Integrated circuit package and method for fabrication
First Claim
1. Structure comprising:
- a substrate formed of a heat deformable material;
at least one semiconductor die embedded in said substrate such that the top surface(s) of said at least one semiconductor die and the top surface of said substrate are in substantially the same plane;
a plurality of bonding pads formed on the top surface(s) of said at least one die; and
a plurality of conductive paths formed over the top surface(s)of said at least one die and the top surface of said substrate, each conductive path ending on the top surface of said substrate in a conductive land or pad and beginning in electrical contact with a corresponding bonding pad on said at least one die thereby to connect said corresponding bonding pad on the top surface(s) of said at least one die with a corresponding conductive land or pad on the top surface of said substrate.
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Abstract
An integrated circuit package includes at least one semiconductor die embedded in a substrate made of a heat deformable material such as plastic or a combination of plastics. The at least one die is embedded so that the top surface of the at least one die, which contains a plurality of bonding pads, is exposed, and, in certain embodiments, substantially coplanar with the top surface of the substrate. A layer of conductive material is then formed on the top surface of the substrate and on the top surfaces(s) of at least one semiconductor die. This layer is formed into a plurality of electrically conductive paths each path beginning at a selected bonding pad and terminating in an electrically conductive land on the top surface of the substrate. Electrical connection is then made between the at least one die and external circuitry by placing the structure on a printed circuit board, for example, with electrically conductive balls between the electrically conductive lands on the substrate and adjacent electrical contacts on the printed circuit board. If desired, a protective coating can be formed over the at least one semiconductor die or over the combination of the at least one semiconductor die and the substrate to protect the surface of the at least one semiconductor die.
78 Citations
29 Claims
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1. Structure comprising:
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a substrate formed of a heat deformable material;
at least one semiconductor die embedded in said substrate such that the top surface(s) of said at least one semiconductor die and the top surface of said substrate are in substantially the same plane;
a plurality of bonding pads formed on the top surface(s) of said at least one die; and
a plurality of conductive paths formed over the top surface(s)of said at least one die and the top surface of said substrate, each conductive path ending on the top surface of said substrate in a conductive land or pad and beginning in electrical contact with a corresponding bonding pad on said at least one die thereby to connect said corresponding bonding pad on the top surface(s) of said at least one die with a corresponding conductive land or pad on the top surface of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 29)
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9. The method of fabricating a package for at least one semiconductor die which comprises:
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forming a substrate of a material deformable at a temperature elevated relative to room temperature;
heating said substrate until the substrate material is deformable;
pressing at least one semiconductor die into said substrate until the top surface of said at least one semiconductor die occupies a selected position relative to the top surface of said substrate; and
cooling said substrate thereby to embed said integrated circuit die in said substrate material. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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28. Structure comprising:
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a substrate formed of a heat deformable materials;
a semiconductor die embedded in said substrate such that the top surface of said semiconductor die and the top surface of said substrate are both exposed;
a plurality of bonding pads formed on the top surface of said semiconductor die; and
a plurality of conductive paths formed over the top surface of said semiconductor die and over the top surface of said substrate, each conductive path ending on said top surface of said substrate as a conductive land, and beginning on said semiconductor die in electrical contact with one of said plurality of bonding pads.
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Specification