Thermosetting polyimide resin composition and process for producing polyimide resin

• US 20030149222A1
• Filed: 01/23/2003
• Published: 08/07/2003
• Est. Priority Date: 01/31/2002
• Status: Active Grant

• Current Assignee: Dainippon Ink and Chemicals Incorporated
• Original Assignee: Dainippon Ink and Chemicals Incorporated
• Inventors: Yamashina, Yohzoh, Ichinose, Eiju, Ishikawa, Hidenobu
• Granted Patent: US 6,887,967 B2
• Time in Patent Office: Days
• US Class Current: 528/170
• CPC Class Codes: C08G 18/345 having three carboxylic acid groups
• CPC Class Codes: C08G 18/6208 Hydrogenated polymers of conjugated dienes
• CPC Class Codes: C08G 18/69 Polymers of conjugated dienes hydrogenated polymers of conjugated dienes C08G18/6208
• CPC Class Codes: C08G 18/792 formed by oligomerisation of aliphatic and/or cycloaliphatic isocyanates or isothiocyanates
• CPC Class Codes: C08L 2666/20 Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
• CPC Class Codes: C08L 2666/22 Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 79/08 Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 3/4676 Single layer compositions

Abstract

A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y). The polyimide resin is obtained by reacting a prepolymer (A) having an isocyanate group at the end, which is obtained by reacting a polyisocyanate compound (a1) with a polyol compound (a2) having a linear hydrocarbon structure in which a number-average molecular weight of a linear hydrocarbon structure is from 300 to 6,000, with an anhydride (B) of polycarboxylic acid having three or more carboxyl groups in an organic solvent.

Claims

1. A thermosetting polyimide resin composition comprising a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).

2. The thermosetting polyimide resin composition according to claim 1, wherein the polyimide resin (X) is a polyimide resin which has a carboxyl group, a linear hydrocarbon structure having a number-average molecular weight of 700 to 4,500, a urethane bond, an imide ring, an isocyanurate ring and a cyclic aliphatic structure.

3. The thermosetting polyimide resin composition according to claim 2, wherein the polyimide resin (X) is a polyimide resin which has a structural unit represented by the following general formula (1) and a structural unit represented by the following general formula (2) and also has one or more kinds of the end structures represented by the following general formulas (3), (4) and (5).

4. The thermosetting polyimide resin composition according to claim 3, wherein the polyimide resin (X) is a polyimide resin in which an acid value is from 20 to 250, a number-average molecular weight of a linear hydrocarbon structure moiety is from 700 to 4,500, the content of the linear hydrocarbon structure moiety is from 20 to 40% by weight, a concentration of an isocyanurate ring is from 0.3 to 1.2 mmol/g, a number-average molecular weight is from 2,000 to 30,000, and a weight-average molecular weight is from 3,000 to 100, 000.

5. The thermosetting polyimide resin composition according to claim 1, wherein the polyimide resin (X) is a polyimide resin obtained by reacting a prepolymer (A) having an isocyanate group at the end, which is obtained by reacting a polyisocyanate compound (a1) with a polyol compound (a2) having a linear hydrocarbon structure in which a number-average molecular weight of a linear hydrocarbon structure is from 300 to 6,000, with an anhydride (B) of polycarboxylic acid having three or more carboxyl groups in an organic solvent.

6. The thermosetting polyimide resin composition according to claim 5, wherein the polyimide resin (X) is a polyimide resin obtained by using polyisocyanate having an isocyanurate ring derived from a cyclic aliphatic diisocyanate as the polyisocyanate compound (a1) and using polyol having 1.5 to 3 hydroxyl groups on average in which a number-average molecular weight of a linear hydrocarbon structure moiety is from 700 to 4,500 as the polyol compound (a2) in an amount of 20 to 40 parts by weight based on 100 parts by weight of the total of the polyisocyanate compound (a1), the polyol compound (a2) and the anhydride (B) of polycarboxylic acid having three or more carboxyl groups.

7. The thermosetting polyimide resin composition according to any one of claims 1 to 6, wherein the polyimide resin (X) is a polyimide resin having an acid value of 20 to 250 and a weight ratio of the polyimide resin (X) to the epoxy resin (Y), (X)/(Y), is from 1 to 10.

8. The thermosetting polyimide resin composition according to any one of claims 1 to 6, which further comprises a compound (Z) having two or more phenolic hydroxyl groups.

9. The thermosetting polyimide resin composition according to claim 8, wherein the content of the polyimide resin (X) is from 40 to 85% by weight, the content of the epoxy resin (Y) is from 10 to 40% by weight and the content of the compound (Z) having two or more phenolic hydroxyl groups is from 5 to 20% by weight based on 100% by weight of the total of the polyimide resin (X), the epoxy resin (Y) and the compound (Z) having two or more phenolic hydroxyl groups.

10. A process for producing a polyimide resin, which comprises reacting a prepolymer (A) having an isocyanate group at the end, which is obtained by reacting a polyisocyanate compound (a1) with a polyol compound (a2) having a linear hydrocarbon structure moiety in which a number-average molecular weight of a linear hydrocarbon structure is from 300 to 6,000, with an anhydride (B) of polycarboxylic acid having three or more carboxyl groups in an organic solvent.

11. The process for producing a polyimide resin according to claim 10, wherein the polyol compound (a2) is polyol having 1.5 to 3 hydroxyl groups on average in which a number-average molecular weight of a linear hydrocarbon structure moiety is from 700 to 4,500.

12. The process for producing a polyimide resin according to claim 10, wherein the polyol compound (a2) comprises polybutadiene polyol and/or hydrogenated polybutadiene polyol which have 1.5 to 3 hydroxyl groups on average in which a number-average molecular weight of a linear hydrocarbon structure moiety is from 700 to 4,500.

13. The process for producing a polyimide resin according to claim 11, wherein the polyol compound (a2) is used in an amount of 20 to 40 parts by weight based on 100 parts by weight of the total of the polyisocyanate compound (a1), the polyol compound (a2) and an anhydride (B) of polycarboxylic acid having three or more carboxyl groups.

14. The process for producing a polyimide resin according to any one of claims 10 to 13, wherein the polyisocyanate. compound (a1) is polyisocyanate having an isocyanurate ring derived from an aliphatic diisocyanate.

15. The process for producing a polyimide resin according to any one of claims 10 to 13, wherein the polyisocyanate compound (a1) is polyisocyanate having an isocyanurate ring derived from a cyclic aliphatic diisocyanate in which the content of the isocyanate group is from 10 to 30% by weight.

16. The process for producing a polyimide resin according to any one of claims 10 to 13, wherein the organic solvent is an aprotic polar organic solvent.

17. The process for producing a polyimide resin according to claim 16, wherein the aprotic polar organic solvent is an ether solvent.