Substrate mapping
First Claim
1. An assembly method for attaching a semiconductor die and a substrate having a plurality of die attach sites on a surface thereof comprising:
- mapping said plurality of die attach sites on said mounting substrate;
determining good die attach sites and defective die attach sites on said substrate;
storing said information in an electronic file; and
attaching at least one semiconductor die to said mounting substrate using said information by one of attaching a known good die to a good die attach site of said good die attach sites and attaching a known defective die to a defective die attach site of said defective die attach sites.
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Accused Products
Abstract
A method for fabricating semiconductor die packages including a mounting substrate and dice attached thereto. The mounting substrate includes multiple die attach sites and a designator having substrate identification information. The die attach sites are evaluated and categorized as either good or defective die attach sites, wherein the evaluated information is saved in an electronic file as mapped information. A die is attached to the die attach sites in accord with the information, wherein known good dice are attached to the good die attach sites and known defective dice are attached to the defective die attach sites. The assembly is then encapsulated in a transfer molding operation.
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Citations
12 Claims
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1. An assembly method for attaching a semiconductor die and a substrate having a plurality of die attach sites on a surface thereof comprising:
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mapping said plurality of die attach sites on said mounting substrate;
determining good die attach sites and defective die attach sites on said substrate;
storing said information in an electronic file; and
attaching at least one semiconductor die to said mounting substrate using said information by one of attaching a known good die to a good die attach site of said good die attach sites and attaching a known defective die to a defective die attach site of said defective die attach sites. - View Dependent Claims (2, 3, 4)
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5. A method for fabricating semiconductor packages, each package having a mounting substrate having a plurality of die attach sites on at least one surface thereof, the method comprising:
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evaluating said plurality of die attach sites on said mounting substrate for determining information regarding said die attach site;
determining good die attach sites and defective die attach sites from said information;
attaching at least one semiconductor die to said mounting substrate according to said information by one of attaching a known good die to a good die attach site of said good die attach sites and attaching a known defective die to a defective die attach site of said defective die attach sites; and
encapsulating said mounting substrate using an encapsulation material. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12)
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Specification