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Laser processing device and laser processing method

  • US 20030150842A1
  • Filed: 10/16/2002
  • Published: 08/14/2003
  • Est. Priority Date: 02/19/2001
  • Status: Active Grant
First Claim
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1. A laser machining apparatus characterized by including:

  • a semiconductor stack comprising a plurality of semiconductor laser elements and divided into a plurality of blocks; and

    a controller for controlling an irradiation output of a laser beam from each of the blocks so as to be changeable in terms of time.

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