Semiconductor device

• US 20030151128A1
• Filed: 08/07/2002
• Published: 08/14/2003
• Est. Priority Date: 02/14/2002
• Status: Active Grant

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Kawaguchi, Muneyoshi
• Granted Patent: US 6,703,699 B2
• Time in Patent Office: Days
• US Class Current: 257/691
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

The present invention has an object to provide a more compact semiconductor device that can be assembled with reduced parts and tasks. The semiconductor device includes a housing having a top and bottom surfaces. Surrounded within the housing is an insulating substrate with metal layers formed on both sides thereof. Also a semiconductor chip is mounted on one of the metal layer of the insulating substrate. A terminal connector extends along the top surface of the housing and is bent towards the bottom surface thereof for supplying power to the semiconductor chip. The housing has a housing through-hole extending from the top surface to the bottom surface through the housing, and the terminal connector has a terminal through-hole which are aligned with and formed coaxially with the housing through-hole.

Claims

1. A semiconductor device, comprising:

a housing having a top and bottom surfaces;

an insulating substrate with metal layers formed on both sides thereof, said insulating substrate surrounded within said housing;

a semiconductor chip mounted on one of the metal layer of said insulating substrate; and

a terminal connector extending along the top surface of the housing and being bent towards the bottom surface thereof for supplying said semiconductor chip with power;

wherein said housing has a housing through-hole extending from the top surface to the bottom surface through the housing, and wherein said terminal connector has a terminal through-hole which are aligned with and formed coaxially with the housing through-hole.

2. The semiconductor device according to claim 1, further comprising:

a supporting metal plate fixed on the other one of the metal layer of said insulating substrate; and

wherein said supporting metal plate has a plate through-hole which are aligned with and formed coaxially with the housing through-hole.

3. The semiconductor device according to claim 1,

wherein the other one of the metal layer of said insulating substrate is secured directly with said housing at the bottom surface thereof.

4. The semiconductor device according to claim 1, further comprising:

a conducting member connected with said terminal connector, having a conductor through-hole which are aligned with and formed coaxially with the housing through-hole;

a metal fastening member extending through the conductor through-hole, the terminal through-hole, and the conductor through-hole; and

a insulating spacer for electrically isolating said metal fastening member from said conducting member.

5. The semiconductor device according to claim 1, further comprising:

a conducting member connected with said terminal connector, having a conductor through-hole which are aligned with and formed coaxially with the housing through-hole;

a metal fastening member extending through the conductor through-hole, the terminal through-hole, and the conductor through-hole;

a receiving member made of insulating material for receiving said metal fastening member; and

a radiator made of metal embedding a receiving member made of insulating material therein for receiving said metal fastening member.

6. The semiconductor device according to claim 2, further comprising:

a conducting member connected with said terminal connector, having a conductor through-hole which are aligned with and formed coaxially with the housing through-hole; and

a fastening member made of insulating material extending through the conductor through-hole, the terminal through-hole, and the conductor through-hole.