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Method for wet etching of high k thin film at low temperature

  • US 20030148625A1
  • Filed: 03/18/2002
  • Published: 08/07/2003
  • Est. Priority Date: 02/01/2002
  • Status: Active Grant
First Claim
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1. A method of high dielectric film wet etching, comprising the steps of:

  • Preparing a wafer having deposited a high dielectric film on silicon dioxide or poly-silicon;

    Etching the high dielectric film with an etching agent by wet etching;

    Rinsing the wafer with de-ionized water;

    Drying the wafer;

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