High breakdown voltage low on-resistance lateral DMOS transistor
First Claim
1. A metal oxide semiconductor (MOS) transistor comprising:
- a substrate of a first conductivity type;
a drift region of a second conductivity type over the substrate;
a body region of the first conductivity type in the drift region;
a source region of the second conductivity in the body region;
a gate extending over a surface portion of the body region, the surface portion of the body region extending between the source region and the drift region to form a channel region of the transistor;
a drain region of the second conductivity type in the drift region, the drain region being laterally spaced from the body region;
a first buried layer of the second conductivity type between the substrate and drift region, the first buried layer laterally extending from under the body region to under the drain region; and
a second buried layer of the first conductivity type between the first buried layer and the drift region, the second buried layer laterally extending from under the body region to under the drain region.
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Accused Products
Abstract
In accordance with the present invention, a metal oxide semiconductor (MOS) transistor has a substrate of a first conductivity type. A drift region of a second conductivity type extends over the substrate. A body region of the first conductivity type is in the drift region. A source region of the second conductivity is in the body region. A gate extends over a surface portion of the body region. The surface portion of the body region extends between the source region and the drift region to form a channel region of the transistor. A drain region of the second conductivity type is in the drift region. The drain region is laterally spaced from the body region. A first buried layer of the second conductivity type is between the substrate and drift region. The first buried layer laterally extends from under the body region to under the drain region. A second buried layer of the first conductivity type is between the first buried layer and the drift region. The second buried layer laterally extends from under the body region to under the drain region.
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Citations
21 Claims
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1. A metal oxide semiconductor (MOS) transistor comprising:
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a substrate of a first conductivity type;
a drift region of a second conductivity type over the substrate;
a body region of the first conductivity type in the drift region;
a source region of the second conductivity in the body region;
a gate extending over a surface portion of the body region, the surface portion of the body region extending between the source region and the drift region to form a channel region of the transistor;
a drain region of the second conductivity type in the drift region, the drain region being laterally spaced from the body region;
a first buried layer of the second conductivity type between the substrate and drift region, the first buried layer laterally extending from under the body region to under the drain region; and
a second buried layer of the first conductivity type between the first buried layer and the drift region, the second buried layer laterally extending from under the body region to under the drain region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of forming a metal oxide semiconductor (MOS) transistor, comprising:
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providing a substrate of a first conductivity type;
forming a first buried layer of a second conductivity type in the substrate;
forming a second buried layer of the first conductivity type in the first buried layer;
forming an epitaxial layer of the second conductivity type over the substrate;
forming a drift region of a second conductivity type in the epitaxial layer;
forming a gate layer over the drift region;
forming a body region of the first conductivity type in the drift region such that the gate overlaps a surface portion of the body region;
forming a source region of the second conductivity in the body region; and
forming a drain region of the second conductivity type in the drift region, the drain region being laterally spaced from the body region;
wherein the first and second buried layers laterally extend from under the body region to under the drain region, and the surface portion of the body region extends between the source region and the drift region to form a channel region of the transistor. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification