Semiconductor device and manufacturing method for same

• US 20030168720A1
• Filed: 12/13/2002
• Published: 09/11/2003
• Est. Priority Date: 03/06/2002
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Kamada, Kazuhiro
• Granted Patent: US 6,943,433 B2
• Time in Patent Office: Days
• US Class Current: 257/666
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/34 having venting means
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12035 : Zener diode
• CPC Class Codes: H01L 2924/12036 : PN diode
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/54 : having a particular shape

Abstract

To provide a light emitting device having a high reliability wherein no resin burrs occur, The semiconductor device comprises a semiconductor element, a package having a recess for housing the semiconductor element and a mold member for sealing the semiconductor element in the recess and the package comprises lead electrodes and a package support part supporting the lead electrodes so that main surfaces of the tip portions of the lead electrodes are exposed from the bottom surface of the recess.

Claims

1. A semiconductor device comprising:

a semiconductor element;

a package having a recess for housing the semiconductor element, said package including lead electrodes and a package support part holding the lead electrodes so that main surfaces of the tip portions of the lead electrodes are exposed from the bottom surface of the recess;

a mold member for sealing the semiconductor element in the recess,

wherein the mold member extends to at least between the lead electrodes and the package support part.

3. The semiconductor device according to claims 1 or 2:

wherein the package has a heat sink of which the back side becomes a mounting surface portion and of which the main surface becomes a portion on which the semiconductor element is placed.

4. The semiconductor device according to claim 3:

wherein the heat sink has a recess on the main surface.

5. The semiconductor device according to claims 3 or 4:

wherein the heat sink has a protrusion on the side making contact with the package.

6. The semiconductor device as in one of claims 1-5:

wherein the package support part has notches that are created in upper end portions of a pair of sides opposed to each other and that go through the sides reaching to the side of the recess.

7. The semiconductor device as in one of claims 1-6:

wherein the package support part is made of a thermoplastic material.

2. A semiconductor device comprising:

a semiconductor element;

a package having a recess for housing the semiconductor element, said package including lead electrodes and a package support part supporting the lead electrodes so that main surfaces of the tip portions of the lead electrodes are exposed from the bottom surface of the recess;

a plurality of conductors for connecting the lead electrodes and electrodes of the semiconductor element;

a mold member for sealing the semiconductor element in the recess,

wherein the main surfaces of the tip portions exposed from the bottom surface of the recess are separated from each other by the package support part extending from the side of the recess and the conductors are connected to these separated and exposed portions respectively.

8. A method for manufacturing a semiconductor device having a semiconductor element, a package having a recess for housing the semiconductor element, lead electrodes and a package support part supporting the lead electrodes so that main surfaces of the tip portions of the lead electrodes are exposed from the bottom surface of the recess

wherein the manufacturing method is characterized by including:

a first step of forming a lead frame having protrusions opposed to each other and separated from each other in one direction and of forming a pair of lead electrodes protruding in a direction differing from the direction by carrying out a punching out process on a metal plate;

a second step of carrying out a pressing process on the main surface side of the lead electrodes so that the tip portions thereof are placed below the lead frame;

a third step of integrally forming a package by placing the metal plate between an upper die and a lower die, which can be engaged with the upper die, and by injecting a thermoplastic material, wherein the upper die has a protruding portion at the center and has protrusions provided so as to oppose each other on the upper edge of the sides and has a pair of protrusions on the lower portions of the other pair of sides;

a fourth step of placing, and electrically connecting, the semiconductor element within a recess of the package gained in the third step; and

a fifth step of sealing the recess with a mold material by allowing the mold material to pass from the upper surface of the lead frame into the recess at a temperature of the melt point, or above, of the thermoplastic material and, then, of hardening the thermoplastic material.

9. The method according to claim 8;

wherein in the fifth step, the package is held by the sides by means of a hangar lead in the direction of the sides of the lead electrodes.