Power semiconductor device
First Claim
1. A power semiconductor device, comprising:
- a plurality of semiconductor device modules each comprising, a resin case (11), a power semiconductor element (1) accommodated in said resin case, a main circuit terminal (M1, M2) protruding outward from said resin case (11) and in which a main current of said power semiconductor element (1) flows, and a control terminal (7, 8) protruding outward from said resin case (11) and to which a control signal for controlling said power semiconductor element (1) is inputted;
a bus bar electrically connecting in common said main circuit terminals of said plurality of semiconductor device modules, said main circuit terminals being arranged in line; and
a control board (10-50) disposed to at least cover a disposed area of said protruding control terminals (7, 8) of said plurality of semiconductor device modules and electrically connected to said control terminals (7, 8).
1 Assignment
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Accused Products
Abstract
The present invention relates to power semiconductor devices, and particularly to a power semiconductor device having a plurality of semiconductor device modules; an object of the invention is to provide semiconductor device modules which are capable of solving problems caused by the presence of the control board, and facilitating electric connection between power semiconductor elements and main circuit terminals and lightening restrictions on the number and layout of the power semiconductor elements.
To achieve the object above, a control emitter relay terminal (7), a gate relay terminal (8), and a relay terminal (9) are connected to a control board (10) disposed above an edge portion of the semiconductor device module (100). The control board (10) has control circuitry and elements for controlling operations of an IGBT device (1) and a diode device (2), and also has a control emitter interconnection pattern to which the control emitter relay terminal (7) is connected and a gate interconnection pattern to which the gate relay terminal (8) is connected, where these interconnection patterns are connected to the control circuitry.
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Citations
7 Claims
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1. A power semiconductor device, comprising:
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a plurality of semiconductor device modules each comprising, a resin case (11), a power semiconductor element (1) accommodated in said resin case, a main circuit terminal (M1, M2) protruding outward from said resin case (11) and in which a main current of said power semiconductor element (1) flows, and a control terminal (7, 8) protruding outward from said resin case (11) and to which a control signal for controlling said power semiconductor element (1) is inputted;
a bus bar electrically connecting in common said main circuit terminals of said plurality of semiconductor device modules, said main circuit terminals being arranged in line; and
a control board (10-50) disposed to at least cover a disposed area of said protruding control terminals (7, 8) of said plurality of semiconductor device modules and electrically connected to said control terminals (7, 8). - View Dependent Claims (2, 3, 4, 5, 6)
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7. A power semiconductor device, comprising:
a plurality of semiconductor device modules each comprising, a resin case (11), a power semiconductor element (1) accommodated in said resin case, and a control terminal (7, 8) protruding outward from an edge portion of said resin case (11) and to which a control signal for controlling said power semiconductor element (1) is inputted; and
a control board (10-30) electrically connected to said control terminals (7, 8);
said plurality of semiconductor device modules being arranged in rows so that their respective said edge portions from which said control terminals (7, 8) protrude lie next to each other, said control board (10-30) being disposed to extend over said edge portions across from one said row to another of said plurality of semiconductor device modules.
Specification