Interconnect bus crossover for MEMS
First Claim
1. A shielded interconnect bus crossover comprising:
- a substrate;
first, second, and third layers of electrically conductive material overlying and supported by at least a portion of said substrate;
an interconnect bus patterned from said first and second layers of electrically conductive material, said interconnect bus including a plurality of interconnect bus lines, a plurality of interconnect bus shield walls, and an interconnect bus shield supported in a spaced relation above said interconnect bus lines by said interconnect bus shield walls;
a plurality of base pads patterned from said first layer of electrically conductive material, said base pads being located at locations within the footprint of said interconnect bus along an imaginary line extending transverse to an orientation of said interconnect bus lines, at least one of said base pads being in contact with at least one of said interconnect bus lines;
a plurality of support columns patterned from said second layer of electrically conductive material, said support columns overlying said base pads and extending vertically upward through holes formed in said interconnect bus shield; and
at least one elevated crossing line patterned from said third layer of electrically conductive material, said elevated crossing line being supported in a spaced relation above said interconnect bus shield by said support columns.
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Accused Products
Abstract
A shielded interconnect bus crossover useful in interconnecting MEM devices with control signal sources or the like and a method of fabricating such a shielded interconnect bus crossover are disclosed. In one embodiment, a shielded interconnect bus crossover (10) includes a plurality of base pads (44A-C) and a plurality of support columns (74) extending upward from the base pads (44A-C) through holes formed in an interconnect bus shield (78) overlying a plurality of interconnect bus lines (42). The support columns (74) support a two layer elevated crossing line (92/112) in a spaced relation above the interconnect bus shield (78). The two layer elevated crossing line (92/112) is oriented transverse to the direction of the interconnect bus lines (42) and is located within the perimeter of a two layer rectangular crossing line shield wall (96/116).
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Citations
25 Claims
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1. A shielded interconnect bus crossover comprising:
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a substrate;
first, second, and third layers of electrically conductive material overlying and supported by at least a portion of said substrate;
an interconnect bus patterned from said first and second layers of electrically conductive material, said interconnect bus including a plurality of interconnect bus lines, a plurality of interconnect bus shield walls, and an interconnect bus shield supported in a spaced relation above said interconnect bus lines by said interconnect bus shield walls;
a plurality of base pads patterned from said first layer of electrically conductive material, said base pads being located at locations within the footprint of said interconnect bus along an imaginary line extending transverse to an orientation of said interconnect bus lines, at least one of said base pads being in contact with at least one of said interconnect bus lines;
a plurality of support columns patterned from said second layer of electrically conductive material, said support columns overlying said base pads and extending vertically upward through holes formed in said interconnect bus shield; and
at least one elevated crossing line patterned from said third layer of electrically conductive material, said elevated crossing line being supported in a spaced relation above said interconnect bus shield by said support columns. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for making a shielded interconnect bus crossover that crosses at least one interconnect bus line of an interconnect bus over other interconnect lines of the interconnect bus, said method comprising the steps of:
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depositing a first layer of electrically conductive material above at least a portion of a substrate;
forming a plurality of base pads from the first layer of electrically conductive material, wherein the base pads are formed at various locations within the footprint of the interconnect bus along an imaginary line extending transverse to an orientation of the interconnect bus lines with at least one of the base pads contacting at least one of the interconnect bus lines;
depositing a second layer of electrically conductive material above the first layer of electrically conductive material;
forming a plurality of support columns from the second layer of electrically conductive material, wherein the support columns are formed to overlie the base pads and extend vertically upward therefrom through holes formed in the interconnect bus shield;
depositing a third layer of electrically conductive material above the second layer of electrically conductive material; and
forming at least one elevated crossing line from the third layer of electrically conductive material, wherein the elevated crossing line is formed to be supported in a spaced relation above the interconnect bus shield by the support columns. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification