Plasma processing apparatus

• US 20030173030A1
• Filed: 01/10/2003
• Published: 09/18/2003
• Est. Priority Date: 07/11/2000
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited, Yasuyoshi Yasaka
• Original Assignee: Tokyo Electron Limited, Yasuyoshi Yasaka
• Inventors: Ishii, Nobuo, Shinohara, Kibatsu, Yasaka, Yasuyoshi
• Granted Patent: US 7,395,779 B2
• Time in Patent Office: Days
• US Class Current: 156/345.48
• CPC Class Codes: B01J 19/088 giving rise to electric discharges for heating purposes H05B7/00; for the production of ozone C01B13/11, H01T19/00
• CPC Class Codes: B01J 2219/0894 Processes carried out in the presence of a plasma
• CPC Class Codes: C23C 16/24 Deposition of silicon only
• CPC Class Codes: C23C 16/511 using microwave discharges
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence

Abstract

A first conductive plate (31A) constituting the radiation surface of a slot antenna (30A) inclines with respect to a first dielectric member (13) opposed to the radiation surface of the slot antenna (30A). Consequently, a plasma generated by the electric field of an electromagnetic field entering directly from the slot antenna (30A) can be set dominant over a plasma generated by the electric field of a standing wave formed in a processing vessel (11). Since the former can be controlled more easily than the latter, the plasma distribution can be improved.

Claims

1. A plasma processing apparatus comprising a processing vessel in which a susceptor for placing a target object thereon is arranged, a slot antenna opposed to said susceptor to supply an electromagnetic field into said processing vessel, and a first dielectric member opposed to a radiation surface of said slot antenna, characterized in that

said slot antenna comprises

a first conductive plate constituting the radiation surface, and

a second conductive plate arranged on a side opposite to said susceptor when seen from said first conductive plate, and

at least one of said first and second conductive plates inclines relative to said first dielectric member.

2. A plasma processing apparatus according to claim 1, characterized in that said slot antenna is a radial antenna.

3. A plasma processing apparatus according to claim 1, characterized in that said slot antenna is a cavity antenna.

4. A plasma processing apparatus according to claim 1, characterized in that said first and second conductive plates of said slot antenna, and said first dielectric member are symmetrical with respect to a common central axis.

5. A plasma processing apparatus according to claim 1, characterized in that at least one of said first and second conductive plates of said slot antenna and said first dielectric member has an upward convex shape.

6. A plasma processing apparatus according to claim 1, characterized in that at least one of said first and second conductive plates of said slot antenna and said first dielectric member has a downward convex shape.

7. A plasma processing apparatus according to claim 1, characterized in that a gap between said first and second conductive plates is not less than 5 mm and less than λ

g/2 where λ

g (λ

g>

10 mm) is the wavelength of an electromagnetic field between said first and second conductive plates.

8. A plasma processing apparatus according to claim 1, characterized in that said first dielectric member has a flat plate-like shape.

9. A plasma processing apparatus according to claim 1, characterized in that said first dielectric member has a dome-like shape.

10. A plasma processing apparatus according to claim 1, characterized in that said first dielectric member is a bell jar which isolates at least part of an inner surface of said processing vessel from said susceptor.

11. A plasma processing apparatus according to claim 10, characterized by further comprising

a second dielectric member arranged on a side different from said susceptor with respect to said first dielectric member and serving to form a sealed space together with said first dielectric member, and

supply means for supplying a fluid in said sealed space so as to adjust a temperature of said first dielectric member.