Methods and apparatus for fabricating Chip-on-Board modules
First Claim
1. A method of fabricating Chip-on-Board logic modules using selectively settable materials, said method comprising:
- mounting unpackaged die using-a first layer of selectively-settable material;
hardening said first layer of selectively-settable material;
covering said first layer of selectively-settable material with a second layer of selectively-settable material; and
capturing bonding wires connecting said unpackaged die to a printed circuit board in said second layer of selectively-settable material.
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Accused Products
Abstract
An improved method for fabricating Chip-on-Board memory modules using partially-defective memory chips or a combination of partially-defective and flawless memory parts, comprises mounting unpackaged (or a combination of packaged and unpackaged) memory parts to a printed circuit board using one or more selectively settable materials, testing and patching the memory parts, and providing a protective cover after a suitable combination of memory parts and patches produces a fully-functional memory module. Also, a new set of printed circuit boards designed to allow fabrication of memory modules using single-bit patching, any-bit patching, and DDR technology with unpackaged memory parts. In a preferred embodiment, the method and printed circuit boards mentioned above are combined to produce a number of low-cost memory modules using modern, available partially-defective and flawless memory parts.
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Citations
27 Claims
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1. A method of fabricating Chip-on-Board logic modules using selectively settable materials, said method comprising:
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mounting unpackaged die using-a first layer of selectively-settable material;
hardening said first layer of selectively-settable material;
covering said first layer of selectively-settable material with a second layer of selectively-settable material; and
capturing bonding wires connecting said unpackaged die to a printed circuit board in said second layer of selectively-settable material. - View Dependent Claims (2, 3, 4, 5, 6)
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- 7. A Chip-on-Board logic module fabricated according to method 1.
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8. A method of fabricating a Chip-on-Board logic module using selectively settable materials, said method comprising:
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mounting one or more electronic logic parts on a printed circuit board using said selectively settable materials;
selectively hardening areas of a selectively settable material;
attaching bonding wires between pads of said logic parts and pads of said printed circuit board;
applying selectively settable material to cover said bonding wires;
inspecting bonding wire connections;
readjusting bonding wires; and
hardening selectively settable material that covers said bonding wires. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
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19. A multi-layer printed circuit board for fabricating Chip-on-Board memory modules using partially-defective memory parts comprising:
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pads for connecting electrical components to said circuit board;
a patching network; and
interface connections. - View Dependent Claims (20, 21, 22, 23, 24, 25)
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26. A memory module comprising a multi-layer printed circuit board for fabricating Chip-on-Board memory modules using partially-defective memory parts comprising:
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pads for connecting electrical components to said circuit board;
a patching network; and
interface connections. - View Dependent Claims (27)
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Specification