Electronic product with heat radiating plate

• US 20030161109A1
• Filed: 02/25/2003
• Published: 08/28/2003
• Est. Priority Date: 02/27/2002
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: NEC Compound Semiconductor Devices, Ltd. (NEC Corporation)
• Inventors: Ueda, Takashi, Kurihara, Toshimichi
• Granted Patent: US 7,002,803 B2
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32188 the layer connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85444 Gold (Au) as principal constituent
• CPC Class Codes: H01L 23/047 the other leads being parallel to the base
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/10161 : with a rectangular active surface
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

An electronic product comprises a heat radiating plate, an electronic component securely mounted on the heat radiating plate and including a high power transistor, an enveloper including a frame member securely associated with the heat radiating plate to encompass the electronic component, and a lid member securely attached to an upper opening end of the frame member, thereby accommodating and sealing the electronic component in the enveloper, and at least one electrically conductive element passing and extending through the frame member. The frame member is made of a suitable resin material, and the lid member is made of one material selected from the group consisting of a ceramic material, a metal material, and a composite material.

Claims

1. An electronic product comprising:

a heat radiating plate;

an electronic component securely mounted on said heat radiating plate;

an enveloper including a frame member securely associated with said heat radiating plate to encompass said electronic component, and a lid member securely attached to an upper opening end of said frame member, thereby accommodating and sealing said electronic component in said enveloper; and

at least one electrically conductive element passing and extending through said frame member,

wherein said frame member is made of a suitable resin material, and said lid member is made of one material selected from the group consisting of a ceramic material, a metal material, and a composite material.

2. An electronic product as set forth in claim 1, wherein said composite material is composed of a suitable resin material, and a suitable filler material.

3. An electronic product as set forth in claim 1, wherein said frame member is molded from said resin by a molding process, and said heat radiating plate is configured so as to be mechanically engaged with the molded frame member.

4. An electronic product as set forth in claim 1, wherein said frame member is molded from said resin by a molding process, and said heat radiating plate is formed with at least one recess which is embedded in the molded frame member, so as to be mechanically engaged with said molded frame member.

5. An electronic product as set forth in claim 4, wherein said heat radiating plate is further formed with at least one projection arranged on a wall face forming said recess, thereby further ensuring the mechanical engagement between said radiating plate and said molded frame member.

6. An electronic product as set forth in claim 1, wherein said frame member is molded from said resin by a molding process, and said at least one electrically conductive element is configured so as to be mechanically engaged with the molded frame member.

7. An electronic product as set forth in claim 1, wherein said frame member is molded from said resin by a molding process, and said at least one electrically conductive element is formed with at least one perforation which is embedded in the molded frame member so as to be mechanically engaged with said molded frame member.

8. An electronic product as set forth in claim 1, wherein said at least one electrically conductive element is formed with an alignment of perforations and endmost cutouts which are embedded in said molded frame member so as to be mechanically engaged with the molded frame member.

9. An electronic product as set forth in claim 1, wherein said frame member is molded from said resin by a molding process, and said at least one electrically conductive element is formed with at least one perforation at an outside of the molded frame member to thereby reduce a rigidity of an outer section of said electrically conductive element.

10. An electronic product as set forth in claim 1, wherein said frame member is molded from said resin by a molding process, said at least one electrically conductive element is formed with a first alignment of perforations which are embedded in said molded frame member so as to be mechanically engaged with said molded frame member, and said at least one electrically conductive element is further formed with a second alignment of perforations arranged along an outer wall face of the molded frame member to thereby reduce a rigidity of an outer section of said electrically conductive element, the perforations included in said second alignment being alternately arranged with respect to the perforations included in said first alignment.

11. An electronic product as set forth in claim 1, wherein said lid member is formed with two rectangular land portions which are integrally swelled from opposing wall faces thereof, and which are symmetrically arranged with respect to a geometrical neutral plane of said lid member, and each land portion is sized so as to be fitted into the upper opening end of said frame member.

12. An electronic product as set forth in claim 1, wherein said heat radiating plate includes inner and outer portions which are divided and defined by said frame member;

the inner portion of said heat radiating plate, which is inside said frame member, is surfaced with silver-plating, and the outer portion of said heat radiating plate, which is outside said frame member, are surfaced with gold-plating;

said at least one electrically conductive element includes inner and outer lead sections which are divided and defined by said frame member; and

said inner and outer lead sections are surfaced with gold-plating.

13. An electronic product as set forth in claim 1, wherein said at least one electrically conductive element is derived from a lead frame, and said heat radiating plate is prepared as a part which is independent from said lead frame.

14. An electronic product as set forth in claim 1, wherein said electronic component comprises a high power transistor, and said at least one electrically conductive element is defined as a first lead, said electronic product further comprising a second lead passing and extending through said frame member, said respective first and second leads being electrically connected to said high power transistor so as to form input and output terminals of said high power transistor, said heat radiating plate being electrically connected to form a grounded terminal of said high power transistor.

15. An electronic product comprising:

a heat radiating plate;

an electronic component securely mounted on said heat radiating plate;

an enveloper including a frame member securely associated with said heat radiating plate to encompass said electronic component, and a lid member securely attached to an upper opening end of said frame member, thereby accommodating and sealing said electronic component in said enveloper; and

at least one electrically conductive element passing and extending through said frame member,

wherein said frame member is made of a suitable resin material, and at least a part of said lid member exhibits an electrical conductivity.

16. An electronic product as set forth in claim 15, wherein said lid member is made of a suitable metal material.

17. An electronic product as set forth in claim 15, wherein said lid member is made of an electrically conductive resin material.

18. An electronic product as set forth in claim 15, wherein said lid member is constituted as a composite lid member composed of a metal sheet element, and a resin plate element.

19. An electronic product as set forth in claim 15, wherein said lid member is constituted as a composite lid member composed of a non-conductive plate element, and an electronic conductive layer formed on a surface of said non-conductive plate element.

20. An electronic product as set forth in claim 19, wherein said electronic conductive layer comprises a suitable metal sheet securely adhered to the surface of said non-conductive plate element.

21. An electronic product as set forth in claim 19, wherein said electronic conductive layer is formed by coating the surface of said non-conductive plate element with a suitable electrically conductive paste material.

22. An electronic product as set forth in claim 19, wherein said electronic conductive layer is configured such that a thermal expansion difference between said non-conductive plate element and said electronic conductive layer is mitigated.

23. An electronic product as set forth in claim 19, wherein said electronic conductive layer is formed from a plurality of thick portions and a plurality of thin portions which are regularly arranged on the surface of the plate element such that a thermal expansion difference between said non-conductive plate element and said electronic conductive layer is mitigated.

24. An electronic product as set forth in claim 19, wherein said electronic conductive layer is formed with a plurality of openings such that a thermal expansion difference between said non-conductive plate element and said electronic conductive layer is mitigated.

25. An electronic product as set forth in claim 15, wherein said frame member is provided with an electrically conductive element through which said lid member is electrically connected to said heat radiating plate.

26. An electronic product as set forth in claim 25, wherein said frame member is molded from said resin by a molding process, and said electrically conductive element is embedded in the molded frame member.

27. An electronic product as set forth in claim 25, wherein said electrically conductive element is constituted as an electronic conductive layer formed on a wall face of said frame member.

28. An electronic product as set forth in claim 27, wherein said electronic conductive layer comprises a suitable metal sheet securely adhered to the wall face of said frame member.

29. An electronic product as set forth in claim 27, wherein said electronic conductive layer is formed by coating the wall face of said frame member with a suitable electrically conductive paste material.

30. An electronic product as set forth in claim 27, wherein said electronic conductive layer is configured such that a thermal expansion difference between said frame member and said electronic conductive layer is mitigated.

31. An electronic product as set forth in claim 27, wherein said electronic conductive layer is formed from a plurality of thick portions and a plurality of thin portions which are regularly arranged on the wall face of said frame member such that a thermal expansion difference between said frame member and said electronic conductive layer is mitigated.

32. An electronic product as set forth in claim 27, wherein said electronic conductive layer is formed with a plurality of openings (70) such that a thermal expansion difference between said frame member and said electronic conductive layer is mitigated.

33. An electronic product as set forth in claim 15, wherein said frame member is molded from said resin by a molding process, and said heat radiating plate is configured so as to be mechanically engaged with the molded frame member.

34. An electronic product as set forth in claim 15, wherein said frame member is molded from said resin by a molding process, and said heat radiating plate is formed with at least one recess which is embedded in the molded frame member, so as to be mechanically engaged with said molded frame member.

35. An electronic product as set forth in claim 34, wherein said heat radiating plate is formed with at least one projection arranged on a wall face forming said recess, thereby further ensuring the mechanical engagement between said radiating plate and said molded frame member.

36. An electronic product as set forth in claim 15, wherein said frame member is molded from said resin by a molding process, and said at least one electrically conductive element is configured so as to be mechanically engaged with the molded frame member.

37. An electronic product as set forth in claim 15, wherein said frame member is molded from said resin by a molding process, and said at least one electrically conductive element is formed with at least one perforation which is embedded in the molded frame member so as to be mechanically engaged with said molded frame member.

38. An electronic product as set forth in claim 15, wherein said at least one electrically conductive element is formed with an alignment of perforations and endmost cutouts which are embedded in said molded frame member so as to be mechanically engaged with the molded frame member.

39. An electronic product as set forth in claim 15, wherein said frame member is molded from said resin by a molding process, and said at least one electrically conductive element is formed with at leas one perforation at an outside of the molded frame member to thereby reduce a rigidity of an outer section of said electrically conductive element.

40. An electronic product as set forth in claim 15, wherein said frame member is molded from said resin by a molding process, said at least one electrically conductive element is formed with a first alignment of perforations which are embedded in said molded frame member so as to be mechanically engaged with said molded frame member, and said at least one electrically conductive element is further formed with a second alignment of perforations arranged along an outer wall face of the molded frame member to thereby reduce a rigidity of an outer section of said electrically conductive element, the perforations included in said second alignment being alternately arranged with respect to the perforations included in said first alignment.

41. An electronic product as set forth in claim 15, wherein said lid member is formed with two rectangular land portions which are integrally swelled from opposing wall faces thereof, and which are symmetrically arranged with respect to a geometrical neutral plane of said lid member, and each land portion is sized so as to be fitted into the upper opening end of said frame member.

42. An electronic product as set forth in claim 15, wherein said heat radiating plate includes inner and outer portions which are divided and defined by said frame member;

the inner portion of said heat radiating plate, which is inside said frame member, is surfaced with silver-plating;

the outer portion of said heat radiating plate, which is outside said frame member, are surfaced with gold-plating;

said at least one electrically conductive element includes inner and outer lead sections which are divided and defined by said frame member; and

said inner and outer lead sections are surfaced with gold-plating.

43. An electronic product as set forth in claim 15, wherein said at least one electrically conductive element is derived from a lead frame, and said heat radiating plate is prepared as a part which is independent from said lead frame.

44. An electronic product as set forth in claim 15, wherein said electronic component comprises a high power transistor, and said at least one electrically conductive element is defined as a first lead, said electronic product further comprising a second lead passing and extending through said frame member, said respective first and second leads being electrically connected to said high power transistor so as to form input and output terminals of said high power transistor, said heat radiating plate being electrically connected to form a grounded terminal of said high power transistor.