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Low voltage swing pad driver and receiver

  • US 20030137440A1
  • Filed: 07/16/2002
  • Published: 07/24/2003
  • Est. Priority Date: 01/24/2002
  • Status: Active Grant
First Claim
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1. A semiconductor system employing low swing pads, the semiconductor system comprising:

  • an integrated asynchronous digital subscriber line semiconductor chip; and

    wherein the integrated asynchronous digital subscriber line semiconductor chip comprises an analog front-end portion;

    the analog front-end portion comprises a transmitter portion and a receiver portion, the transmitter portion being communicatively coupled to a transmitter pad and the receiver portion being communicatively coupled to a receiver pad;

    the transmitter portion comprises a voltage to current converter that is operable to convert a voltage signal to a current signal and to push/pull the current signal to the transmitter pad; and

    the receiver portion comprises a current to voltage converter that is operable to receive a current signal at the receiver pad and to transform the received current signal to a voltage signal.

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