Miniaturized high-density multichannel electrode array for long-term neuronal recordings

• US 20030176905A1
• Filed: 03/14/2002
• Published: 09/18/2003
• Est. Priority Date: 03/14/2002
• Status: Active Grant

• Current Assignee: Duke University
• Original Assignee: Duke University
• Inventors: Lehew, Gary C., Nicolelis, Miguel A.L., Krupa, David J.
• Granted Patent: US 6,993,392 B2
• Time in Patent Office: Days
• US Class Current: 607/116
• CPC Class Codes: A61N 1/0529 Electrodes for brain stimulation
• CPC Class Codes: A61N 1/3605 Implantable neurostimulators for stimulating central or peripheral nerve system
• CPC Class Codes: A61N 1/36082 Cognitive or psychiatric applications, e.g. dementia or Alzheimer's disease

Abstract

A high-density multichannel microwire electrode array is disclosed. The array can comprise a variable number of electrodes. A method of assembling the array is further disclosed. Additionally, a plurality of devices employing the array are disclosed, including an intelligent brain pacemaker and a closed loop brain machine interface.

Claims

1. A multichannel microwire electrode array for acquiring neural signals from a plurality of single neurons comprising:

(a) a plurality of microwire electrodes;

(b) one or more printed circuit boards in electrical connection with the microwire electrodes, the one or more printed circuit boards comprising;

(i) a plurality of conductive traces spaced apart about 0.015 inches (center to center) or less; and

(ii) a plurality of conductive pads in electrical connection with the conductive traces; and

(c) one or more connectors in electrical connection with the conductive pads and having contacts spaced apart about 0.030 inches or less.

2. The multichannel microwire electrode array of claim 1, wherein the microwire electrodes comprise a material selected from the group consisting of stainless steel, tungsten, noble metals, conductive alloys and conductive polymers.

3. The multichannel microwire electrode array of claim 1, wherein the microwire electrodes are substantially coated with a material selected from the group consisting of TEFLON®

, S-Isonel, polymers, plastics and non-conductive materials.

4. The multichannel microwire electrode array of claim 1, wherein the one or more printed circuit boards are flexible and about 0.01 inch thick.

5. The multichannel microwire electrode array of claim 1, wherein the one or more printed circuit boards is substantially rigid and about 0.08 inches thick.

6. The multichannel microwire electrode array of claim 1, wherein the one or more printed circuit boards comprise a plurality of the circuit boards secured together in a superimposed stacked relationship.

7. The multichannel microwire electrode array of claim 1, wherein the one or more printed circuit boards each comprise one or more removable support tabs.

8. The multichannel microwire electrode array of claim 1, wherein the one or more printed circuit boards each comprise a plurality of conductive traces spaced apart about 0.012 inches (center to center).

9. The multichannel microwire electrode array of claim 1, wherein the conductive traces are substantially insulated.

10. The multichannel microwire electrode array of claim 1, wherein the one or more connectors are zero insertion force (ZIF) connectors.

11. The multichannel microwire electrode array of claim 1, wherein the one or more connectors are low insertion force (LIF) connectors.

12. The multichannel microwire electrode array of claim 1, wherein the one or more connectors comprise a plurality of connectors soldered to the plurality of conductive pads.

13. A method of assembling a multichannel microwire electrode array for acquiring neural signals from a plurality of single neurons, the method comprising:

(a) associating a plurality of microwire electrodes with a printed circuit board (PCB) comprising a plurality of conductive traces spaced about 0.015 inches (center to center) or less and a plurality of conductive pads in electrical connection with the conductive traces to form a PCB-electrode assembly;

(b) applying a conductive paint to the PCB-electrode assembly to form a coated PCB-electrode assembly; and

(c) associating the coated PCB-electrode assembly with at least one connector via the conductive pads, the connector comprising;

(i) a contact adapted to electrically connect with the conductive pads; and

(ii) a ground contact;

in order to form a multichannel microwire electrode array for acquiring neural signals from a plurality of single neurons.

14. The method of claim 13, wherein the microwire electrodes comprise a material selected from the group consisting of stainless steel, tungsten, noble metals, conductive alloys and conductive polymers.

15. The method of claim 13, wherein the microwire electrodes are substantially coated with a material selected from the group consisting of TEFLON®

, S-Isonel, polymers, plastics and non-conductive materials.

16. The method of claim 13, wherein the associating of step (a) comprises connecting the microwires to the conductive traces with conductive paint, whereby an electrical connection is formed.

17. The method of claim 13, wherein the associating of step (a) comprises bonding the microwires to the conductive traces with a cyanoacrylate compound.

18. The method of claim 13, wherein the printed circuit board comprises conductive traces spaced apart about 0.012 inches (center to center).

19. The method of claim 13, wherein the associating of step (a) comprises bonding the electrodes to the conductive traces with a cyanoacrylate adhesive.

20. The method of claim 13, wherein the conductive paint comprises colloidal silver.

21. The method of claim 13, wherein the connector comprises a zero insertion force (ZIF) connector.

22. The method of claim 13, wherein the connector comprises a low insertion force (LIF) connector.

23. The method of claim 13, further comprising repeating steps (a) and (b) a desired number of times to form a plurality of coated PCB-electrode assemblies and bonding the coated PCB-electrode assemblies together before associating the coated PCB-electrode assemblies with a connector.

24. The method of claim 13, further comprising aligning the microwires with the PCB by employing an alignment jig.

25. The method of claim 13, further comprising potting the multichannel microwire electrode array for acquiring neural signals from large numbers of single neurons with a dental acrylic compound.

26. A multichannel microwire electrode array kit comprising:

(a) a plurality of microwire electrodes;

(b) one or more printed circuit boards comprising;

(i) a plurality of conductive traces spaced apart about 0.015 inches (center to center) or less; and

(ii) a plurality of conductive pads in electrical connection with the conductive traces; and

(c) one or more connectors having contacts spaced apart about 0.030 inches (center to center) or less.

27. The kit of claim 26, wherein the microwire electrodes comprise a material selected from the group consisting of stainless steel, tungsten, noble metals, conductive alloys and conductive polymers.

28. The kit of claim 26, wherein the microwire electrodes are substantially coated with a material selected from the group consisting of TEFLON®

, S-Isonel, polymers, plastics and non-conductive materials.

29. The kit of claim 26, wherein the one or more printed circuit boards are about 0.01 inch thick.

30. The kit of claim 26, wherein the one or more printed circuit boards are about 0.08 inches thick.

31. The kit of claim 26, wherein the one or more printed circuit boards comprise a plurality of circuit boards stacked one on top of the other.

32. The kit of claim 26, wherein the one or more printed circuit boards each comprise one or more removable support tabs.

33. The kit of claim 26, wherein the conductive traces are substantially insulated.

34. The kit of claim 26, wherein the one or more connectors are zero insertion force connectors.

35. The kit of claim 26, wherein the one or more connectors comprise a plurality of connectors soldered to the plurality of conductive pads.

36. The kit of claim 26, further comprising an assembly jig.

37. The kit of claim 26, further comprising a container containing conductive paint.

38. The kit of claim 37, wherein the conductive paint comprises colloidal silver.

39. The kit of claim 26, further comprising a container containing cyanoacrylate adhesive.

40. The kit of claim 26, further comprising a container containing dental acrylic compound.

41. The kit of claim 26, further comprising a set of instructions.

42. A real time closed loop brain-machine interface comprising:

(a) a multichannel microwire electrode array for acquiring neural signals from a plurality of single neurons comprising;

(i) a plurality of microwire electrodes;

(ii) one or more printed circuit boards in electrical connection with the microwire electrodes comprising;

(1) a plurality of conductive traces spaced apart about 0.015 inches (center to center) or less; and

(2) a plurality of conductive pads in electrical connection with the one or more conductive traces; and

(iii) one or more connectors in communication with conductive pads and having contacts spaced apart about 0.030 inches (center to center) or less;

(b) a signal processing mechanism adapted to communicate with the multichannel microwire electrode array and adapted to form extracted motor commands from the extracellular electrical signals; and

(c) an actuator adapted to communicate with the signal processing mechanism and to respond to the extracted motor commands by effecting a movement, and to provide sensory feedback to the subject.

43. The real time closed loop brain-machine interface of claim 42, wherein the microwire electrodes comprise a material selected from the group consisting of stainless steel, tungsten, noble metals, conductive alloys and conductive polymers.

44. The real time closed loop brain-machine interface of claim 42, wherein the microwire electrodes are substantially coated with a material selected from the group consisting of TEFLON®

, S-Isonel, polymers, plastics and non-conductive materials.

45. The real time closed loop brain-machine interface of claim 42, wherein the one or more printed circuit boards are flexible and about 0.01 inch thick.

46. The real time closed loop brain-machine interface of claim 42, wherein the one or more printed circuit boards are substantially rigid and about 0.08 inches thick.

47. The real time closed loop brain-machine interface of claim 42, wherein the one or more printed circuit boards comprise a plurality of the circuit boards secured together in a superimposed stacked relationship.

48. The real time closed loop brain-machine interface of claim 42, wherein the one or more printed circuit boards each comprise one or more removable support tabs.

49. The real time closed loop brain-machine interface of claim 42, wherein the conductive traces are substantially insulated.

50. The real time closed loop brain-machine interface of claim 42, wherein the one or more connectors are zero insertion force (ZIF) connectors.

51. The real time closed loop brain-machine interface of claim 42, wherein the one or more connectors are low insertion force (LIF) connectors.

52. The real time closed loop brain-machine interface of claim 42, wherein the one or more connectors comprise a plurality of connectors soldered to the plurality of conductive pads.

53. A real time closed loop brain-machine interface for restoring voluntary motor control and sensory feedback to a subject that has lost a degree of voluntary motor control and sensory feedback comprising:

(a) a multichannel microwire electrode array for acquiring neural signals from a plurality of single neurons comprising;

(i) a plurality of microwire electrodes;

(ii) one or more printed circuit boards in electrical connection with the microwire electrodes comprising;

(1) a plurality of conductive traces spaced part about 0.015 inches (center to center) or less; and

(2) a plurality of conductive pads in electrical connection with the conductive traces; and

(iii) one or more connectors in electrical connection with the conductive pads and having contacts spaced about 0.030 inches (center to center) or less;

(b) an implantable neurochip adapted to communicate with the multichannel microwire electrode array and to filter and amplify the neural signals;

(c) a motor command extraction microchip adapted to communicate with the implantable neurochip and embodying one or more motor command extraction algorithms, the microchip and the algorithms adapted to extract motor commands from the brain-derived neural signals;

(d) an actuator adapted to communicate with the motor command extraction microchip and to move in response to the motor commands and to acquire sensory feedback information during and subsequent to a movement;

(e) a sensory feedback microchip embodying one or more sensory feedback information interpretation algorithms adapted to communicate with the actuator, the sensory feedback microchip adapted to form interpreted sensory feedback information;

(f) a structure adapted to communicate with the sensory feedback microchip and to deliver interpreted sensory feedback information to the subject; and

(g) one or more power sources adapted to provide power, as necessary, to one or more of the group comprising;

the implantable neurochip;

the motor command extraction microchip;

the actuator;

the sensory feedback microchip; and

the structure adapted to relay interpreted sensory feedback information to the subject.

54. The real time closed loop brain-machine interface of claim 53, wherein the microwire electrodes comprise a material selected from the group consisting of stainless steel, tungsten, noble metals, conductive alloys and conductive polymers.

55. The real time closed loop brain-machine interface of claim 53, wherein the microwire electrodes are substantially coated with a material selected from the group consisting of TEFLON®

, S-Isonel, polymers, plastics and non-conductive materials.

56. The real time closed loop brain-machine interface of claim 53, wherein the one or more printed circuit boards are flexible and about 0.01 inch thick.

57. The real time closed loop brain-machine interface of claim 53, wherein the one or more printed circuit boards are substantially rigid and about 0.08 inches thick.

58. The real time closed loop brain-machine interface of claim 53, wherein the one or more printed circuit boards comprise a plurality of the circuit boards secured together in a superimposed stacked relationship.

59. The real time closed loop brain-machine interface of claim 53, wherein the one or more printed circuit boards each comprise one or more removable support tabs.

60. The real time closed loop brain-machine interface of claim 53, wherein the conductive traces are substantially insulated.

61. The real time closed loop brain-machine interface of claim 53, wherein the one or more connectors are zero insertion force (ZIF) connectors.

62. The real time closed loop brain-machine interface of claim 53, wherein the one or more connectors are low insertion force (LIF) connectors.

63. The real time closed loop brain-machine interface of claim 53, wherein the one or more connectors comprise a plurality of connectors soldered to the plurality of conductive pads.

64. An intelligent brain pacemaker for a mammal having a cranial nerve not associated with an autonomic function comprising:

(a) a multichannel microwire electrode array for acquiring neural signals from a plurality of single neurons comprising;

(i) a plurality of microwire electrodes;

(ii) one or more printed circuit boards in electrical connection with the microwire electrodes comprising;

(1) a plurality of conductive traces spaced apart about 0.015 inches (center to center) or less; and

(2) a plurality of conductive pads in communication with the conductive traces; and

(iii) one or more connectors in electrical connection with the conductive pads and having contacts spaced about apart 0.030 inches (center to center) or less;

(b) a seizure detector adapted to detect seizure-related brain activity of a mammal in real-time, the seizure detector being electrically connected to the multichannel microwire electrode array;

(c) one or more nerve stimulators adapted to provide electrical stimulation to a mammal'"'"'s cranial nerve not associated with an autonomic function, to terminate or ameliorate the seizure, the one or more nerve simulators being electrically connected to the seizure detector; and

(d) a power source for providing power to the intelligent brain pacemaker.

65. The real time closed loop brain-machine interface of claim 64, wherein the microwire electrodes comprise a material selected from the group consisting of stainless steel, tungsten, noble metals, conductive alloys and conductive polymers.

66. The real time closed loop brain-machine interface of claim 64, wherein the microwire electrodes are substantially coated with a material selected from the group consisting of TEFLON®

, S-Isonel, polymers, plastics and non-conductive materials.

67. The real time closed loop brain-machine interface of claim 64, wherein the one or more printed circuit boards are flexible and about 0.01 inch thick.

68. The real time closed loop brain-machine interface of claim 64, wherein the one or more printed circuit boards are substantially rigid and about 0.08 inches thick.

69. The real time closed loop brain-machine interface of claim 64, wherein the one or more printed circuit boards comprise a plurality of the circuit boards secured together in a superimposed stacked relationship.

70. The real time closed loop brain-machine interface of claim 64, wherein the one or more printed circuit boards each comprise one or more removable support tabs.

71. The real time closed loop brain-machine interface of claim 64, wherein the conductive traces are substantially insulated.

72. The real time closed loop brain-machine interface of claim 64, wherein the one or more connectors are zero insertion force (ZIF) connectors.

73. The real time closed loop brain-machine interface of claim 64, wherein the one or more connectors are low insertion force (LIF) connectors.

74. The real time closed loop brain-machine interface of claim 64, wherein the one or more connectors comprise a plurality of connectors soldered to the plurality of conductive pads.