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LATCHING MICRO MAGNETIC RELAY PACKAGES AND METHODS OF PACKAGING

  • US 20030151479A1
  • Filed: 04/19/2002
  • Published: 08/14/2003
  • Est. Priority Date: 09/17/2001
  • Status: Active Grant
First Claim
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1. A method of forming a package and sealing a MEMS device in the package comprising the steps of:

  • providing a supporting substrate with a surface;

    forming at least one contact for the MEMS device on the surface of the supporting substrate and providing an external connection to the contact;

    forming a cantilever on the surface of the supporting substrate, the cantilever being positioned to come into electrical engagement with the contact in one orientation;

    depositing a seal ring on the surface of the supporting substrate circumferentially around the contact and the cantilever;

    forming a cap member with a cavity and a continuous edge circumferentially around the cavity, the cavity being designed to receive the cantilever and contact therein;

    depositing a seal ring on the continuous edge of the cap member; and

    sealingly engaging the seal ring on the continuous edge of the cap member to the seal ring on the surface of the supporting substrate.

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