Pattern inspecting apparatus and pattern inspecting method

• US 20030156749A1
• Filed: 07/23/2002
• Published: 08/21/2003
• Est. Priority Date: 02/15/2002
• Status: Abandoned Application

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Nishiura, Toshie, Ishio, Noriaki
• Application Number:
  US10/200,167
• Publication Number:
  US 20030156749A1
• Time in Patent Office: Days
• US Class Current: 382/149
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/0004 Industrial image inspection
• CPC Class Codes: G06T 7/73 using feature-based methods

Abstract

When inspecting a pattern of a semiconductor device, a basic pattern, which is used for correction of a mounted position when mounting a substrate on a support platform of the substrate, is recorded beforehand. Then, a deviation of a mounted position is corrected using the basic pattern. An image of the pattern, which is formed on the substrate mounted on the support platform, is obtained to detect a defect of the pattern judging from the obtained image. After production processing of the substrate progresses, if a shape of the basic pattern changes, a new pattern, which is used for correction of a mounted position when mounting a substrate on the support platform, is recorded temporarily. Then, using the new pattern registered temporarily, a deviation of a mounted position when the substrate is mounted on the support platform is corrected.

Claims

1. A pattern inspecting apparatus comprising:

an image obtaining means for obtaining an image of a pattern formed on a substrate which is mounted on a support platform;

a position correction means for recording a basic pattern beforehand, the basic pattern being used for correction of a mounted position when the substrate is mounted on the support platform, and said position correction means correcting a deviation of the mounted position using the basic pattern; and

a defect detecting means for detecting a defect of the pattern judging from the image obtained by said image obtaining means; and

a temporary recording portion for temporarily recording a new pattern used for correction of a mounted position when the substrate is mounted on the support platform, if a mounted position can not be corrected by using the basic pattern,

wherein the position correction means can correct a deviation of the mounted position when the substrate is mounted on the support platform, using the new pattern recorded on said temporary recording portion.

2. A pattern inspecting apparatus according to claim 1, further comprising a defect position recording portion for recording a position of the pattern, where the defect has been detected, in the substrate.

3. A pattern inspecting apparatus according to claim 1, further comprising:

a defect size judging means for judging a size of the defect detected by said defect detecting means; and

a defect image recording portion for selecting only a pattern image, the defect of which has a size within a given range, from among the patterns where the defect has been detected, and recording the selected image.

4. A pattern inspecting apparatus according to claim 1, further comprising an adjusting means for adjusting the deviation of the position of the new pattern from that of the basic pattern.

5. A pattern inspecting apparatus comprising:

an image obtaining means for obtaining an image of a pattern formed on a substrate which is mounted on a support platform;

a position correction means for recording a basic pattern beforehand, the basic pattern being used for correction of a mounted position when the substrate is mounted on the support platform, and said position correction means correcting a deviation of the mounted position using the basic pattern;

a defect detecting means for detecting a defect of the pattern judging from the image obtained by said image obtaining means;

a defect size judging means for judging a size of the defect detected by said defect detecting means; and

a defect image recording portion for selecting only a pattern image, the defect of which has a size within a given range, from among the patterns where the defect has been detected, and recording the selected image.

6. A pattern inspecting method for inspecting a defect of a pattern formed on a substrate, said pattern inspecting method comprising:

a program selecting step for selecting an inspection program that is set beforehand;

a substrate mounting step for selecting a substrate to be inspected according to the inspection program to mount the selected substrate at a given position;

a position correcting step for correcting a deviation of a mounted position of the substrate using a basic pattern formed on the substrate; and

a defect detecting step for detecting a defect of the pattern,

wherein, when said position correcting step is performed, if a mounted position cannot be corrected using the basic pattern, a position correcting step comprises a first temporary recording step for recording a new pattern temporarily, and a first temporary position correcting step for correcting a deviation of the mounted position of the substrate using the new pattern recorded at said first temporary recording step.

7. A pattern inspecting method according to claim 6, further comprising, a defect position recording step for recording a position of the defect pattern if the pattern has a defect.

8. A pattern inspecting method according to claim 6, further comprising;

an observing step for observing the pattern where the detect has been detected,

wherein, when said observing step is performed, if a mounted position cannot be corrected by using the basic pattern or the new pattern recorded at said first temporary recording step, said observing step comprises a second temporary recording step for recording a new pattern temporarily, and a second temporary position correcting step for correcting a deviation of the mounted position of the substrate using the new pattern recorded at said second temporary recording step.

9. A pattern inspecting method according to claim 6, further comprising;

a defect size judging step for judging a size of the defect detected in said defect detecting step; and

a defect image recording step for selecting only a pattern image, the defect of which is judged to have a size within a given range in the defect size judging step, and recording the selected image.

10. A pattern inspecting method according to claim 6, further comprising a position adjusting step for adjusting a deviation of the position of the new pattern from that of the basic pattern after said first temporary recording step.