Method and system for monitoring and profiling an integrated circuit die temperature
First Claim
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1. A system to monitor a temperature of an integrated circuit, comprising:
- a thermal sensor to measure said temperature of said integrated circuit and assert a value representative of said temperature; and
a controller coupled to said thermal sensor to interpret said value asserted by said thermal sensor to monitor said temperature of said integrated circuit.
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Abstract
A system and method are provided for sensing a physical stimulus of an integrated circuit. The system and method operate with one or more active thermal sensors embedded in the die of an integrated circuit to provide highly accurate die temperature measurements. The system and method are able to monitor and control the die temperature of the integrated circuit to avoid an integrated circuit malfunction due to an undesirable temperature condition.
164 Citations
32 Claims
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1. A system to monitor a temperature of an integrated circuit, comprising:
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a thermal sensor to measure said temperature of said integrated circuit and assert a value representative of said temperature; and
a controller coupled to said thermal sensor to interpret said value asserted by said thermal sensor to monitor said temperature of said integrated circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for monitoring a die temperature of an integrated circuit, said method comprising the steps of:
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sensing said die temperature of said integrated circuit with an active thermal sensor at a die location of the integrated circuit;
asserting from said active thermal sensor a value representative of said die temperature at the die location of said active thermal sensor; and
determining if said value from said active thermal sensor exceeds a threshold value for said active thermal sensor to detect an undesirable temperature condition of said integrated circuit. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A temperature management system for an integrated circuit, comprising:
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one or more thermal sensors to sense and report one or more temperature measurements from one or more locations located across a die area of the integrated circuit; and
a control unit to manage the temperature of the integrated circuit if the control unit detects a temperature event from the one or more thermal sensors. - View Dependent Claims (30, 31, 32)
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Specification