Method for improving heat dissipation in optical transmitter

• US 20030159772A1
• Filed: 02/27/2002
• Published: 08/28/2003
• Est. Priority Date: 02/27/2002
• Status: Active Grant

• Current Assignee: Lumentum Operations, LLC (Lumentum Holdings Inc.)
• Original Assignee: Optronx Inc.
• Inventors: Fu, Hui, Wolf, Robert K.
• Granted Patent: US 6,773,532 B2
• Time in Patent Office: Days
• US Class Current: 156/182
• CPC Class Codes: G02B 6/4208 using non-reciprocal elements or birefringent plates, i.e. quasi-isolators optical isolators per se G02F1/093, G02F1/0955
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: G02B 6/4224 using visual alignment markings, e.g. index methods
• CPC Class Codes: G02B 6/4225 by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
• CPC Class Codes: G02B 6/4228 Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements G02B6/4234 takes precedence
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4257 having a supporting carrier or a mounting substrate or a mounting plate G02B6/3648 takes precedence
• CPC Class Codes: G02B 6/4265 of the Butterfly or dual inline package [DIP] type
• CPC Class Codes: G02B 6/4266 Thermal aspects, temperature control or temperature monitoring thermal aspect of electrical circuits H05K7/20, H05K5/0213, temperature control in general G05D23/19
• CPC Class Codes: G02B 6/4267 Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/4277 Protection against electromagnetic interference [EMI], e.g. shielding means shielding of electric apparatus H05K9/00, of instruments G12B17/00
• CPC Class Codes: G02B 6/4284 of optical modules with disconnectable electrical connectors latching arms for electrical connectors H01R13/627
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1089 of discrete laminae to single face of additional lamina

Abstract

A method of positioning a heat generating component on a header to enhance heat sinking characteristics includes positioning the header on a first pedestal, wherein the first pedestal and the header are bounded by an air trench having a vertical surface, and positioning the heat generating component only in areas on the header having an associated heat dissipation conical region extending from the heat generating component downward through the first pedestal at an angle that satisfies Fourier'"'"'s Law of Heat Conduction, wherein the conical region does not intersect the vertical surface of the air trench.

Claims

1. A method of positioning a heat generating component on a header to enhance heat sinking characteristics, comprising:

positioning the header on a first pedestal, wherein the first pedestal and the header are bounded by an air trench having a vertical surface; and

positioning the heat generating component only in areas on the header having an associated heat dissipation conical region extending from the heat generating component downward through the first pedestal at an angle that satisfies Fourier'"'"'s Law of Heat Conduction, wherein the conical region does not intersect the vertical surface of the air trench.

2. The method of claim 1, wherein the heat generating component is one from the group of a laser, a laser driver, or a cooler.

3. The method of claim 1, wherein the first pedestal includes a first material at a location adjacent to the laser and a second material at a location adjacent to the lower portion of the air trench, wherein the second material has a lower thermal conductivity than the first material.

4. The method of claim 1, further comprising:

positioning a hybrid subassembly on a second pedestal that is separated from the first pedestal by the air trench, and mounting a laser driver on the hybrid subassembly.

5. The method of claim 4, wherein a second air trench separates the first and second pedestals from a third pedestal having an optical receiver mounted thereon.