Elastomer interposer for grid array packages and method of manufacturing the same
First Claim
1. An elastomer interposer, employed between a package and a printed circuit board, comprising:
- an elastomer, having a first surface and a second surface;
a plurality of conductive wires, arranged inside the elastomer at a certain interval and tilted toward the second surface with an inclined angle;
a plurality of first Cu pads, formed on the first surface at a space and electrically connected to the corresponding conductive wires;
a plurality of second Cu pads, formed on the second surface at the space and electrically connected to the corresponding conductive wires;
a plurality of first solder resistant blocks, having openings surrounding the first Cu pads, are on the first surface;
a plurality of second solder resistant blocks, having openings surrounding the second Cu pads, are on the second surface;
a plurality of first Ni/Au plated pads, formed on outer surface of the first Cu pads; and
a plurality of second Ni/Au plated pads, formed on outer surface of the second Cu pads.
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Accused Products
Abstract
An elastomer interposer employed between a package and a printed circuit board and the method of manufacturing the same are disclosed. The elastomer interposer includes an elastomer, a plurality of conductive wires, Cu pads, solder resistant blocks and Ni/Au plated pads. The elastomer has two contact surfaces. The conductive wires are arranged inside the elastomer at a certain interval and tilted toward one of the contact surfaces with an inclined angle. The Cu pads are formed on both of the surfaces at a space, and electrically connected to the corresponding conductive wires. Also, the Ni/Au plated pads are formed over the Cu pads.
63 Citations
35 Claims
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1. An elastomer interposer, employed between a package and a printed circuit board, comprising:
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an elastomer, having a first surface and a second surface;
a plurality of conductive wires, arranged inside the elastomer at a certain interval and tilted toward the second surface with an inclined angle;
a plurality of first Cu pads, formed on the first surface at a space and electrically connected to the corresponding conductive wires;
a plurality of second Cu pads, formed on the second surface at the space and electrically connected to the corresponding conductive wires;
a plurality of first solder resistant blocks, having openings surrounding the first Cu pads, are on the first surface;
a plurality of second solder resistant blocks, having openings surrounding the second Cu pads, are on the second surface;
a plurality of first Ni/Au plated pads, formed on outer surface of the first Cu pads; and
a plurality of second Ni/Au plated pads, formed on outer surface of the second Cu pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of manufacturing elastomer interposer employed between a package and a printed circuit board, comprising the steps of:
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providing an elastomer, the elastomer having a first surface, a second surface and a plurality of conductive wires, which the conductive wires are arranged inside the elastomer at a certain interval and tilted toward the second surface with an inclined angle;
etching the elastomer to expose two ends of the conductive wires protruding from the first surface and the second surface, forming a coated Cu layer to cover the elastomer;
patterning the coated Cu layer by photolithography, to form a plurality of first Cu pads and second Cu pads respectively on the first surface and the second surface at a space, and the first Cu pads electrically connected to the second Cu pads by the corresponding conductive wires between them;
forming a plurality of first solder resistant blocks and second solder resistant blocks respectively on the first surface and the second surface, which the first solder resistant blocks have openings surrounding first Cu pads on the first surface, and the second solder resistant blocks have openings surrounding the second Cu pads on the second surface; and
forming a plurality of first Ni/Au plated pads over the outer surface of the first Cu pads, and a plurality of second Ni/Au plated pads over the outer surface of the second Cu pads. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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35. A method of manufacturing elastomer interposer, comprising the steps of:
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providing an elastomer, the elastomer having a first surface, a second surface and a plurality of conductive wires, which the conductive wires are arranged inside the elastomer at a certain interval and tilted toward the second surface with an inclined angle;
forming a plurality of first patterned photo resist (PR) blocks and second patterned photo resist (PR) blocks respectively on the first surface and the second surface by photolithography, which the first and the second patternedPR blocks are kept in a space after exposure and development;
etching the elastomer to expose two ends of the conductive wires from the first surface and the second surface;
forming a coated Cu layer to cover the elastomer surface and the PR blocks;
removing the first and the second patterned-PR blocks and lifting off the coated Cu layer thereon, to form a plurality of first Cu pads and second Cu pads respectively on the first surface and the second surface at a space, and the first Cu pads electrically connected to the second Cu pads through the corresponding conductive wires;
forming a plurality of first solder resistant blocks and second solder resistant blocks respectively on the first surface and the second surface, which the first solder resistant blocks have openings surrounding the first Cu pads on the first surface, and the second solder resistant blocks have openings surrounding the second Cu pads on the second surface; and
forming a plurality of first Ni/Au plated pads over the outer surface of the first Cu pads and a plurality of second Ni/Au plated pads over the outer surface of the second Cu pads.
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Specification