Modular heat sinks

• US 20030169983A1
• Filed: 02/11/2003
• Published: 09/11/2003
• Est. Priority Date: 03/05/2002
• Status: Active Grant

• Current Assignee: Lumentum Operations, LLC (Lumentum Holdings Inc.)
• Original Assignee: Viavi Solutions, Inc. (Lumentum Holdings Inc.)
• Inventors: Freitag, Ladd W., Hanley, Michael Francis, Gaio, David Peter, Branch, Scott Michael, Distad, Eugene E.
• Granted Patent: US 6,916,122 B2
• Time in Patent Office: Days
• US Class Current: 385/92
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4256 Details of housings
• CPC Class Codes: G02B 6/4261 Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/4277 Protection against electromagnetic interference [EMI], e.g. shielding means shielding of electric apparatus H05K9/00, of instruments G12B17/00
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 13/6582 with resilient means for engaging mating connector
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing

Abstract

The invention relates. to modular heat-dissipating housing covers for opto-electronic modules, e.g. transceivers. The housing covers according to the present invention are constructed out of various different parts, which provide different levels of heat dissipation depending on the desired implementation, while maintaining a seal against EMI leakage. Extra heat sinking portions are provided to dissipate heat generated from specific heat generating sources. The extra heat sinking portions are configured into a shape and/or out of a material that provides more thermal dissipation than the standard cover provided. Independent control over the different heat sinking portions enables a better fit and appropriate dissipation

Claims

1. An opto-electronic device of the type for transmitting signals between an optical waveguide and a host computer comprising:

an optical sub-assembly for converting optical signals into electrical signals or electrical signals into optical signals;

a thermally conductive housing for supporting the optical sub-assembly;

an optical connector on one end of said housing for receiving the optical waveguide, and for

aligning the optical waveguide with the optical sub-assembly;

a printed circuit board mounted in said housing including circuitry for controlling the optical

sub-assembly, the printed circuit board including a first heat source; and

an electrical connector extending from another end of said housing for transmitting electrical signals between the printed circuit board and the host computer;

wherein the housing includes;

a lower portion for supporting the optical sub-assembly and the printed circuit board;

a heat dissipating cover fixed on top of the lower portion for dissipating heat from inside the housing; and

a first heat sink mounted on the heat dissipating cover above the first heat source for dissipating heat therefrom;

wherein the heat dissipating cover and/or the first heat sink enclose and seal the housing to prevent leakage of electro-magnetic interference (EMI) from the housing.

3. The device according to claim 1, wherein the first heat sink and the heat dissipating cover include interlocking mating surfaces for fitting the first heat sink on the heat dissipating cover.

4. The device according to claim 1, wherein the heat dissipating cover includes an opening therethrough adjacent the heat source;

and wherein at least a portion of the first heat sink extends through the opening into proximity with the first heat source.

5. The device according to claim 4, wherein the first opening is surrounded by a bond line for attaching the first heat sink to the heat dissipating cover, while providing EMI protection.

6. The device according to claim 1, wherein the first heat sink includes heat dissipating projections extending therefrom.

7. The device according to claim 6, wherein the heat dissipating cover includes heat dissipating projections extending therefrom.

8. The device according to claim 4, further comprising at least one additional opening in the heat dissipating cover, each opening for receiving at least a portion of an additional heat sink dissipating heat from an additional heat source.

9. The device according to claim 8, wherein bond lines surround each opening for attaching the heat sinks to the heat dissipating cover, while providing EMI protection;

and wherein the first heat sink and the additional heat sinks substantially cover the heat dissipating cover.

10. The device according to claim 4, wherein substantially all of the first heat sink extends through the first opening for contacting the first heat source.

11. The device according to claim 10, wherein the entire peripheral edge of the first heat sink is thermally connected to the heat dissipating cover by one or more of the group consisting of an adhesive, a thermally conductive gel, and a friction fit.

12. The device according to claim 1, wherein the first heat sink covers substantially all of the heat dissipating cover.

13. The device according to claim 12, wherein the heat dissipating cover provides a first surface area for heat dissipation;

and wherein the first heat sink includes projections on an upper surface thereof providing a second surface area for heat dissipation, which is greater than the first surface area.

14. The device according to claim 13, wherein the heat dissipating cover includes projections;

and wherein the first heat sink includes recesses on a lower surface thereof for receiving the projections of the heat dissipating cover.

15. The device according to claim 11, wherein the first heat sink is mounted over a cage system supporting the opto-electronic device on a circuit board of the host computer.

16. The device according to claim 15, further comprising a clip for biasing the first heat sink into contact with the heat dissipating cover;

wherein the clip is mounted on the cage system or on the circuit board of the host computer.

17. The device according to claim 1, wherein the first heat sink includes a first fin resiliently biased away from the heat dissipating cover;

wherein the first fin is retracted toward the heat dissipating cover into a retracted position during insertion of the device into the host computer, and extendable outwardly from the heat dissipating cover into an extended position, when the device is fully installed in the host computer.

18. The device according to claim 17, further comprising an actuator for holding the first fin in the retracted position, and for releasing the first fin into the extended position.

19. The device according to claim 18, further comprising a latching system for holding the device in a rail or cage system moveable between a first position engaged with the rail or cage system and a second position disengaged from the rail or cage system;

wherein the latching system is interconnected with the actuator for releasing the first fin when the latching system is in the first position

2. The device according to clam 1, wherein the heat dissipating cover is made of a first material, and the first heat sink is made of a second material, which is more thermally conductive than the first material.