Light emitting diode

• US 20030151361A1
• Filed: 02/10/2003
• Published: 08/14/2003
• Est. Priority Date: 02/08/2002
• Status: Active Grant

• Current Assignee: Citizen Electronics Company Limited
• Original Assignee: Citizen Electronics Company Limited
• Inventors: Ishizaka, Mitsunori
• Granted Patent: US 7,193,365 B2
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

Disclosed is a light emitting diode capable of accomplishing enlargement of emitted range of light and equalization of brightness of emitted light.

The light emitting diode comprises a substrate (22), electrodes (23a, 23b), a light emitting element (24) mounted on the substrate (22) and connected electrically with the electrodes (23a, 23b), a resinous cover (26) for sealing the light emitting element (24) and electrodes (23a, 23b) and an uneven shaped light scattering part (30) provided on a surface of the cover.

Claims

1. A light emitting diode comprising:

a substrate;

a pair of electrodes provided on said substrate;

a light emitting element mounted on said substrate and connected electrically with said the electrodes;

a cover mounted on said substrate for sealing said electrodes and light emitting element; and

a light scattering part provided on at least one surface of said cover,

wherein said light scattering part is formed from an uneven configuration.

2. A light emitting diode according to claim 1, wherein said cover is formed from a resin.

3. A light emitting diode according to claim 1, wherein said light scattering part is formed from a plurality of concave and convex portions provided on a surface of said cover.

4. A light emitting diode according to claim 3, wherein said concave and convex portions are minute in size.

5. A light emitting diode according to claim 1, wherein said light scattering part is composed of a film attached on a surface of said cover and concave and convex portions formed on said film.

6. A light emitting diode according to claim 1, wherein said light scattering part is composed of a plurality of concave and convex portions formed on a surface of the cover by mean of printing.

7. A light emitting diode according to claim 1, wherein said cover is made of formable material and said light scattering part is composed of concave and convex portions formed on a surface of the cover when said cover is formed.

8. A light emitting diode according to claim 1, wherein said concave and convex portions of said light scattering part are formed by means of machining a surface of said cover.

9. A light emitting diode according to claim 1, wherein said light scattering part is formed on a surface of the cover facing to a light emitting projected surface of said light emitting element.

10. A light emitting diode according to claim 1, wherein depth and oblique angle of circumferential walls of each of their concave and convex portions are mutually un-uniform.

11. A light emitting diode according to claim 1, wherein said light scattering part is formed by etching carried out on a surface of said cover.

12. A light emitting diode according to claim 1, wherein said light scattering part is formed from a frosted glass attached on a surface of said cover.