Method and system for locally connecting microstructures and devices formed thereby

• US 20030178403A1
• Filed: 01/15/2003
• Published: 09/25/2003
• Est. Priority Date: 01/18/2002
• Status: Active Grant

• Current Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Lemmerhirt, David F., Wise, Kensall D.
• Granted Patent: US 6,893,885 B2
• Time in Patent Office: Days
• US Class Current: 219/209
• CPC Class Codes: B81B 2201/13 Mechanical connectors, i.e. not functioning as an electrical connector
• CPC Class Codes: B81C 3/008 Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002
• CPC Class Codes: H05K 3/3421 Leaded components

Abstract

A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystem platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.

Claims

1. A method for locally connecting a pair of microstructures, the method comprising the steps of:

aligning the microstructures in close proximity to one another;

controllably melting solder over surfaces of the aligned microstructures; and

allowing the melted solder to solidify to mechanically and electrically connect the microstructures together.

2. The method as claimed in claim 1, further comprising determining when the microstructures are aligned in close proximity to one another and providing a corresponding signal wherein the step of controllably melting is performed in response to the signal.

3. The method as claimed in claim 2, wherein one of the microstructures includes a pair of regions having an electrical property and wherein the step of determining includes the step of measuring the electrical property between the pair of regions.

4. The method as claimed in claim 1, wherein one of the microstructures and a heater are formed on a substrate and wherein the step of controllably heating includes the step of causing the heater to heat the solder.

5. The method as claimed in claim 4, wherein the heater and the one of the microstructures are formed in a region thermally isolated from other microstructures formed on the substrate.

6. A method for locally connecting a plurality of microstructures, the method comprising the steps of:

aligning the microstructures to form aligned pairs of microstructures, wherein the microstructures of each aligned pair of microstructures are in close proximity to one another;

controllably melting solder over surfaces of desired aligned pairs of microstructures; and

allowing the melted solder to solidify to mechanically and electrically connect desired pairs of the microstructures together.

7. The method as claimed in claim 6, further comprising determining when the microstructures of each pair are aligned in close proximity to one another and providing a corresponding signal wherein the step of controllably melting is performed in response to the signal.

8. The method as claimed in claim 7, wherein one microstructure of each pair includes a pair of regions having an electrical property and wherein the step of determining includes the step of measuring the electrical property between each pair of regions.

9. The method as claimed in claim 6, wherein one microstructure of each pair and at least one heater are formed on a substrate and wherein the step of controllably heating includes the step of causing the at least one heater to heat the solder.

10. The method as claimed in claim 9, wherein the at least one heater and one microstructure of each pair are formed in a region thermally isolated from other microstructures formed on the substrate.

11. A system for locally connecting a pair of aligned microstructures, the system comprising:

a power supply;

a heater for converting power from the power supply to heat energy; and

a controller for determining when the microstructures are aligned in close proximity to one another and providing a corresponding control signal wherein the power supply supplies power to the heater in response to the control signal to melt solder over surfaces of the aligned microstructures wherein the melted solder mechanically and electrically connects the microstructures together when solidified.

12. The system as claimed in claim 11, further comprising a temperature sensor for sensing temperature and providing a corresponding temperature signal for use in controlling power from the power supply.

13. The system as claimed in claim 11, wherein one of the microstructures includes a pair of regions having an electrical property and wherein the controller measures the electrical property between the pair of regions.

14. The system as claimed in claim 12, wherein one of the microstructures, the heater and the controller are formed on a substrate.

15. The system as claimed in claim 14, wherein the heater and the one of the microstructures are formed in a region thermally isolated from other microstructures formed on the substrate.

16. A system for locally connecting a plurality of microstructures, the system comprising:

a power supply;

at least one heater for converting power from the power supply to heat energy; and

a controller for determining when the microstructures are aligned to form aligned pairs of microstructures in close proximity to one another and providing a corresponding control signal wherein the power supply supplies power to the at least one heater in response to the control signal to melt solder over surfaces of desired aligned pairs of microstructures wherein the melted solder mechanically and electrically connects each desired pair of the microstructures together when solidified.

17. The system as claimed in claim 16, further comprising a temperature sensor for sensing temperature and providing a corresponding temperature signal for use in controlling power from the power supply.

18. The system as claimed in claim 16, wherein one microstructure of each pair includes a pair of regions having an electrical property and wherein the controller measures the electrical property between each pair of regions.

19. The system as claimed in claim 16, wherein one microstructure of each pair, the at least one heater and the controller are formed on a substrate.

20. The system as claimed in claim 19, wherein the at least one heater and one microstructure of each pair are formed in a region thermally isolated from other microstructures formed on the substrate.

21. A device comprising:

a substrate;

a pair of microstructures soldered together so that the pair of microstructures are mechanically and electrically connected together; and

a resistive heating element formed on the substrate, together with one of the microstructures and adapted to receive a signal which, in turn, causes the heating element to melt solder located between surfaces of the microstructures to allow the pair of microstructures to be disconnected.

22. A device comprising:

a substrate;

a plurality of microstructures soldered together so that pairs of microstructures are mechanically and electrically connected together; and

at least one resistive heating element formed on the substrate, together with one of the microstructures of each pair of microstructures, and adapted to receive a signal which, in turn, causes the at least one heating element to melt solder located between surfaces of the microstructures to allow each pair of microstructures to be disconnected.