System and method for repairing flex circuits

• US 20030146018A1
• Filed: 02/01/2002
• Published: 08/07/2003
• Est. Priority Date: 02/01/2002
• Status: Active Grant

• Current Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Original Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Inventors: Belke, Robert Edward, Schweitzer, Charles Frederick, Shi, Zhong-You, Baker, Jay D., Fuks, Stephen Edward, Foster, Raymond Eric, Sinkunas, Peter Joseph
• Granted Patent: US 6,830,176 B2
• Time in Patent Office: Days
• US Class Current: 174/254
• CPC Class Codes: H05K 3/225 Correcting or repairing of printed circuits H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence
• CPC Class Codes: H05K 3/363 by soldering

Abstract

A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.

Claims

1. A repairable electrical system for conducting electrical signals to and from electronic devices, the system comprising:

a flexible circuit substrate having a cut zone and a repair zone;

at least one electrical conductor supported by the flexible circuit substrate, wherein the electrical conductor carries the electrical signals; and

a repair patch for electrically interconnecting at least two repair zones.

2. The system of claim 1 further comprising a solder pre-form disposed on the conductor.

3. The system of claim 2 wherein the solder pre-form is disposed within the repair zone.

4. The system of claim 1 wherein the flexible circuit substrate includes a plurality of conductors.

5. The system of claim 1 wherein the flexible circuit substrate includes a plurality of alignment apertures for aligning a portion of the flexible circuit substrate with another portion of the flexible circuit substrate to ensure alignment and positioning of conductors disposed thereon.

6. The system of claim 1 wherein the conductors are exposed within the repair zones.

7. The system of claim 2 wherein the solder pre-form is a eutectic solder composition having 63% tin and 37% lead.

8. The system of claim 2 wherein the solder pre-form is comprised of a lead free solder formulation.

9. The system of claim 1 wherein the repairable patch includes multiple repair zones for mating with and electrically interconnecting to repair zones on the flexible circuit substrate.

10. The system of claim 1 wherein the repair patch is electrically interconnected to the flexible circuit substrate using a diode laser.

11. The system of claim 1 wherein a solder paste is applied transversely across the electrical conductors.

12. A method for repairing flexible circuits having a flexible substrate, the method comprising:

locating a repair zone;

cutting along a cut line located within the repair zone;

positioning a repair patch within the repair zone on the flexible substrate;

applying pressure to the repair zone; and

soldering a first portion of the flexible substrate to a second portion of the flexible substrate within the repair zone to form an electrically conductive joint.

13. The method of claim 12 wherein applying pressure further comprises actuating a hold down fixture restrict movement of the flexible substrate.

14. The method of claim 12 further comprising applying a solder pre-form transversally across the flexible substrate.

15. The method of claim 12 further comprising applying a solder paste transversally across the flexible substrate.

16. The method of claim 12 further comprising applying a solder core wire transversally across the flexible substrate.

17. The method of claim 12 wherein soldering further comprises emitting a laser light to reflow solder to electrically interconnect the first and second portions.

18. A method for repairing flexible circuits having a flexible substrate, the method comprising:

locating a repair zone;

cutting along a cut line located within the repair zone;

positioning a repair patch within the repair zone on the flexible substrate;

applying pressure to the repair zone; and

emitting a laser light beam to reflow solder to form an electrically conductive joint, within the repair zone, between a first portion of the flexible substrate and a second portion of the flexible substrate.

19. The method of claim 18 wherein applying pressure further comprises actuating a hold down fixture restrict movement of the flexible substrate.

20. The method of claim 18 further comprising applying a solder pre-form transversally across the flexible substrate.

21. The method of claim 18 further comprising applying a solder paste transversally across the flexible substrate.

22. The method of claim 18 further comprising applying a solder core wire transversally across the flexible substrate.