Stack type flip-chip package
First Claim
1. A stack type flip-chip package, comprising:
- a substrate board having a surface with a plurality of bump contacts and a plurality of line contacts thereon;
a first chip having a first active surface and a back surface, wherein the first active surface has a plurality of first bonding pads thereon;
a redistribution circuit on the back surface of the first chip, wherein the redistribution circuit layer has a plurality of bump pads and a plurality of line pads thereon;
a second chip having a second active surface with a plurality of second bonding pads thereon;
a plurality of bumps, wherein a portion of the bumps are disposed between the bump contacts and the first bonding pads, and a portion of the bumps are disposed between the bump pads and the second bonding pads;
a plurality of conductive wires for connecting between the line contacts and the line pads; and
a packaging material, used for enclosing the first chip, the second chip and the conductive wires.
1 Assignment
0 Petitions
Accused Products
Abstract
A stack type flip-chip package that utilizes a redistribution circuit on the back of a chip to serve as a bridge for connecting with other chips. The package includes at least a substrate, a first chip, a second chip, some underfill material and some packaging material. The substrate has a plurality of bump contacts and a plurality of line contacts thereon. The first chip has an active surface with a plurality of first bonding pads thereon. The back surface of the first chip has a redistribution circuit. The redistribution circuit has a plurality of bump pads and a plurality of line pads thereon. The second chip has an active surface with a plurality of second bonding pads thereon. Bumps are positioned between the bump contacts and the first bonding pads and between the bump pads and the second bonding pads. Conductive wires connect the line contacts and the line pads. The underfill material fills the space between the chip and the substrate and the gap between the first and the second chips. The packaging material encloses the chips and the conductive wires.
-
Citations
9 Claims
-
1. A stack type flip-chip package, comprising:
-
a substrate board having a surface with a plurality of bump contacts and a plurality of line contacts thereon;
a first chip having a first active surface and a back surface, wherein the first active surface has a plurality of first bonding pads thereon;
a redistribution circuit on the back surface of the first chip, wherein the redistribution circuit layer has a plurality of bump pads and a plurality of line pads thereon;
a second chip having a second active surface with a plurality of second bonding pads thereon;
a plurality of bumps, wherein a portion of the bumps are disposed between the bump contacts and the first bonding pads, and a portion of the bumps are disposed between the bump pads and the second bonding pads;
a plurality of conductive wires for connecting between the line contacts and the line pads; and
a packaging material, used for enclosing the first chip, the second chip and the conductive wires. - View Dependent Claims (2)
-
-
3. A stack type flip-chip package, comprising:
-
a substrate having a surface with a plurality of bump contacts and a plurality of line contacts thereon;
a first chip having a first active surface and a back surface, wherein the first active surface has a plurality of first bonding pads thereon;
a redistribution circuit on the back surface of the first chip, wherein the redistribution circuit layer has a plurality of bump pads and a plurality of line pads thereon;
a plurality of second chips each having a second active surface with a plurality of second bonding pads thereon;
a plurality of bumps, wherein a portion of the bumps are disposed between the bump contacts and the first bonding pads and a portion of the bumps are disposed between the bump pads and the second bonding pads;
a plurality of conductive wires for connecting between the line contacts and the line pads; and
a packaging material for enclosing the first chip, the second chips and the conductive wires. - View Dependent Claims (4)
-
-
5. A stack type flip-chip package, comprising:
-
a substrate having a surface with a plurality of bump contacts and a plurality of line contacts thereon;
a first chip having a first active surface and a back surface, wherein the first active surface has a plurality of first bonding pads thereon;
a first redistribution circuit on the back surface of the first chip, wherein the redistribution circuit layer has a plurality of bump pads and a plurality of line pads thereon;
a plurality of second chips each having a second active surface with a plurality of second bonding pads thereon;
a plurality of second redistribution circuits on the back surface of the second chips, wherein the second redistribution circuit layers each has a plurality of second bump pads and a plurality of second line pads thereon;
at least one third chip having a third active surface with a plurality of third bonding pads thereon;
a plurality of bumps disposed between the bump contacts and the first bonding pads, disposed between the second bonding pads and he first bump pads, disposed between the second bonding pads and the second bump pads and disposed between the second bump pads and the third bonding pads;
a plurality of conductive wires for connecting between the line contacts and the first line pads, connecting between the second line pads and the first line pads and connecting between neighboring second line pads; and
a packaging material for enclosing the first chip, the second chips, the third chip and the conductive wires. - View Dependent Claims (6)
-
-
7. A stack type flip-chip package, comprising:
-
a substrate having a surface with a plurality of bump contacts and a plurality of line contacts thereon;
a plurality of first chips each having a first active surface and a back surface, wherein the first active surface has a plurality of first bonding pads thereon and the first active surface faces the substrate surface;
a plurality of redistribution circuits on the back surface of the first chip, wherein each redistribution circuit layer has a plurality of bump pads and a plurality of line pads thereon;
a plurality of second chips each having a second active surface with a plurality of second bonding pads thereon, wherein the active surface of the second chip faces the substrate surface;
a plurality of bumps, disposed between the bump contacts and the first bonding pads, disposed between the first bonding pads and the bump pads, and disposed between the second bonding pads and the bump pads;
a plurality of conductive wires for connecting between the line contacts and the line pads and connecting between neighboring first line pads; and
a packaging material for enclosing the first chips, the second chips and the conductive wires. - View Dependent Claims (8)
-
-
9. A chip having a redistribution circuit on its back surface, comprising:
-
a chip having a first active surface wit a plurality of first bonding pads thereon; and
a redistribution circuit on the back surface of the chip, wherein the redistribution circuit has a plurality of bump pads and a plurality of line pads thereon.
-
Specification