured to electrically insulate said inductor and to protect said inductor from physical damage.