Laser processing device and laser processing method

• US 20030150842A1
• Filed: 10/16/2002
• Published: 08/14/2003
• Est. Priority Date: 02/19/2001
• Status: Active Grant

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Inventors: Mikame, Kazuhisa
• Granted Patent: US 6,856,634 B2
• Time in Patent Office: Days
• US Class Current: 219/121.6
• CPC Class Codes: B23K 2101/35 Surface treated articles
• CPC Class Codes: B23K 2103/04 Steel or steel alloys
• CPC Class Codes: B23K 2103/08 Non-ferrous metals or alloys
• CPC Class Codes: B23K 2103/16 Composite materials , e.g. fibre reinforced
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/0604 by a combination of beams
• CPC Class Codes: B23K 26/0613 having a common axis B23K26/0619 takes precedence
• CPC Class Codes: B23K 26/073 Shaping the laser spot
• CPC Class Codes: B23K 26/244 Overlap seam welding
• CPC Class Codes: B23K 26/32 taking account of the properties of the material involved

Abstract

The present invention provides a laser machining apparatus in a simple structure which can properly carry out laser machining by irradiating a laser beam easily at a predetermined energy density to a machining-target site in a predetermined range, and in addition, which can be downsized and can be kept with easy maintenance and has enhanced durability.

The apparatus includes: a semiconductor stack 1 comprising a plurality of semiconductor laser elements; and a controller for controlling emission of the laser beam emitted from each of the semiconductor laser elements. The semiconductor stack 1 is divided into a plurality of blocks B11, B12, B13, B14 in correspondence with the machining-target site of a work piece.

The controller controls the irradiation of the laser beam from each of the blocks B11, B12, B13, B14 to be changeable in terms of time.

Claims

1. A laser machining apparatus characterized by including:

a semiconductor stack comprising a plurality of semiconductor laser elements and divided into a plurality of blocks; and

a controller for controlling an irradiation output of a laser beam from each of the blocks so as to be changeable in terms of time.

2. A laser machining apparatus according to claim 1, wherein the semiconductor stack is divided into a block which continuously irradiates a laser beam and a block of which irradiation output of laser beam is changed in terms of time.

3. A laser machining apparatus according to claim 2, wherein the blocks of which respective irradiation output of laser beam is changed in terms of time are arranged around the block which continuously irradiates a laser beam.

4. A laser machining apparatus according to claim 2, wherein the block which continuously irradiates a laser beam is disposed in front and at rear in a machining direction, respectively.

5. A laser machining method characterized in that a semiconductor stack comprising a plurality of semiconductor laser elements is divided into a plurality of blocks and an irradiation output of a laser beam emitted from each of the blocks is changed in terms of time.

6. A laser machining method according to claim 5, wherein the irradiation output of the laser beam emitted from each of the blocks is sequentially changed between the adjacent blocks.

7. A laser machining method according to claim 6, wherein the irradiation output of a block which irradiates a laser beam to the side edge in the machining direction is set high.

8. A laser beam machining method according to claim 6, wherein the irradiation time duration of a block which irradiates a laser beam to the side edge in the machining direction is set long.

9. A laser beam machining method according to claim 5, wherein a block which continuously irradiates a laser beam is disposed in front and at rear in the machining direction, respectively, and the irradiation output of the block disposed at the rear in the machining direction is set low.

10. A laser machining method according to any one of claims 5 to 9, wherein the laser machining is buildup machining where a buildup material is build up onto a base material.

11. A laser machining method according to any one of claims 5 to 9, wherein the laser machining is welding where sheet-like materials each including a plated base material are welded with each other.

12. A laser machining method according to claim 11, wherein the sheet-like material is an aluminum plated steel sheet.

13. A laser machining method according to claim 11, wherein the sheet-like material is a zinc plated steel sheet.