Manufacturing system using solder self-alignment with optical component deformation fine alignment

• US 20030162003A1
• Filed: 03/19/2003
• Published: 08/28/2003
• Est. Priority Date: 03/08/2001
• Status: Abandoned Application

• Current Assignee: Axsun Technologies Incorporated
• Original Assignee: Axsun Technologies Incorporated
• Inventors: OʼConnor, Sean P., Atia, Walid A., Fitch, Eric E., Murdza, Randal A., Conover, Steven D.
• Application Number:
  US10/391,835
• Publication Number:
  US 20030162003A1
• Time in Patent Office: Days
• US Class Current: 428/209
• CPC Class Codes: G02B 6/4226 Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4238 Soldering
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 2203/0186 Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49769 Using optical instrument [excludes mere human eyeballing]
• CPC Class Codes: Y10T 29/49771 Quantitative measuring or gauging
• CPC Class Codes: Y10T 29/49778 with aligning, guiding, or instruction
• CPC Class Codes: Y10T 29/49861 Sizing mating parts during final positional association
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

A process for assembling micro-optical systems, such as optoelectronic and/or fiber optic components uses solder self-alignment to achieve a coarse, passive alignment of optical components relative to the optical bench. The fine, final alignment is performed using plastic deformation of the optical components to thereby improve the alignment of the optical components. As a result, the sub-micrometer alignment accuracies are attainable, if required.

Claims

1. An unpopulated optical bench precursor structure comprising:

a bench;

solder pads deposited on the bench at locations determined by engagement points between optical components and the optical bench; and

spacers on the bench and in or near the solder pads for supporting the optical components at a predetermined position vertically on the bench.

2. An unpopulated optical bench precursor structure as claimed in claim 1, further comprising a template for facilitating the placement of optical components on the bench.