Adhesive-backed articles

• US 20030178124A1
• Filed: 02/03/2003
• Published: 09/25/2003
• Est. Priority Date: 05/13/1999
• Status: Abandoned Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Mazurek, Mieczyslaw H., Fleming, Patrick R., Mikami, Haruyuki
• Application Number:
  US10/357,151
• Publication Number:
  US 20030178124A1
• Time in Patent Office: Days
• US Class Current: 156/87
• CPC Class Codes: B32B 2037/243 Coating
• CPC Class Codes: B32B 2405/00 Adhesive articles, e.g. adhesive tapes labels B32B2519/00
• CPC Class Codes: B32B 2605/08 Cars
• CPC Class Codes: B32B 3/30 characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs apertured layer B32B3/266; layer with cavities or internal voids B32B3/26
• CPC Class Codes: B32B 37/1284 Application of adhesive
• CPC Class Codes: B32B 37/24 with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate B32B37/15 takes precedence
• CPC Class Codes: B32B 38/0012 Mechanical treatment, e.g. roughening, deforming, stretching
• CPC Class Codes: B44C 1/105 comprising an adhesive layer decalcomania B44C1/16; adhesive tapes C09J7/20
• CPC Class Codes: C09J 2301/204 the adhesive coating being discontinuous
• CPC Class Codes: C09J 7/38 Pressure-sensitive adhesives [PSA]
• CPC Class Codes: C09J 7/403 characterised by the structure of the release feature
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1023 Surface deformation only [e.g., embossing]
• CPC Class Codes: Y10T 428/14 Layer or component removable to expose adhesive
• CPC Class Codes: Y10T 428/1471 Protective layer
• CPC Class Codes: Y10T 428/1476 Release layer
• CPC Class Codes: Y10T 428/1486 Ornamental, decorative, pattern, or indicia
• CPC Class Codes: Y10T 428/24479 including variation in thickness
• CPC Class Codes: Y10T 428/24562 Interlaminar spaces
• CPC Class Codes: Y10T 428/24959 of adhesive layers
• CPC Class Codes: Y10T 428/28 : Web or sheet containing structurally defined element or component and having an adhesive outermost layer
• CPC Class Codes: Y10T 428/2843 : including a primer layer
• CPC Class Codes: Y10T 428/2902 : Channel shape

Abstract

Methods of preparing adhesive-backed articles and methods of applying adhesives backed articles are described. The adhesive-backed articles include a compliant film and a pressure-sensitive adhesive having a microstructured surface opposite the compliant film.

Claims

1. A method of preparing an adhesive-backed article, said method comprising:

embossing a release liner to form a microstructured release liner;

coating a pressure-sensitive adhesive layer onto the microstructured release liner, wherein the pressure-sensitive adhesive layer has a microstructured surface facing the microstructured release liner; and

laminating a compliant film to a surface of the pressure-sensitive adhesive layer that is opposite the release liner,

wherein when the release liner is removed to expose the microstructure surface of the pressure-sensitive adhesive layer, said microstructure surface has channels that define exit pathways providing a continuous fluid egress to a periphery of said microstructured surface, said channels having a volume of at least 1×

10³ μ

m³ per any 500 μ

m diameter circular area of the microstructured surface and having an aspect ratio of about 0. 1 to about 20.

2. The method of claim 1, wherein the channels have a cross-sectional form of v-grooves, u-grooves, rectangles, trapezoids, or combinations thereof.

3. The method of claim 1, wherein the microstructured surface comprises a plurality of structures which at least partially define the channels.

4. The method of claim 3, wherein the structures are selected from hemispheres, prisms, pyramids, ellipsoids, or a combination thereof.

5. The method of claim 3, wherein the structures are truncated.

6. The method of claim 3, wherein the structures are regularly placed about the microstructured surface of the pressure-sensitive adhesive.

7. The method of claim 3, wherein the structures are randomly placed about the microstructured surface of said adhesive.

8. The method of claim 3, wherein the structures are arranged at a pitch of about 400 μ

m or less.

9. The method of claim 3, wherein the structures have a height of about 3 μ

m to about 50 μ

m.

10. The method of claim 1, wherein the compliant film comprises a primer layer on a surface laminated to the pressure-sensitive adhesive layer.

11. The method of claim 1, wherein the compliant film has a thickness of about 300 μ

m or less.

12. The method of claim 1, wherein the release liner comprises a thermoplastic film.

13. The method of claim 1, wherein the release liner comprises a paper laminated or coated with a thermoplastic material.

14. The method of claim 1, wherein the release liner comprises a polyethylene coated paper.

15. The method of claim 1, wherein the pressure-sensitive adhesive comprises a solvent based acrylic pressure-sensitive adhesive.

16. A method of preparing an adhesive-backed article comprising:

providing a compliant film;

coating the compliant film with a pressure-sensitive adhesive layer;

embossing the pressure-sensitive adhesive layer to form to microstructured surface having channels that define exit pathways providing a continuous fluid egress to a periphery of said microstructured surface, said channels having a volume of at least 1×

10³ μ

m³ per any 500 μ

m diameter circular area of the microstructured surface and having an aspect ratio of about 0.1 to about 20.

17. A method of applying an adhesive-backed article to a substrate, said method comprising:

providing an adhesive-backed article comprising a pressure-sensitive adhesive layer having a microstructured surface and an opposite surface bonded to a compliant film, said microstructured surface having channels that define exit pathways providing a continuous fluid egress to a periphery of said microstructured surface, said channels having a volume of at least 1×

10³ μ

m³ per any 500 μ

m diameter circular area of the microstructured surface and having an aspect ratio of about 0.1 to about 20;

adhering the microstructured surface of the pressure-sensitive adhesive layer to the surface of a substrate, wherein the pressure-sensitive adhesive has an initial wet out test result of at least 85 percent and the channels are substantially undetectable on an outer surface of the compliant film.

18. The method of claim 17, wherein upon initial contact with the substrate, said pressure-sensitive adhesive layer has an initial surface contact area of about 60 percent or less of the total area of the pressure-sensitive adhesive layer.

19. The method of claim 17, wherein the compliant film after adherence to the substrate has a surface roughness similar to that of the compliant film itself.