Wiring board and method of fabricating tape-like wiring substrate

• US 20030174483A1
• Filed: 02/19/2003
• Published: 09/18/2003
• Est. Priority Date: 02/27/2002
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Yuzawa, Hideki
• Granted Patent: US 7,081,590 B2
• Time in Patent Office: Days
• US Class Current: 361/777
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 13/06 Wiring by machine
• CPC Class Codes: H05K 2201/09263 Meander
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/0008 for aligning or positioning of tools relative to the circuit board H05K3/4638, H05K3/4679 take precedence; for manufacturing assemblages of components H05K13/0015
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/242 characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated

Abstract

A substrate supporting a plurality of interconnecting patterns arranged in matrix is cut at a position at least between adjacent columns of the interconnecting patterns. A plurality of positioning marks are formed on the substrate and arranged on a straight line between adjacent columns of the interconnecting patterns. Cutting of the substrate is performed by using the positioning marks as reference.

Claims

1. A wiring board comprising:

a substrate;

a plurality of interconnecting patterns arranged in matrix on the substrate; and

a plurality of positioning marks formed on the substrate and arranged on a straight line between adjacent columns of the interconnecting patterns.

2. The wiring board as defined in claim 1,

wherein the positioning marks are formed of the same material and by the same method as the interconnecting patterns.

3. The wiring board as defined in claim 1,

wherein the positioning marks have references for defining the straight line.

4. The wiring board as defined in claim 1,

wherein the positioning marks have references for defining a range in a widthwise direction intersecting the straight line.

5. The wiring board as defined in claim 1,

wherein each of the positioning marks has a V-shape which is symmetrical with respect to the straight line.

6. The wiring board as defined in claim 1, further comprising a plating lead electrically connected to the interconnecting patterns, wherein:

the plating lead includes sections intersecting the straight line; and

part of the sections of the plating lead intersecting the straight line form the positioning marks.

7. A method of fabricating a tape-like wiring substrate, comprising cutting a substrate which supports a plurality of interconnecting patterns arranged in matrix, at least in a region between adjacent columns of the interconnecting patterns, wherein:

the substrate has a plurality of positioning marks arranged on a straight line between adjacent columns of the interconnecting patterns; and

the substrate is cut by using the positioning marks as references.

8. The method of fabricating a tape-like wiring substrate as defined in claim 7,

wherein the positioning marks are formed from the same material and by the same method as the interconnecting patterns.

9. The method of fabricating a tape-like wiring substrate as defined in claim 7, wherein:

the positioning marks have references for defining the straight line; and

the substrate is cut along the straight line in the cutting step.

10. The method of fabricating a tape-like wiring substrate as defined in claim 7, wherein:

the positioning marks have references for defining a range in a widthwise direction intersecting the straight line; and

the cutting of the substrate is done within the range in the widthwise direction.

11. The method of fabricating a tape-like wiring substrate as defined in claim 7, wherein:

each of the positioning marks has a V-shape which is symmetrical with respect to the straight line; and

the cutting of the substrate is done within the V-shape.

12. The method of fabricating a tape-like wiring substrate as defined in claim 7, wherein:

a plating lead electrically connected to the interconnecting patterns is formed on the substrate;

the plating lead includes sections intersecting the straight line; and

part of the sections of the plating leads intersecting the straight line form the positioning marks.

13. The method of fabricating a tape-like wiring substrate as defined in claim 7, wherein:

the substrate is put on a pair of reels; and

the cutting of the substrate is done while the substrate is being spooled from one reel to the other reel.