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Wafer interposer assembly and system for building same

  • US 20030148108A1
  • Filed: 02/24/2003
  • Published: 08/07/2003
  • Est. Priority Date: 12/15/2000
  • Status: Active Grant
First Claim
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1. A wafer interposer assembly comprising:

  • a semiconductor wafer having a die;

    a redistribution layer (RDL) pad electrically connected to the die;

    an epoxy layer deposited on the surface of the redistribution layer pad and the die, the epoxy layer having an opening therethrough about the redistribution layer pad; and

    an interposer pad positioned in the opening in electrical contact with the redistribution layer pad.

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