Encapsulation of organic electronic devices using adsorbent loaded adhesives

• US 20030143423A1
• Filed: 01/31/2002
• Published: 07/31/2003
• Est. Priority Date: 01/31/2002
• Status: Active Grant

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: McCormick, Fred B., Haase, Michael A., Baude, Paul F.
• Granted Patent: US 6,936,131 B2
• Time in Patent Office: Days
• US Class Current: 428/690
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/846 comprising getter material or desiccants
• CPC Class Codes: Y10S 428/917 Electroluminescent
• CPC Class Codes: Y10T 428/23 Sheet including cover or casing
• CPC Class Codes: Y10T 428/239 Complete cover or casing
• CPC Class Codes: Y10T 428/2852 Adhesive compositions

Abstract

Disclosed herein are organic electronic devices that are encapsulated at least in part by adsorbent-loaded transfer adhesives. The adsorbent material may be a dessicant and/or a getterer. The adsorbent-loaded transfer adhesive may form a gasket around the periphery of the device, or may cover the entire device and its periphery. An encapsulating lid covers the device.

Claims

1. A method of encapsulating an organic electronic device comprising:

providing an adsorbent loaded transfer adhesive containing one or both of a dessicant and a gettering material,

applying the transfer adhesive such that it will form a gasket around the entire periphery of an organic electronic device situated on a substrate or will cover the entire device, and

applying a lid over the organic electronic device and its periphery such that the lid is adhered to the substrate by the adhesive, thereby encapsulating the device.

2. The method of claim 1 wherein the transfer adhesive is first applied to the lid instead of the substrate or device.

3. The method of claim 1 wherein the transfer adhesive is made from a material selected from the group comprising hot melt adhesives, pressure sensitive adhesives, thermoset adhesives, UV curable adhesives, curable pressure sensitive adhesives, and combinations thereof.

4. The method of claim 1 further comprising curing the adhesive.

5. The method of claim 1 wherein the organic electronic device is on a rigid substrate.

6. The method of claim 1 wherein the organic electronic device is on a flexible substrate.

7. The method of claim 6 wherein the flexible substrate is a continuous web.

8. The method of claim 1 wherein the device is an organic light emitting diode.

9. The method of claim 1 further comprising applying a high barrier adhesive around the entire periphery of the portion of transfer adhesive that is adhering the lid to the substrate.

10. The method of claim 9 wherein the high barrier adhesive is selected from the group comprising two part epoxies, solvent based adhesives, one part curable adhesives, and UV curable adhesives.

11. The method of claim 9 wherein the transfer adhesive comprises an adhesive that is permeable to one or both of air and water vapor.

12. An article comprising an encapsulated organic electronic device comprising:

an organic electronic device on a substrate,

an adsorbent loaded transfer adhesive that forms a perimeter seal around the device and optionally further forms a layer covering the device, the adsorbent loaded adhesive containing one or both of a dessicant and a gettering material, and

a lid over the device, wherein the transfer adhesive adheres the lid to the substrate.

13. The article of claim 12 wherein the transfer adhesive is made from a material selected from the group comprising hot melt adhesives, pressure sensitive adhesives, thermoset adhesives, UV curable adhesives, curable pressure sensitive adhesives, and combinations thereof.

14. The article of claim 12 wherein the lid is selected from the group comprising stamped metal foils, glass plates, plastic circuit boards, ceramic cans, machined metal cans, and semiconductor substrates.

15. The article of claim 12 wherein the organic electronic device is on a rigid substrate.

16. The article of claim 12 wherein the organic electronic device is on a flexible substrate.

17. The article of claim 12 wherein the device is an organic light emitting diode.

18. The article of claim 12 further comprising a high barrier adhesive layer around the entire periphery of the portion of transfer adhesivethat is adhering the lid to the substrate.

19. The article of claim 18 wherein the transfer adhesive comprises an adhesive that is permeable to one or both of air and water vapor.

20. The article of claim 18 wherein the high barrier adhesive is selected from the group comprising two part epoxies, solvent based adhesives, one part curable adhesives, and UV curable adhesives.