Electronic component cooling apparatus

• US 20030168208A1
• Filed: 03/06/2003
• Published: 09/11/2003
• Est. Priority Date: 03/11/2002
• Status: Abandoned Application

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Sato, Kaoru
• Application Number:
  US10/379,800
• Publication Number:
  US 20030168208A1
• Time in Patent Office: Days
• US Class Current: 165/122
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A cooling apparatus has a heat sink that has a plurality of fins on the top face of a heat transfer plate opposed to a heat-generating body to be cooled in contact therewith. Comb-like baffle plates or raised baffle plates are inserted between the fins of the heat sink. This structure improves heat dissipation characteristics.

Claims

1. A cooling apparatus comprising:

a heat transfer plate having a heat-receiving surface;

a heat sink having a plurality of fins erected on said heat transfer plate on a surface opposed to said heat-receiving surface;

a blower for said heat sink; and

baffling members each for controlling an air path between said fins of said heat sink.

2. The cooling apparatus of claim 1, wherein each of said baffling members makes a clearance between said fins smaller than other portions.

3. The cooling apparatus of claim 1, wherein one of said baffling member and corresponding one of said fins are in contact with each other.

4. The cooling apparatus of claim 1, wherein each of said baffling members is shaped like one of a plate, column, and comb.

5. A cooling apparatus comprising:

a heat transfer plate having a heat-receiving surface;

a heat sink having a plurality of fins erected on said heat transfer plate on a surface opposed to said heat-receiving surface;

a blower for said heat sink; and

air-guiding members each inserted between said fins of said heat sink for guiding an air path toward a central portion of said heat sink.

6. The cooling apparatus of claim 5, wherein one of said air-guiding members and corresponding one of said fins are in contact with each other.

7. A cooling apparatus comprising:

a heat transfer plate having a heat-receiving surface;

a heat sink having a plurality of fins erected on said heat transfer plate on a surface opposed to said heat-receiving surface;

a blower for said heat sink; and

air-guiding members each inserted between said fins of said heat sink for guiding an air path toward a central portion of said heat transfer plate.

8. A cooling apparatus comprising:

a heat transfer plate opposed to a heat-generating body in contact therewith and protruding oppositely to a heat-receiving surface thereof;

a heat sink having a plurality of fins erected on said heat transfer plate on a surface opposed to said heat-receiving surface;

a fan as a blower for said heat sink; and

baffle plates each disposed between said fins of said heat sink.

9. The cooling apparatus of claim 8, wherein each of said baffle plates disposed between said fins of said heat sink is perpendicular to a fan-attaching surface.

10. The cooling apparatus of claim 8, wherein each of said baffle plates disposed between said fins of said heat sink is at an angle with respect to a fan-attaching surface.

11. The cooling apparatus of any one of claims 9 and 10, wherein each of said baffle plates disposed between said fins of said heat sink is shaped like a comb.

12. The cooling apparatus of any one of claims 9 and 10, wherein each of said baffle plates disposed between said fins of said heat sink is formed by cutting and raising a portion of each fin.

13. The cooling apparatus of any one of claims 9 and 10, wherein said baffle plates are disposed between said fins of said heat sink so that at least two baffle plates corresponds to one fin.

15. The cooling apparatus of claim 11 further comprising:

a duct for guiding exhausted fluid to an outside of the cooling apparatus;

wherein said blower is disposed one of between said duct and a housing wall and in the middle of said duct.

16. The cooling apparatus of claim 12 further comprising:

a duct for guiding exhausted fluid to an outside of the cooling apparatus;

wherein said blower is disposed one of between said duct and a housing wall and in the middle of said duct.

14. A cooling apparatus comprising:

a heat transfer plate opposed to a heat-generating body in contact therewith and protruding oppositely to a heat-receiving surface thereof;

a heat sink having a plurality of fins erected on said heat transfer plate on a surface opposed to said heat-receiving surface;

a blower for said heat sink; and

baffle plates disposed on a side wall of said heat sink through which air is blown.

17. A cooling apparatus comprising:

a heat transfer plate having a heat-receiving surface;

a heat sink having;

.

a plurality of fins erected on said heat transfer plate on a surface opposed to said heat-receiving surface; and

baffling members each for controlling an air path between said fins of said heat sink;

a fan for blowing air from said heat sink; and

a duct as an air path for said fan.