WDM add/drop multiplexer module

• US 20030169566A1
• Filed: 12/18/2002
• Published: 09/11/2003
• Est. Priority Date: 12/21/2001
• Status: Active Grant

• Current Assignee: Sorrento Networks I. Inc
• Original Assignee: Redfern Broadband Networks, Inc. (Comtek Network Systems (UK) Ltd.)
• Inventors: Brown, Brian Robert, Owens, Mark J., Seiler, Chia, Halgren, Ross, Bonwick, Mark Henry, Scott, Quentin, Goh, Robert
• Granted Patent: US 6,822,860 B2
• Time in Patent Office: Days
• US Class Current: 361/688
• CPC Class Codes: G02B 6/293 with wavelength selective means
• CPC Class Codes: G02B 6/29383 Adding and dropping
• CPC Class Codes: G02B 6/29398 Temperature insensitivity
• CPC Class Codes: G02B 6/4452 Distribution frames
• CPC Class Codes: G02B 6/44526 Panels or rackmounts covering a whole width of the frame or rack
• CPC Class Codes: H04J 14/02 Wavelength-division multiplex systems
• CPC Class Codes: H04J 14/0201 Add-and-drop multiplexing

Abstract

A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for facilitating maintaining a controlled temperature environment inside of the component.

Claims

1. A casing member for a WDM add/drop multiplexer unit, the casing member comprising:

a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and

at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for facilitating maintaining a controlled temperature environment inside of the component.

2. A casing member as claimed in claim 1, wherein the heat sink opening is formed in the backwall incorporating the backplane.

3. A casing member as claimed in claim 2, wherein a pair of heat sink openings is formed in a mirrored configuration on either side of the backplane with respect to a centreplane halfway along the width of the casing member.

4. A casing member as claimed in claim 3, wherein the casing member further comprises a first key member arranged, in use, to prevent a component of the WDM add/drop multiplexer unit from contacting the backplane, when said component is inserted with an incorrect orientation, and wherein the first key member is adapted to cooperate with a heat sink structure of said component.

5. A casing member as claimed in claims 3 or 4, wherein the casing member further comprises a second key member arranged, in use, to prevent a component of the WDM add/drop multiplexer unit from contacting the backplane, when said component is inserted with a correct orientation in another component'"'"'s intended slot, and wherein the second key member is adapted to co-operate with a third key member formed on said component.

6. A casing member as claimed in claims 1 or 2, wherein the casing member further comprises at least one vent opening in one wall of the casing member.

7. A casing member as claimed in claim 6, wherein the casing member comprises at least one pair of vent openings, the openings of the pair being formed in opposite walls of the casing member.

8. A casing member as claimed in claim 7, wherein the at least one pair of vent openings is formed in the sidewalls of the housing.

9. A casing member as claimed in claim 7, wherein at least one pair of vent openings is formed in the top and bottom walls of the housing element.

10. A casing member as claimed in claim 1, wherein the housing element is adapted for mounting onto a rack structure.

11. A casing member as claimed in claim 1, wherein the housing element is adapted to be mounted horizontally or vertically.

12. A casing member as claimed in claim 1, wherein the casing member further comprises a heat sink unit mounted onto the casing member and adapted, in use, when components of the WDM add/drop multiplexer unit are inserted in the casing member, to make thermal contact with at least one of the components, for facilitating maintaining a controlled temperature environment inside of said component.

13. A casing member as claimed in claim 12, wherein the casing member comprises a locking member arranged, in use, to co-operate with a corresponding locking member of one of the components when the component is inserted to maintain the thermal contact.

14. A casing member as claimed in claim 13, wherein the locking member is arranged, in use, to co-operate with the corresponding locking member to bias the component when inserted.

15. A casing member as claimed in claim 12, wherein the heat sink unit is arranged in a manner such that, in use, the interconnection to said component is releasable.

16. A casing member as claimed in claim 12, wherein the heat sink unit is incorporated in the backwall incorporating the backplane.

17. A casing member as claimed in claim 16, wherein the heat sink unit is formed on the backplane.

18. A casing member as claimed in claim 12, wherein the heat sink unit comprises a plurality of substantially planar fins disposed substantially parallel to the backwall of the casing member, and mounted by way of at least one longitudinal mounting member expanding substantially perpendicularly from the backwall. Accordingly, convection airflow between the fins is preferably not inhibited in either a horizontal or a vertical mounting position of the casing member.

19. A casing member as claimed in claim 1, wherein the casing element further comprises at least one fan device mounted on the outside of the housing element and disposed in a manner such that, in use when the heat sink structure of the component of the WDM add/drop multiplexer unit extends through the heat sink opening of the housing element, the heat sink structure is subjected to an airflow generated by the fan device.

20. A casing member as claimed in claim 1, wherein the casing member further comprises at least one baffle structure externally mounted or formed on the casing member, and arranged in a manner such that in use when the casing member is mounted vertically into the rack structure, convection airflow from one heat sink structure or heat sink unit is diverted away from other heat sink structures or heat sink units.

21. An optical network node incorporating a casing member for a WDM add/drop multiplexer unit as claimed in claims 1 or 2.

22. An optical network incorporating an optical network node as claimed in claim 21.