Method for fabricating a structure for a microelectromechanical systems (MEMS) device
First Claim
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1. A microfabrication process for fabricating a microelectromechanical systems device, comprising:
- depositing one or a stack of layers on a substrate;
patterning said one or a stack of layers;
depositing a middle layer on said one or a stack of layers; and
patterning the middle layer using said one or a stack of layers as a photomask.
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Abstract
The invention provides a microfabrication process which may be used to manufacture a MEMS device. The process comprises depositing one or a stack of layers on a base layer, said one layer or an uppermost layer in said stack of layers being a sacrificial layer; patterning said one or a stack of layers to provide at least one aperture therethrough through which said base layer is exposed; depositing a photosensitive layer over said one or a stack of layers; and passing light through said at least one aperture to expose said photosensitive layer.
103 Citations
19 Claims
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1. A microfabrication process for fabricating a microelectromechanical systems device, comprising:
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depositing one or a stack of layers on a substrate;
patterning said one or a stack of layers;
depositing a middle layer on said one or a stack of layers; and
patterning the middle layer using said one or a stack of layers as a photomask. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A method for fabricating a microelectromechanical systems device, the method of comprising:
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a) depositing one or a stack of layers on a base layer, said one layer or an uppermost layer in said stack of layers being a sacrificial layer;
b) patterning said one or a stack of layers to provide at least one aperture therethrough through which said base layer is exposed;
c) depositing a photosensitive layer over said one or a stack of layers; and
d) passing light through said at least one aperture to expose said photosensitive layer. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification