Wafer interposer assembly and system for building same
First Claim
Patent Images
1. A wafer interposer assembly comprising:
- a semiconductor wafer having a die;
a redistribution layer (RDL) pad electrically connected to the die;
an epoxy layer deposited on the surface of the redistribution layer pad and the die, the epoxy layer having an opening therethrough about the redistribution layer pad; and
an interposer pad positioned in the opening in electrical contact with the redistribution layer pad.
6 Assignments
0 Petitions
Accused Products
Abstract
A wafer interposer assembly and a system for building the same are disclosed. The wafer interposer assembly includes a semiconductor wafer (10) having a die (11) and a redistribution layer pad (13) electrically connected to the die (11). An epoxy layer (20) is deposited on the surface of the redistribution layer pad (13) and the die (11). An interposer pad (50) is positioned in an opening (40) in the epoxy layer (20) in electrical contact with the redistribution layer pad (13).
-
Citations
30 Claims
-
1. A wafer interposer assembly comprising:
-
a semiconductor wafer having a die;
a redistribution layer (RDL) pad electrically connected to the die;
an epoxy layer deposited on the surface of the redistribution layer pad and the die, the epoxy layer having an opening therethrough about the redistribution layer pad; and
an interposer pad positioned in the opening in electrical contact with the redistribution layer pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A wafer interposer assembly comprising:
-
a semiconductor wafer having a plurality of die;
a plurality of redistribution layer pads electrically connected to each die, the redistribution layer pads including a material reflective to laser frequencies;
an epoxy layer deposited on the surface of the redistribution layer pads and the dies, the epoxy layer having a plurality of openings therethrough corresponding to the redistribution layer pads, the epoxy layer having a flat surface that is trimmed to a height of at least the length of the redistribution layer pads; and
a plurality of interposer pads positioned in the openings in electrical contact with the redistribution layer pads. - View Dependent Claims (17, 18)
-
-
19. A system for building a wafer interposer assembly, comprising:
-
a depositor that deposits an epoxy layer onto the surface of a semiconductor wafer having a plurality of die and a plurality of redistribution layer pads electrically connected to each die;
a laser that operates relative to the semiconductor wafer to trim the epoxy layer to a flat surface and controlled height and to bore a plurality of openings in alignment with the redistribution layer pads through the epoxy layer; and
a screener that screens an interposer pad into the openings and into electrical contact with the redistribution layer pads. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
-
-
30. The system as recited in 29, wherein the laser adjusts the height of the epoxy coat.
Specification