High resolution hidden damage imaging

• US 20030164700A1
• Filed: 01/15/2003
• Published: 09/04/2003
• Est. Priority Date: 03/19/2001
• Status: Abandoned Application

• Current Assignee: Jentek Sensors, Inc.
• Original Assignee: Jentek Sensors, Inc.
• Inventors: Goldfine, Neil J., Grundy, David C., Schlicker, Darrell E., Washabaugh, Andrew P., Shay, Ian C., Windoloski, Mark D.
• Application Number:
  US10/345,883
• Publication Number:
  US 20030164700A1
• Time in Patent Office: Days
• US Class Current: 324/235
• CPC Class Codes: G01N 27/82 for investigating the presence of flaws
• CPC Class Codes: G01N 27/902 by moving the sensors
• CPC Class Codes: G01N 27/904 with two or more sensors

Abstract

This invention relates to apparatus for the nondestructive measurements of materials. New eddy current sensing arrays and methods are described which provide a capability for high resolution imaging of test materials and also a high probabilitity of detection for defects and flaws around features such as fasteners. The arrays incorporate unique layouts for the sensing elements, generally have essentially identical sensor arrays with sensing elements aligned in proximity to the drive elements, and conductive pathways that promote cancellation of undesired magnetic flux. These features enable the use of small sense elements that permits high resolution imaging of material properties.

Claims

1. A test circuit comprising:

two parallel rows of aligned sense elements for scanning across a material under test surface;

at least one linear conductor segment positioned parallel to and between the sensing element rows for imposing a magnetic field; and

a right row of sensing elements for detecting a flaw on the right side of a feature and a left row of sensing elements for detecting cracks on the left side of a feature.

2. A test circuit as described in claim 1 where the feature is a fastener in an aircraft skin.

3. A test circuit as described in claim 1 where the flaw is a crack.

4. A test circuit as described in claim 1 where the flaw is corrosion.

5. A test circuit as described in claim 1 where the flaw is a buried inclusion.

6. A test circuit as described in claim 1 where multiple frequencies are used to remove the interference caused by the feature and isolate the response from the flaw.

7. A test circuit as described in claim 1 where a shape filter is used to search the sensor response for shapes that are most likely to be flaws and to suppress responses unlikely to be flaws.

8. A test circuit as described in claim 7 where the response from sensing elements on opposite sides of the central conductor are combined to construct a filter representing the flaw of interest, the filter then is used to search the response image for indications likely to be the flaw of interest.

9. A test circuit as claimed in claim 8 where the flaw of interest is a crack.

10. A test circuit as claimed in claim 8 where the flaw of interest is a buried inclusion.

11. A test circuit as claimed in claim 1 further comprising the primary winding and sense elements are in the same plane.

12. A test circuit as claimed in claim 1 further comprising the primary winding and sense elements are in the different planes.

13. A test circuit as claimed in claim 1 further comprising that each individual sense element in one row of sense elements is aligned with a sense element in the second row of sense elements in a direction perpendicular to the extended portions of the primary winding.

14. A test circuit as claimed in claim 1 further comprising that the sense elements in one row of sense elements is offset in a direction parallel to the extended portions of the primary winding from the sense elements in the second row of sense elements.

15. A test circuit as claimed in claim 14 wherein the offset distance is one-half of the length of a sensing element.

16. A test circuit as claimed in claim 1 wherein the location of the sense elements is non-uniform in the direction parallel to the extended portions of the primary winding.

17. A test circuit as claimed in claim 1 wherein the primary winding and sense elements are fabricated onto a flexible substrate.

18. A test circuit as claimed in claim 1 wherein the primary winding and sense elements are fabricated onto a rigid substrate.

19. A test circuit as claimed in claim 1 wherein at least one of the sense elements includes a magnetoresistive sensor.

20. A test circuit as claimed in claim 1 wherein at least one of the sense elements includes a giant magnetoresistive sensor.

21. A test circuit in claim 20 further comprising a secondary coil that surrounds the giant magnetoresistive sensing elements.

22. A test circuit as claimed in claim 21 wherein the secondary coil is in a feedback configuration.

23. A method for inspecting materials comprising:

disposing at least two parallel rows of aligned sense elements on substrate for scanning across a material under test surface, with at least one linear drive conductor segment positioned parallel to and between the sensing element rows for imposing a magnetic field; and

having a right row of sensing elements for detecting a flaw on the right side of a feature and a left row of sensing elements for detecting cracks on the left side of a feature;

passing a time-varying electric current through the drive conductor;

measuring the response from each of the sense elements, comprising the scan responses to a shape filter representing the response from a flaw, and searching the scan responses for indications likely to be the flaw.

24. A test circuit as described in claim 23 where multiple frequencies are used to remove the interference caused by the feature and isolate the response from the flaw.

25. A test circuit as described in claim 23 where the feature is a fastener in an aircraft skin.

26. A test circuit as described in claim 23 where the flaw is a crack.

27. A test circuit as described in claim 23 where the flaw is a buried inclusion.