Reversed memory module socket, motherboard and test system including same, and method of modifying motherboard

• US 20030137862A1
• Filed: 01/13/2003
• Published: 07/24/2003
• Est. Priority Date: 07/12/2001
• Status: Active Grant

• Current Assignee: Saeed Momenpour, Steven J. Brunelle
• Original Assignee: Saeed Momenpour, Steven J. Brunelle
• Inventors: Momenpour, Saeed, Brunelle, Steven J.
• Granted Patent: US 6,693,817 B2
• Time in Patent Office: Days
• US Class Current: 365/63
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01R 12/721 cooperating directly with the edge of the rigid printed circuits
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 7/1431 Retention mechanisms for CPU modules

Abstract

A memory module socket having a transposed pinout allowing the socket to be mounted on the second, or reverse, surface of a motherboard and connected to circuit traces configured for mounting of a memory socket on the first, or processor, surface of the motherboard to correctly accommodate signals between the motherboard and the memory module. A motherboard having at least one memory socket mounted on the second, opposing surface enhancing access to the memory socket or sockets for insertion and removal of memory modules for testing the memory modules in multimotherboard test systems. A method of converting a conventional motherboard and memory socket assembly for such testing.

Claims

1. A system for testing memory modules comprising:

a plurality of motherboard assemblies, each motherboard assembly of the plurality including;

a substrate having a first surface, a second, opposing surface and a plurality of conductive traces;

a processor mounted on the first surface of the substrate and in communication with the conductive traces of the plurality; and

at least one memory socket mounted on the second, opposing surface of the substrate, the at least one memory socket including a cavity configured to receive a portion of a memory module therein and to operably couple the memory module with the processor through the conductive traces of the plurality; and

an input device operably coupled to each of the plurality of motherboard assemblies for providing electrical test signals to the memory module.

2. The system of claim 1, further comprising a frame supporting the plurality of motherboard assemblies thereon.

3. The system of claim 2, wherein each of the plurality of motherboard assemblies is mounted and oriented such that the cavity of the at least one memory socket is facing away from the frame.

4. The system of claim 3, wherein each of the plurality of motherboard assemblies is mounted vertically on the frame and the cavity of the at least one memory socket is oriented horizontally.

5. The system of claim 4, wherein the motherboard assemblies of the plurality are arranged in horizontal rows and vertical columns.

6. The system of claim 1, further including a monitoring device operably coupled to each of the plurality of motherboard assemblies for receiving signals therefrom.

7. The system of claim 1, further including an automated system configured for removing the memory module from and inserting the memory module into the at least one memory socket of the plurality of motherboard assemblies.