Electroless deposition apparatus
First Claim
1. A substrate processing apparatus, comprising:
- a substrate support having a substrate receiving surface; and
a fluid seal disposed at a perimeter portion of the substrate support and adapted to prevent a fluid from flowing on a backside of a substrate disposed on the substrate receiving surface of the substrate support.
1 Assignment
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Accused Products
Abstract
An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer. In one embodiment, the conductive material is deposited over the catalytic layer by electroless deposition. In another embodiment, the conductive material is deposited over the catalytic layer by electroless deposition followed by electroplating or followed by chemical vapor deposition. In still another embodiment, the conductive material is deposited over the catalytic layer by electroplating or by chemical vapor deposition.
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Citations
95 Claims
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1. A substrate processing apparatus, comprising:
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a substrate support having a substrate receiving surface; and
a fluid seal disposed at a perimeter portion of the substrate support and adapted to prevent a fluid from flowing on a backside of a substrate disposed on the substrate receiving surface of the substrate support. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A substrate processing apparatus, comprising:
an evaporation shield adapted to be positioned over a substrate disposed on a substrate support. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. A substrate processing chamber adapted for electroless deposition, comprising:
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a substrate support, comprising;
a substrate receiving surface;
a vacuum port;
vacuum grooves in communication with the vacuum port; and
a fluid seal at a perimeter portion of the substrate support; and
a fluid source;
a fluid input coupled to the fluid source and adapted to deliver a processing fluid to a substrate disposed on the substrate receiving surface; and
a drain. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75)
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- 59. The substrate processing chamber of 49, wherein the evaporation shield comprises a degassing membrane.
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76. A substrate processing chamber adapted for electroless deposition, comprising:
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a substrate support; and
a power supply coupled to the substrate support to apply a bias to a substrate structure of a substrate disposed on the substrate support. - View Dependent Claims (77, 78, 79, 80, 81)
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82. A semiconductor deposition system, comprising:
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one or more electroless deposition chambers adapted to deposit a catalytic layer; and
one or more electroless deposition chambers adapted to deposit a conductive material layer. - View Dependent Claims (83, 84, 85, 86, 87)
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88. A substrate processing chamber adapted for electroless deposition, comprising:
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a substrate support, and a transducer. - View Dependent Claims (89, 90)
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91. A multilevel chamber adapted for electroless deposition, comprising:
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a plurality of catch-up cups, each catch-up cup defining a region;
a movable substrate support adapted to move a substrate between each region defined by the catch-up cups;
a solution inlet adapted to provide a processing solution to one region; and
a rinse inlet adapted to provide a rinsing solution to another region. - View Dependent Claims (92, 93, 94, 95)
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Specification