Radiation emitting semiconductor component with luminescent conversion element
First Claim
Patent Images
1. A radiation emitting semiconductor component comprising:
- a base body defining an open interior recess, the recess further comprising walls defining a cup like molded portion wherein at least one semiconductor body and a luminescent conversion element are accommodated such that said luminescent conversion element defines a boundary surface between said cup like molded portion and a remainder of the open interior recess.
3 Assignments
0 Petitions
Accused Products
Abstract
The invention describes a radiation-emitting semiconductor component with a luminescent conversion element, at which the semiconductor body is placed in a recess of the base body. A cup-like area is molded inside of the recess around the semiconductor body, which contains the luminescent conversion element and coats the semiconductor body. The cup-like portion is formed as indentation inside of the recess or as annular border on the base of the recess.
-
Citations
25 Claims
-
1. A radiation emitting semiconductor component comprising:
- a base body defining an open interior recess, the recess further comprising walls defining a cup like molded portion wherein at least one semiconductor body and a luminescent conversion element are accommodated such that said luminescent conversion element defines a boundary surface between said cup like molded portion and a remainder of the open interior recess.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
21. A method for producing a radiation emitting semiconductor component with a:
luminescent conversion element, comprising the steps of;
forming a base body having a open interior recess and an imbedded conductor frame, coating the conductor frame with a compound, forming a chip service area on the conductor frame and recessing the area, forming a cup like portion on the area, the cup like portion defining an internal recess, installing a semiconductor body on the area and bonding the semiconductor body, filling the cup like portion with a luminescent conversion element such that a boundary surface of the luminescent conversion element separates the cup like portion internal recess from the open interior recess.
-
22. A method for the production of a radiation emitting semiconductor component with a luminescent conversion element, further comprising the steps of:
-
forming a base body having an open internal region and an imbedded conductor frame, the frame further comprising a chip service area, molding an annular border around the chip service area, the border defining a cup-like portion having an interior area, installing a semiconductor body on the chip service area and bonding the semiconductor body, and filling the interior area with a luminescent conversion element. - View Dependent Claims (23, 24, 25)
-
Specification