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Encapsulated integrated circuit package and method of manufacturing an integrated circuit package

  • US 20030143781A1
  • Filed: 01/31/2002
  • Published: 07/31/2003
  • Est. Priority Date: 01/31/2002
  • Status: Active Grant
First Claim
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1. A method of manufacturing an integrated circuit package, comprising:

  • providing a substrate comprising;

    a first surface, a second surface opposite said first surface, a cavity through said substrate between said first and second surfaces, and a conductive via extending through said substrate and electrically connecting said first surface of said substrate with said second surface of said substrate;

    applying a strip to said second surface of said substrate;

    mounting a semiconductor die on said strip, at least a portion of said semiconductor die being disposed inside said cavity;

    encapsulating in a molding material at least a portion of said first surface of said substrate; and

    removing said strip from said substrate.

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