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Thermal management materials having a phase change dispersion

  • US 20030152764A1
  • Filed: 10/21/2002
  • Published: 08/14/2003
  • Est. Priority Date: 02/06/2002
  • Status: Active Grant
First Claim
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1. A thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween, said interface comprising a thermally-conductive compound formed into a layer which is conformable between the first and second heat transfer surface, said compound comprising an admixture of:

  • (a) a polymeric constituent forming a continuous matrix in said layer; and

    (b) a dispersed constituent forming discrete domains within said matrix, said domains being form-stable at normal room temperature in a first domain phase and conformable between the first and second heat transfer surface in a second domain phase, and said domains having a domain transition temperature above normal room temperature from said first domain phase to said second domain phase.

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