Pin installation guidance apparatus, methods and articles of manufacture

• US 20030166349A1
• Filed: 03/01/2002
• Published: 09/04/2003
• Est. Priority Date: 03/01/2002
• Status: Abandoned Application

• Current Assignee: Tyco Electronics Corporation (TE Connectivity Ltd. (United Kingdom))
• Original Assignee: Tyco Electronics Corporation (TE Connectivity Ltd. (United Kingdom))
• Inventors: Huss, John P. Jr., Martin, Galen M.
• Application Number:
  US10/087,353
• Publication Number:
  US 20030166349A1
• Time in Patent Office: Days
• US Class Current: 439/79
• CPC Class Codes: H01R 12/724 containing contact members forming a right angle
• CPC Class Codes: H01R 43/205 with a panel or printed circuit board

Abstract

Apparatus, methods and articles of manufacture for pin installation are shown, comprising one or more support surfaces above a pin array. These support surfaces permit a press fit mechanism to install the array by applying a force normal to the pin heads of the array and above the pin tails. A liquid curing to solid such as epoxy may be used to provide the surface. Alternatively a solid surface may be used.

Claims

1. An article of manufacture for installing pin connectors comprising a support surface for right angle pin array installation, wherein said support surface is configured to receive a force at an angle normal to the pin heads of said pin array.

2. An apparatus for installing pin connectors comprising:

a pin array;

a support surface means; and

,

an enclosure means for receiving said support surface means;

wherein said pin array is at least partially enclosed within said enclosure means.

3. An apparatus as in claim 2 wherein said support surface means further comprises an encapsulation means.

4. An apparatus as in claim 3 wherein said encapsulation means further comprises an epoxy means.

5. An apparatus as in claim 3 wherein said encapsulation means further comprises a transverse support means for said pin array.

6. An apparatus as in claim 3 wherein said encapsulation means further comprises an axial support means for said pin array.

7. An apparatus as in claim 3 wherein said encapsulation means further comprises an encapsulation means for surrounding said pin array.

8. An apparatus as in claim 2 further comprising a pin guide, wherein said pin array is at least partially enclosed within said pin guide as well as within said encapsulation means.

9. An apparatus for installing pin connectors comprising:

a connector means;

a pin array;

a header means; and

a support means;

wherein said connector means is matingly engaged with said header means, thus forming an enclosure for said pin array, and said support surface means provides for a downward force to be applied above a pin array.

10. An apparatus as in claim 9 further comprising means for bonding said connector means and said header means.

11. An apparatus as in claim 9 further comprising a pin guide, wherein said pin array is at least partially enclosed within said pin guide as well as within said encapsulation means.

12. An method for installing pin connectors comprising:

providing a support surface on a connector and housing, with said housing having a floor from which pin tails depend;

applying a force on said support surface in order to install said connector and housing to a printed circuit board.

13. A method as in claim 12, further comprising

providing a pin array within a connector;

providing a housing;

assembling said connector and housing so that pin tails form said pin array tails depend from said housing;

providing a support surface; and

,

applying a force on said support surface in order to install said connector and housing to a printed circuit board.

14. A method as in claim 13 further comprising the step of providing an enclosure means for receiving said support surface means wherein said pin array is at least partially enclosed within said enclosure means.

15. A method as in claim 13 wherein the step of providing a support surface further comprises providing an encapsulation means.

16. A method as in claim 15 wherein the step of providing a said encapsulation means further comprises providing an epoxy means.

17. A method as in claim 15 wherein the step of providing said encapsulation means further comprises providing a transverse support means for said pin array.

18. A method as in claim 15 wherein the step of providing said encapsulation means further comprises providing an axial support means for said pin array.

19. A method as in claim 15 wherein the step of providing said encapsulation means further comprises providing an encapsulation means for surrounding said pin array.

20. A method for installing pin connectors comprising:

providing a connector means;

providing a pin array;

providing a header means; and

providing a support means;

wherein said connector means is matingly engaged with said header means, thus forming an enclosure for said pin array, and said support surface means provides for a downward force to be applied above a pin array.

21. A method as in claim 20 further comprising the step of bonding said connector means and said header means.